|
|
PDF LEMWS68T80KZxxxx Data sheet ( Hoja de datos )
| Número de pieza | LEMWS68T80KZxxxx | |
| Descripción | 6030 2Cup 2Chip | |
| Fabricantes | LG | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de LEMWS68T80KZxxxx (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
|
No Preview Available !
CUSTOMER :
.
DATE
: JAN 09, 2013 .
REV
: REV. 0.0 .
PRODUCT FAMILY DATA SHEET
6030 2Cup 2Chip (3500K)
MODEL NAME : LEMWS68T80KZ◇◇◇◇
RoHS
Compliant
Free Datasheet http://www.datasheet-pdf.com/
1 page  
6. Typical Characteristic Curves
Forward Current vs. Forward Voltage
Ta=25℃
240
220
200
180
160
140
120
100
80
60
40
20
0
2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2
Forward Voltage [V]
Spectrum
Ta=25℃, IF=130mA
Wavelength [nm]
Radiation Characteristics
X-X
0
-30
Ta=25℃, IF=130mA
30
-60 60
Relative Luminous Flux vs. Forward Current
Ta=25℃
200
180
160
140
120
100
80
60
40
20
0
0 20 40 60 80 100 120 140 160 180 200 220 240
Forward Current [mA]
Chromaticity Coordinate vs. Forward Current
0.005
0.004
0.003
Ta=25℃
Cx
Cy
0.002
0.001
0.000
30 60 90 120 150 180 210 240
-0.001
-0.002
-0.003
-0.004
-0.005
Forward Current [mA]
-30
-60
Y-Y
0
Ta=25℃, IF=130mA
30
60
-90 90
100 50 0 50 100
-90 90
100 50 0 50 100
5 / 12
Free Datasheet http://www.datasheet-pdf.com/
5 Page 
9. Cautions on Use
9-8. Soldering Conditions
-. Reflow soldering method is recommended for LEDs assembly.
-. LG Innotek does not guarantee the performance of the LEDs assembled by dip soldering method.
-. Recommended Soldering Profile (according to JEDEC J-STD-020D)
Profile Feature
Preheat/Soak
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Maximum time(ts) from Tsmin to Tsmax
Ramp-up rate (TL to Tp)
Liquidous temperature (TL)
Time (tL) maintained above TL
Maximum peak package body temperature (Tp)
Time(tp) within 5℃ of the specified temperature (Tc)
Ramp-down rate (Tp to TL)
Maximum Time 25℃ to peak temperature
Pb-Free Assembly
150℃
200℃
60~120 seconds
3℃/ second max.
217℃
60~150 seconds
260℃
30 seconds
6℃/second max.
8 minutes max.
Pb-Based Assembly
100℃
150℃
60~120 seconds
3℃/ second max.
183℃
60~150 seconds
235℃
20 seconds
6℃/second max.
6 minutes max.
-. Reflow or hand soldering at the lowest possible temperature is desirable for the LEDs
although the recommended soldering conditions are specified in the above diagrams.
-. A rapid cooling process is not recommended for the LEDs from the peak temperature.
-. The silicone encapsulant at the top of the LED package is a soft surfaces on the tops, which can
easily be damaged by pressure. Precautions should be taken to avoid strong pressure on the
silicone encapsulant when leveraging the pick and place machines. The pick up nozzle should not
directly contact the silicone resin of the LEDs.
-. Reflow soldering should not be done more than two times.
11 / 12
Free Datasheet http://www.datasheet-pdf.com/
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LEMWS68T80KZxxxx.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| LEMWS68T80KZxxxx | 6030 2Cup 2Chip | LG |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |