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PDF HBC114YC6 Data sheet ( Hoja de datos )

Número de pieza HBC114YC6
Descripción Dual NPN Digital Transistors
Fabricantes CYStech Electronics 
Logotipo CYStech Electronics Logotipo



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CYStech Electronics Corp.
Dual NPN Digital Transistors
HBC114YC6
Spec. No. : C355C6
Issued Date : 2012.07.19
Revised Date :
Page No. : 1/6
Features
Built-in bias resistors enable the configuration of an inverter circuit without connecting external input
resistors (see equivalent circuit).
The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the
input. They also have the advantage of almost completely eliminating parasitic effects.
Only the on/off conditions need to be set for operation, making device design easy.
Two DTC114Y chips in a SOT-563 package.
Mounting by SOT-523 automatic mounting machines is possible.
Mounting cost and area can be cut in half.
Complements the HBA114YC6
Pb-free package.
Equivalent Circuit
HBC114YC6
RBE2
RB2
TR1
RB1
RBE1
TR2
RB1=10kΩ , RB2=10 kΩ
RBE1=47kΩ , RBE2=47 kΩ
Outline
C1
SOT-563
B2 E2
E1 B1 C2
HBC114YC6
CYStek Product Specification
http://www.Datasheet4U.com

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HBC114YC6 pdf
CYStech Electronics Corp.
Spec. No. : C355C6
Issued Date : 2012.07.19
Revised Date :
Page No. : 5/6
Recommended wave soldering condition
Product
Peak Temperature
Pb-free devices
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Sn-Pb eutectic Assembly
Pb-free Assembly
Average ramp-up rate
(Tsmax to Tp)
3°C/second max.
3°C/second max.
Preheat
Temperature Min(TS min)
Temperature Max(TS max)
Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
Temperature (TL)
Time (tL)
183°C
60-150 seconds
217°C
60-150 seconds
Peak Temperature(TP)
240 +0/-5 °C
260 +0/-5 °C
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
Time 25 °C to peak temperature
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
HBC114YC6
CYStek Product Specification

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