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PDF ACPM-5011 Data sheet ( Hoja de datos )
| Número de pieza | ACPM-5011 | |
| Descripción | Power Amplifier Module | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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ACPM-5011
UMTS/LTE Band11 + Band21 (1427.9 - 1462.9 MHz)
3 x 3 mm Power Amplifier Module
Data Sheet
Description
The ACPM-5011 is a fully matched 10-pin surface mount
module developed for UMTS and LTE at Band11 and Band
21. This power amplifier module operates in the 1427.9-
1462.9 MHz bandwidth. The ACPM-5011 meets stringent
LTE (MPR = 0 dB) and HSPA+ linearity requirements up to
27.5 dBm output power. The 3 x 3 mm form factor package
is self contained, incorporating 50 ohm input and output
matching networks.
The ACPM-5011 features 5th generation of CoolPAM circuit
technology which supports 3 power modes – bypass, mid
and high power modes. The CoolPAM is stage bypass tech-
nology enhancing PAE (power added efficiency) at low
and medium power range. Active bypass feature is added
to 5th generation to enhance PAE further at low output
range. This helps to extend talk time.
A directional coupler is integrated into the module and
both coupling and isolation ports are available externally,
supporting daisy chain. The integrated coupler has
excellent coupler directivity, which minimizes the coupled
output power variation or delivered power variation
caused by the load mismatch from the antenna. The
coupler directivity, or the output power variation into
the mismatched load, is critical to the TRP and SAR per-
formance of the mobile phones in real field operations as
well as compliance tests for the system specifications.
The ACPM-5011 has integrated on-chip Vref and
on-module bias switch as the one of the key features of
the CoolPAM-5, so an external constant voltage source
is not required, eliminating the external LDO regulators
and switches from circuit boards of mobile devices. It also
makes the PA fully digital-controllable by the Ven pin that
simply turns the PA on and off from the digital control logic
input from baseband chipsets. All of the digital control
input pins such as the Ven, Vmode and Vbp are fully CMOS
compatible and can operate down to the 1.35 V logic. The
current consumption by digital control pins is negligible.
The power amplifier is manufactured on an advanced InGaP
HBT (hetero-junction Bipolar Transistor) MMIC (microwave
monolithic integrated circuit) technology offering state-of-
the-art reliability, temperature stability and ruggedness.
Features
• Thin Package (0.9 mm typ)
• Excellent Linearity
• 3-mode power control with Vbp and Vmode
• Bypass / Mid Power Mode / High Power Mode
• High Efficiency at max output power
• 10-pin surface mounting package
• Internal 50 ohm matching networks for both RF input
and output
• Integrated coupler
• Coupler and Isolation ports for daisy chain
• Green – Lead-free and RoHS complian
Applications
• UMTS(HSPA+)/LTE Handset for Band11 and Band 21
Ordering Information
Part Number
ACPM-5011-TR1
ACPM-5011-BLK
Number of
Devices
1000
100
Container
178 mm (7”) Tape/Reel
Bulk
Free Datasheet http://www.datasheet4u.com/
1 page  
Footprint
0.10
1.50
0.25
0.3 0.10
X-RAY TOP VIEW
All dimensions are in millimeter
0.125
0.60
0.35
0.35
PIN Description
Pin # Name
1 Vcc1
2 RFin
3 Vbp
4 Vmode
5 Ven
6 CPL
7 GND
8 ISO
9 RFOut
10 Vcc2
Package Dimensions
Pin 1 Mark
0.5
1 10
29
3 8 3 ± 0.1
47
56
3 ± 0.1
All dimensions are in millimeter
0.9 ± 0.1
Marking Specification
Pin 1 Mark
A5011
PYYWW
AAAAA
Description
DC Supply Voltage
RF Input
Bypass Control
Mode Control
PA Enable
Coupling port of Coupler
Ground
Isolation port of Coupler
RF Out
DC Supply Voltage
Manufacturing Part Number
Lot Number
P Manufacturing Info
YY Manufacturing Year
WW Work Week
AAAAA Assemby Lot Number
5
Free Datasheet http://www.datasheet4u.com/
5 Page 
Reflow Profile Recommendations
Tp
TL Tsmax
Tsmin
ts
Preheat
Ramp-up
tp
tL
Critical Zone
TL to Tp
Ramp-down
25
t 25° C to Peak
Time
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5° C
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5° C
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (TL)
Peak temperature (TP)
Time within 5° C of actual Peak Temperature (TP)
Ramp-down Rate
Time 25° C to Peak Temperature
Sn-Pb Solder
3° C/sec max
100° C
150° C
60-120 sec
183° C
60-150 sec
240 +0/-5° C
10-30 sec
6° C/sec max
6 min max.
Pb-Free Solder
3° C/sec max
150° C
200° C
60-180 sec
3° C/sec max
217° C
60-150 sec
260 +0/-5° C
20-40 sec
6° C/sec max
8 min max.
11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
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| PDF Descargar | [ Datasheet ACPM-5011.PDF ] | |
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