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PDF UPG2411T6R Data sheet ( Hoja de datos )
| Número de pieza | UPG2411T6R | |
| Descripción | GaAs Integrated Circuit SPDT Switch | |
| Fabricantes | Renesas | |
| Logotipo |  |
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μPG2411T6R
GaAs Integrated Circuit
SPDT Switch for 1 GHz to 8 GHz
Preliminary Data Sheet
R09DS0020EJ0100
Rev.1.00
Apr 25, 2011
DESCRIPTION
The μPG2411T6R is a GaAs MMIC SPDT (Single Pole Double Throw) switch which was designed for 1 GHz to 8
GHz applications, including dual-band wireless LAN.
This device operates with dual control switching voltages of 1.8 to 3.6 V and can operate at frequencies from 1 GHz to
8 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) and is suitable for high-
density surface mounting.
FEATURES
• Switch control voltage
: Vcont (H) = 1.8 to 3.6 V (3.0 V TYP.)
: Vcont (L) = 0 V TYP.
• Low insertion loss
: Lins = 0.5 dB TYP. @ f = 2.5 GHz
: Lins = 0.6 dB TYP. @ f = 6 GHz
• High isolation
: ISL = 25 dB TYP. @ f = 2 to 6 GHz
• Handling power
: Pin (1 dB) = +30.5 dBm TYP. @ Vcont (H) = 3.0 V, f = 2.5 GHz and 6 GHz
: Pin (0.1 dB) = +28 dBm TYP. @ Vcont (H) = 3.0 V, f = 2.5 GHz and 6 GHz
• High-density surface mounting : 6-pin plastic TSSON package (1.0 × 1.0 × 0.37 mm)
APPLICATIONS
• Wireless LAN (IEEE802.11a/b/g/n), etc.
ORDERING INFORMATION
Part Number
Order Number
Package Marking
Supplying Form
μPG2411T6R-E2 μPG2411T6R-E2-A 6-pin
GC • Embossed tape 8 mm wide
plastic TSSON
• Pin 1, 6 face the perforation side of the tape
(Pb-Free)
• Qty 5 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2411T6R
CAUTION
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this
device. This device must be protected at all times from ESD. Static charges may easily produce potentials of
several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard
ESD precautions must be employed at all times.
R09DS0020EJ0100 Rev.1.00
Apr 25, 2011
Page 1 of 12
Free Datasheet http://www.datasheet4u.com/
1 page  
μPG2411T6R
EVALUATION CIRCUIT
C1 1
RF1
2
3
RF2
C1
Remark C1: 8 pF
1 000 pF
6
5 C1
4
1 000 pF
Vcont1
RFC
Vcont2
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
C1
Switch
C1 LESD
C1
• C1 are DC blocking capacitors external to the device.
The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for
best performance.
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
R09DS0020EJ0100 Rev.1.00
Apr 25, 2011
Page 5 of 12
Free Datasheet http://www.datasheet4u.com/
5 Page 
μPG2411T6R
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Condition Symbol
IR260
HS350
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0020EJ0100 Rev.1.00
Apr 25, 2011
Page 11 of 12
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet UPG2411T6R.PDF ] | |
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