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Número de pieza | MC74HC4067A | |
Descripción | Quad Analog Switch Multiplexer/Demultiplexer | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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No Preview Available ! MC74HC4067A
Quad Analog Switch/
Multiplexer/Demultiplexer
High−Performance Silicon−Gate CMOS
The MC74HC4067A utilizes silicon−gate CMOS technology to
achieve fast propagation delays, low ON resistances, and low
OFF−channel leakage current. This bilateral switch/
multiplexer/demultiplexer controls analog and digital voltages that
may vary across the full power−supply range (from VCC to GND).
The ON/OFF control inputs are compatible with standard CMOS
outputs; with pullup resistors, they are compatible with LSTTL outputs.
For analog switches with voltage−level translators, see the HC4316A.
Features
• Fast Switching and Propagation Speeds
• High ON/OFF Output Voltage Ratio
• Low Crosstalk Between Switches
• Diode Protection on All Inputs/Outputs
• Wide Power−Supply Voltage Range (VCC − GND) = 2.0 to 6.0 V
• Analog Input Voltage Range (VCC − GND) = 0 to 6.0 V
• Improved Linearity and Lower ON Resistance over Input Voltage
• Low Noise
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These are Pb−Free Devices
www.onsemi.com
MARKING
DIAGRAMS
24
1
24
SOIC−24
DW SUFFIX
CASE 751E
1
HC4067AG
AWLYWW
24
24
1
TSSOP−24
DT SUFFIX
CASE 948H
HC
4067AG
ALYW
1
A
L, WL
Y, YY
W, WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
May, 2015 − Rev. 2
1
Publication Order Number:
MC74HC4067A/D
1 page MC74HC4067A
AC CHARACTERISTICS (INPUT tr, tf = 6 ns)
Symbol
Parameter
tPLH,
tPHL
Propagation Delay Switch In to
Out
Conditions
CL = 50 pF
VCC
(V)
2.0
4.5
6.0
25_C
Min Typ
tON Switch Turn−ON Time
E to Out
CL = 15 pF
5.0
CL = 50 pF
2.0
4.5
6.0
6.0
SN to Out
CL = 15 pF
CL = 50 pF
5.0
2.0
4.5
6.0
23
tOFF Switch Turn−OFF Time
E to Out
CL = 15 pF
5.0
CL = 50 pF
2.0
4.5
6.0
25
SN to Out
CL = 15 pF
CL = 50 pF
5.0
2.0
4.5
6.0
23
CL = 15 pF
5.0
Cin Input Capacitance, Control Pins
CPD Power Dissipation Capacitance
(Note 4)
CL = 15 pF
5.0
4. CPD is used to determine the dynamic power consumption, per multivibrator.
21
3.5
Guaranteed Limits
–40 to 85_C
Max Min Max
75 95
15 19
13 16
275 345
55 69
47 59
300 375
60 75
51 64
275 345
55 69
47 59
290 365
58 73
49 62
10 10
29
–55 to 125_C
Min Max
110
22
19
415
83
71
450
90
76
415
83
71
435
87
74
10
Unit
ns
ns
ns
pF
pF
www.onsemi.com
5
5 Page MC74HC4067A
PACKAGE DIMENSIONS
SOIC−24 WB
CASE 751E−04
ISSUE F
0.25 C
24
E
1
PIN 1
INDICATOR
A
A1
NOTE 5
D
TOP VIEW
e
SIDE VIEW
AH
B
13
E1
12
LC
DETAIL A
24X b
0.25 M
NOTE 3
CAS
BS
h
x 45 _
M
C
SEATING
PLANE
c
NOTE 3
DETAIL A
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b AND c APPLY TO THE FLAT SEC-
TION OF THE LEAD AND ARE MEASURED BE-
TWEEN 0.10 AND 0.25 FROM THE LEAD TIP.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 mm PER SIDE. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
5. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.13 0.29
b 0.35 0.49
c 0.23 0.32
D 15.25 15.54
E 10.30 BSC
E1 7.40 7.60
e 1.27 BSC
h 0.25 0.75
L 0.41 0.90
M 0_ 8_
RECOMMENDED
SOLDERING FOOTPRINT*
24X
0.52
24X
1.62
11.00
1 1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet MC74HC4067A.PDF ] |
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