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PDF ISL8200AM Data sheet ( Hoja de datos )

Número de pieza ISL8200AM
Descripción Complete Current Share 10A DC/DC Power Module
Fabricantes Intersil 
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DATASHEET
Complete Current Share 10A DC/DC Power Module
ISL8200AM
The ISL8200AM is a simple and easy to use high power,
current-sharing DC/DC power module for Datacom/Telecom/
FPGA power hungry applications. All that is needed is the
ISL8200AM, a few passive components and one VOUT setting
resistor to have a complete 10A design ready for market.
The ease of use virtually eliminates the design and
manufacturing risks while dramatically improving time to
market.
Need more output current? Parallel up to six ISL8200AM
modules to scale up to a 60A solution (see Figure 7 on
page 10).
The simplicity of the ISL8200AM is in its "off-the-shelf",
unassisted implementation versus a discrete implementation.
Patented current sharing in multiphase operation greatly
reduces ripple currents, BOM cost and complexity. For
example, parallel 2 for 20A and up to 6 for 60A. The output
voltage can be precisely regulated to as low as 0.6V with ±1%
output voltage regulation over line, load and temperature
variations.
The ISL8200AM’s thermally enhanced, compact QFN package,
operates at full load and over-temperature, without requiring
forced air cooling. It's so thin it can even fit on the backside of
the PCB. Easy access to all pins with few external components,
reduces the PCB design to a component layer and a simple
ground layer.
Features
• Complete switch mode power supply in one package
• Patented current share architecture reduces layout
sensitivity when modules are paralleled
• Programmable phase shift (1- to 6-phase)
• Extremely low profile (2.2mm height)
• Input voltage range +3V to +20V at 10A, current share up to
60A
• A single resistor sets VOUT from +0.6V to +6V
• Output overvoltage, overcurrent and over-temperature
protection and undervoltage indication
• RoHS compliant
Applications
• Servers, telecom and datacom applications
• Industrial and medical equipment
• Point of load regulation
Related Literature
AN1738 “ISL8200AMEV1PHZ Evaluation Board User’s
Guide”
ISL8200AM iSim Model - (Product Information Page)
AN1786 “Reducing the Switching Frequency of the
ISL8200M and ISL8200AM Power Modules”
Complete Functional Schematic
VIN = 4.5V TO 20V
PVIN = 3V TO 20V
PVIN
VIN
VOUT
ISL8200AM
POWER MODULE
EN VOUT_SET
FF VSEN_REM-
V0UT =
0.6V TO 6.0V
RSET
ISHARE
PGND1
10µF
5k
NOTE: For input voltage higher than 4.5V, VIN can be tied to PVIN directly
(see Figure 24 on page 13 for details).
FIGURE 1. COMPLETE 10A DESIGN, JUST SELECT RSET FOR THE
DESIRED VOUT
ISL8200AM Package
2.2mm
15mm
15mm
FIGURE 2. THE 2.2mm HEIGHT IS IDEAL FOR THE BACKSIDE OF
PCB WHEN SPACE AND HEIGHT IS A PREMIUM
July 30, 2015
FN8271.5
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2012, 2013, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.

1 page




ISL8200AM pdf
ISL8200AM
Pin Descriptions (Continued)
PIN # PIN NAME
PIN DESCRIPTION
23 N.C. Not internally connected
PD1 Phase Thermal Pad Used for both the PHASE pin (Pin 16) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PHASE Pin 16.
PD2 PVIN Thermal Pad Used for both the PVIN pin (Pin 17) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PVIN Pin 17.
PD3 PGND Thermal Pad Used for both the PGND pin (Pin 18) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PGND Pin 18.
PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin 19) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to VOUT Pin 19.
Typical Application Circuits
PVIN
GROUND
ISFETDRV1
PVIN
VIN
FF
EN
FSYNC_IN
CLKOUT
ISHARE_BUS
ISFETDRV
ISL8200AM
VOUT
VOUT_SET
VSEN_REM-
PGOOD
PH_CNTRL
VCC
RSET
2.2k
PGOOD
VCC
VOUT
VOUT
GROUND
SET R1 AND R2 SUCH THAT
0.8V ≤ VEN ≤ 5.0V
DO NOT TIE EN DIRECTLY TO A POWER SOURCE
RSET CAN CHANGE VOUT
Refer to Table 1
FIGURE 4. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT
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ISL8200AM arduino
ISL8200AM
Typical Performance Characteristics (Continued)
Transient Response Performance TA = +25°C, PVIN = VIN = 12V, CIN = 220µFx1, 10µF/ceramic x 2, COUT = 47µF/ceramic x 8
IOUT = 0A to 5A, Current slew rate = 2.5A/µs.
VOUT
VOUT
VIN = 12V
VOUT = 1.5V
IOUT = 0A TO 5A
VIN = 12V
VOUT = 1.8V
IOUT = 0A TO 5A
FIGURE 11. 1.5V TRANSIENT RESPONSE
VOUT
VIN = 12V
VOUT = 2.5V
IOUT = 0A TO 5A
FIGURE 13. 2.5V TRANSIENT RESPONSE
PHASE1-M
PHASE2-M
PHASE3-M
PHASE4-S
FIGURE 12. 1.8V TRANSIENT RESPONSE
VOUT
VIN = 12V
VOUT = 1.8V
IOUT = 0A TO 5A
FIGURE 14. 3.3V TRANSIENT RESPONSE
FIGURE 15. FOUR MODULE CLOCK SYNC (VIN = 12V)
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July 30, 2015

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