|
|
PDF ESD8004 Data sheet ( Hoja de datos )
| Número de pieza | ESD8004 | |
| Descripción | ESD Protection Diode | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de ESD8004 (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
|
No Preview Available !
ESD8004
ESD Protection Diode
Low Capacitance Array for High Speed
Data Lines
The ESD8004 is designed to protect high speed data lines from
ESD. Ultra−low capacitance and low ESD clamping voltage make this
device an ideal solution for protecting voltage sensitive high speed
data lines. The flow−through style package allows for easy PCB layout
and matched trace lengths necessary to maintain consistent impedance
between high speed differential lines such as USB 3.0/3.1.
Features
• Low Capacitance (0.35 pF Max, I/O to GND)
• Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
• Low ESD Clamping Voltage
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• USB 3.0/3.1
• eSATA
• DisplayPort
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −55 to +125 °C
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
±15 kV
±15 kV
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
www.onsemi.com
UDFN10
CASE 517BB
MARKING
DIAGRAM
4DMG
G
4D = Specific Device Code (tbd)
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION AND SCHEMATIC
N/C N/C GND N/C N/C
10 9 8 7 6
12 3 4 5
I/O I/O GND I/O I/O
I/O I/O I/O I/O
Pin 1 Pin 2 Pin 4 Pin 5
Pins 3, 8
Note: Common GND − Only Minimum of 1 GND connection required
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 5
ORDERING INFORMATION
Device
Package
Shipping
ESD8004MUTAG
SZESD8004MUTAG
UDFN10
(Pb−Free)
UDFN10
(Pb−Free)
3000 / Tape &
Reel
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1 Publication Order Number:
ESD8004/D
1 page  
ESD8004
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0 0.5 1 1.5 2 2.5 3 3.5
VR, VOLTAGE (V)
Figure 9. Junction Capacitance; VR = 3.5 V −
0 V, f = 1 MHz, I/O − GND, dV/dt = 214 mV/s
Figure 10. Junction Capacitance; VR = 0 V,
f = 500 MHz − 10 GHz
Without ESD8004
With ESD8004
Figure 11. USB 3.0 Eye Diagram with and without ESD8004. 5 Gb/s
Without ESD8004
With ESD8004
Figure 12. USB 3.1 Eye Diagram with and without ESD8004. 10 Gb/s
See application note AND9075/D for further description of eye diagram testing methodology.
www.onsemi.com
5
5 Page 
ESD8004
PACKAGE DIMENSIONS
UDFN10 2.5x1, 0.5P
CASE 517BB
ISSUE O
D AB
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN ONE
REFERENCE
ÍÍÍÍÍÍ2X 0.10 C
E
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
2X 0.10 C TOP VIEW
0.10 C
DETAIL B
A3
10X 0.08 C
A1
A
EXPOSED Cu
MOLD CMPD
ÇÇÇ A3
ÇÉÉÇÉÉÇÉÉA1 DETAIL B
OPTIONAL
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
b2 0.35 0.45
D 2.50 BSC
E 1.00 BSC
e 0.50 BSC
L 0.30 0.40
L1 --- 0.05
SIDE VIEW
C
SEATING
PLANE
CONSTRUCTION
RECOMMENDED
2X b2
DETAIL A
1
10X L
5
SOLDERING FOOTPRINT*
10X
0.50
2X 0.45
10
e
6
BOTTOM VIEW
8X b
0.10 C A B
0.05 C NOTE 3
1.30
PACKAGE
OUTLINE
0.50
PITCH
8X 0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
11
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ESD8004/D
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet ESD8004.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| ESD8004 | ESD Protection Diode | ON Semiconductor |
| ESD8006 | ESD Protection Diode | ON Semiconductor |
| ESD8006MUTAG | ESD Protection Diode | ON Semiconductor |
| ESD8008 | ESD Protection Diodes | ON Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |