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PDF NCV4275 Data sheet ( Hoja de datos )
| Número de pieza | NCV4275 | |
| Descripción | 5.0 V Low-Drop Voltage Regulator | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NCV4275
5.0 V Low−Drop Voltage
Regulator
This industry standard linear regulator has the capability to drive
loads up to 450 mA at 5.0 V. It is available in DPAK and D2PAK.
This device is pin−for−pin compatible with Infineon part number
TLE4275.
Features
• 5.0 V, ±2%, 450 mA Output Voltage
• Very Low Current Consumption
• Active RESET
• Reset Low Down to VQ = 1.0 V
• 500 mV (max) Dropout Voltage
• Fault Protection
♦ +45 V Peak Transient Voltage
♦ −42 V Reverse Voltage
♦ Short Circuit
♦ Thermal Overload
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
I
Bandgap
Reference
Thermal
Shutdown
D
Error
Amplifier
+
−
Current Limit and
Saturation Sense
Reset
Generator
Figure 1. Block Diagram
Q
GND
RO
1
5
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MARKING
DIAGRAMS
DPAK
5−PIN
DT SUFFIX
CASE 175AA
4275
ALYWW
x
1
1
5
D2PAK
5−PIN
DS SUFFIX
CASE 936A
NCV4275
AWLYYWW
Pin 1. I
2. RO
1
Tab, 3. GND*
4. D
5. Q
* Tab is connected to
Pin 3 on all packages
A
WL, L
YY, Y
WW
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping†
NCV4275DT
DPAK
75 Units/Rail
NCV4275DTRK
DPAK 2500 Tape & Reel
NCV4275DS
D2PAK
50 Units/Rail
NCV4275DSR4
D2PAK 800 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
August, 2004 − Rev. 8
1
Publication Order Number:
NCV4275/D
Free Datasheet http://www.datasheetlist.com/
1 page  
NCV4275
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and
the outside environment will have a thermal resistance.
Like series electrical resistances, these resistances are
summed to determine the value of RqJA:
RqJA + RqJC ) RqCS ) RqSA
(3)
VI
where
RqJC
RqCS
RqSA
is the junction−to−case thermal resistance,
is the case−to−heatsink thermal resistance,
is the heatsink−to−ambient thermal
resistance.
RqJC appears in the package section of the data sheet.
Like RqJA, it too is a function of package type. RqCS and
RqSA are functions of the package type, heatsink and the
interface between them. These values appear in heat sink
data sheets of heat sink manufacturers.
Thermal, mounting, and heatsinking considerations are
discussed in the ON Semiconductor application note
AN1040/D.
VQ
VD
Reset
Delay Time
VRO
Reset
Reaction Time
t
< Reset Reaction Time
VQ,rt
t
dVD
dt
+
Reset
Charge
CD
Current
Upper Timing Threshold
Lower Timing Threshold
t
Power−on−Reset
Thermal
Shutdown
Voltage Dip Undervoltage Secondary Overload
at Input
Spike
at Output
Figure 5. Reset Timing
t
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5
Free Datasheet http://www.datasheetlist.com/
5 Page 
NCV4275
PACKAGE DIMENSIONS
D2PAK
5 LEAD
DS SUFFIX
CASE 936A−02
ISSUE B
−T−
A
OPTIONAL
CHAMFER
E
TERMINAL 6
U
K
B
S
1 2345
H
D
0.010 (0.254) M T
G
V
ML
NP
R
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.386 0.403 9.804 10.236
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
E 0.045 0.055 1.143 1.397
G 0.067 BSC
1.702 BSC
H 0.539 0.579 13.691 14.707
K 0.050 REF
1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R 5 _REF
5 _REF
S 0.116 REF
2.946 REF
U 0.200 MIN
5.080 MIN
V 0.250 MIN
6.350 MIN
http://onsemi.com
11
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11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet NCV4275.PDF ] | |
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