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PDF NEXC474Z5.5V16X9.5TRF Data sheet ( Hoja de datos )
| Número de pieza | NEXC474Z5.5V16X9.5TRF | |
| Descripción | V-Chip Memory Back-Up Capacitors | |
| Fabricantes | NIC | |
| Logotipo |  |
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V-Chip Memory Back-Up Capacitors
NEXC Series
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS DEVICES
• SURFACE MOUNTABLE V-CHIP STYLE
• LEAD-FREE FINISH
*For high temperature +85°C,
high temperature reflow parts
see the NEXCW series
CHARACTERISTICS
Rated Voltage Range
3.5 & 5.5VDC
Rated Capacitance Range
Operating Temp. Range
Capacitance Tolerance
Load Life Test
+70°C 1,000 hours
0.047F ~ 1.0F (47,000μF ~ 1,000,000μF)
-25°C ~ +70°C
+80%/-20% (Z)
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Less than ±30% of initial measured value
Less than 200% of the specified maximum value
Less than 200% of the specified maximum value
Temperature Cycling
(5 cycles, -25 ~ +70°C
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Within +80%/-20% of specified value
Less than specified maximum value
Less than specified maximum value
Humidity Resistance
(240 hours @ 40°C/90% RH)
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Less than ±20% of initial measured value
Less than 120% of the specified maximum value
Less than 120% of the specified maximum value
STANDARD VALUES AND SPECIFICATIONS
NIC P/N
Capacitance Working
Value (F) Voltage
Discharge (VDC)
NEXC104Z3.5V10.5X5.5TRF
0.1 3.5
NEXC224Z3.5V10.5X5.5TRF
0.22 3.5
NEXC474Z3.5V10.5X8.5TRF
0.47 3.5
NEXC473Z5.5V10.5X5.5TRF
0.047
5.5
NEXC104Z5.5V10.5X5.5TRF
0.1 5.5
NEXC224Z5.5V10.5X8.5TRF
0.22 5,5
NEXC474Z5.5V16X9.5TRF
0.47 5.5
NEXC105Z5.5V21X10.5TRF
1.0 5.5
Holding
Voltage
(VDC min.)
-
-
-
4.2
4.2
4.2
4.2
4.2
Max. Current
@ 30 minutes
(mA)
0.090
0.200
0.420
0.071
0.150
0.330
0.710
1.500
Max. ESR
@ 1KHz
(Ω)
50
25
25
50
25
25
13
7
CASE DIMENSIONS (mm)
Case Size Dφ ± 0.5 L max. A/B ±0.2
I
WP
10.5 x 5.5 10.5 5.5 10.8 3.6 ±0.5 1.2 5.0
10.5 x 8.5 10.5 8.5 10.8 3.6 ±0.5 1.2 5.0
16 x 9.5 16.0 9.5 16.3 6.8 ±1.0 1.2 5.0
21 x 10.5 21.0 10.5 21.6 7.0 ±1.0 1.4 10.0
0.3mm max.
Dφ
+I
w
L
I I-
A
P
B
PRECAUTIONS
WASHING is NOT RECOMMENDED. Additional precautions can be found at
www.niccomp.com/precautions
If in doubt or uncertainty, please review your speci fic application - process details
with NIC’s technical support personnel: [email protected]
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
www.SMTmagnetics.com
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