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PDF PMEG2002AESF Data sheet ( Hoja de datos )
| Número de pieza | PMEG2002AESF | |
| Descripción | 0.2 A low VF MEGA Schottky barrier rectifier | |
| Fabricantes | NXP Semiconductors | |
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PMEG2002AESF
20 V, 0.2 A low VF MEGA Schottky barrier rectifier
8 October 2013
Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with
an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultra
small Surface-Mounted Device (SMD) package.
2. Features and benefits
• Average forward current IF(AV) ≤ 0.2 A
• Reverse voltage VR ≤ 20 V
• Low forward voltage typ. VF 245 mV
• Low forward current typ. IF 10 µA
• Ultra small and leadless SMD package
• Package height typ. 0.3 mm
3. Applications
• Low voltage rectification
• High efficiency DC-to-DC conversion
• Switch mode power supply
• Low power consumption applications
• Ultra high-speed switching
• LED backlight for mobile application
4. Quick reference data
Table 1.
Symbol
IF(AV)
Quick reference data
Parameter
average forward
current
VR reverse voltage
VF forward voltage
IR reverse current
Conditions
δ = 0.5 ; f = 20 kHz; Tamb = 115 °C;
square wave
δ = 0.5 ; f = 20 kHz; Tsp = 125 °C;
square wave
Tj = 25 °C
IF = 10 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
VR = 10 V; Tj = 25 °C
Min Typ Max Unit
[1] - - 0.2 A
- - 0.2 A
- - 20 V
- 245 310 mV
- 5 - µA
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
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NXP Semiconductors
PMEG2002AESF
20 V, 0.2 A low VF MEGA Schottky barrier rectifier
10. Characteristics
Table 7.
Symbol
VF
IR
Cd
trr
Characteristics
Parameter
forward voltage
reverse current
diode capacitance
reverse recovery time
Conditions
IF = 0.1 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
IF = 1 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
IF = 10 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
IF = 100 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
IF = 200 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
VR = 6 V; Tj = 25 °C
VR = 10 V; Tj = 25 °C
VR = 20 V; Tj = 25 °C
VR = 1 V; f = 1 MHz; Tj = 25 °C
VR = 10 V; f = 1 MHz; Tj = 25 °C
IF = 200 mA; IR = 200 mA;
IR(meas) = 40 mA; Tj = 25 °C
Min Typ Max Unit
- 120 180 mV
- 180 250 mV
- 245 310 mV
- 330 380 mV
- 375 420 mV
-
3.2 20
µA
- 5 - µA
- 10 45 µA
- 25 - pF
- 10 - pF
- 1.9 - ns
10
IF
(A)
1
10-1
(1)
(2)
aaa-006875
10-2
10-3
(3) (4)
10-4
0
0.2 0.4 0.6 0.8 1.0
VF (V)
(1) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = −40 °C
Fig. 4. Forward current as a function of forward
voltage; typical values
10-2
IR
(A)
10-3
aaa-006876
(1)
10-4
(2)
10-5
10-6
(3)
10-7
10-8
10-9
0
5
(1) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = −40 °C
(4)
10
15 20
VR (V)
Fig. 5. Reverse current as a function of reverse
voltage; typical values
PMEG2002AESF
Product data sheet
All information provided in this document is subject to legal disclaimers.
8 October 2013
© NXP N.V. 2013. All rights reserved
5 / 13
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NXP Semiconductors
PMEG2002AESF
20 V, 0.2 A low VF MEGA Schottky barrier rectifier
15. Legal information
15.1 Data sheet status
Document
status [1][2]
Objective
[short] data
sheet
Preliminary
[short] data
sheet
Product
[short] data
sheet
Product
status [3]
Definition
Development This document contains data from
the objective specification for product
development.
Qualification This document contains data from the
preliminary specification.
Production
This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
15.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
PMEG2002AESF
Product data sheet
All information provided in this document is subject to legal disclaimers.
8 October 2013
© NXP N.V. 2013. All rights reserved
11 / 13
Free Datasheet http://www.datasheet4u.com/
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