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Número de pieza | SKY65387-11 | |
Descripción | 2110-2170 MHz Variable Gain Amplifier | |
Fabricantes | Skyworks Solutions | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de SKY65387-11 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
No Preview Available ! PRELIMINARY DATA SHEET
SKY65387-11: 2110-2170 MHz Variable Gain Amplifier
Applications
• WCDMA base stations
• Femto cells
Features
• Frequency range: 2110 to 2170 MHz
• High gain: >30 dB
• Attenuation range: > 35 dB
• OP1dB: >+28 dBm
• ACLR < –65 dBc for POUT = +12 dBm
• Single DC supply: +5 V
• Small MCM (12-pin, 8.385 x 8.385 mm) SMT package (MSL3,
260 °C per JEDEC J-STD-020)
Skyworks Pb-free products are compliant with
all applicable legislation. For additional
information, refer to Skyworks Definition of
Lead (Pb)-Free, document number SQ04-0073.
Description
Skyworks SKY65387-11 is a high linearity, Variable Gain Amplifier
(VGA) module. The device includes an input Low-Noise Amplifier
(LNA), a variable voltage attenuator, and an output Power
Amplifier (PA). The two amplifiers and voltage attenuator are
optimized for superior ACLR performance with WCDMA signals.
The high linearity (high OP1dB, OIP3, and ACLR) and high
efficiency of this device make it ideal for use at the final stage (or
close to the final stage) of a WCDMA transmit chain.
The output of the first PA (PA1) is matched to the input of the VCA.
The output of the VCA is matched to the input of the second PA
(PA2). The RF_IN and RF_OUT signals (pins 1 and 8, respectively)
are both internally matched, including DC blocking capacitors.
The SKY65387-11 VGA uses low-cost Surface Mount Technology
(SMT) in the form of a compact, 8 x 8 mm 12-pin Multi-Chip
Module (MCM), which allows for a highly manufacturable low-cost
solution. A functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
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VCTRL
RF_IN
Input Match
PA1 PA2
Variable Attenuator
Output Match
Figure 1. SKY65387-11 Block Diagram
RF_OUT
S2326
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202310A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 27, 2012
1
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page PRELIMINARY DATA SHEET • SKY65387-11 VGA
40
2110 MHz
30 2140 MHz
2170 MHz
20
10
0
–10
–20
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Control Voltage (V)
Figure 9. Gain vs Control Voltage
Evaluation Board Description
The Skyworks SKY65387-11 Evaluation Board is used to test the
performance of the SKY65387-11 VGA. An Evaluation Board
schematic diagram is provided in Figure 10. An assembly drawing
for the Evaluation Board is shown in Figure 11 and the layer detail
is provided in Figure 12. The layer detail physical characteristics
are noted in Figure 13.
Capacitors C1, C2, and C3 provide DC bias decoupling and RF
bypass for VCC_AMP1 (pin 11). Capacitors C4, C5, and C6 provide
DC bias decoupling and RF bypass for VCC_AMP2 (pin 10).
Capacitor C7 provides decoupling for VCTRL (pin 3).
Pins 1 and 8 are the RF input and output signals, respectively.
Pins 2, 4, 5, 6, 7, 9, 12, and the package backside metal are
ground pins that provide the DC, RF, and thermal ground.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
1. Proper isolation must be provided between the VCC_AMP1
and VCC_AMP2 pins.
2. Paths to ground should be made as short as possible.
3. The ground pad of the SKY65387-11 VGA has special
electrical and thermal grounding requirements. This pad is the
main thermal conduit for heat dissipation. Since the circuit
board acts as the heat sink, it must shunt as much heat as
possible from the amplifier. As such, design the connection to
the ground pad to dissipate the maximum wattage produced
to the circuit board. Multiple vias to the grounding layer are
required. Filled or capped vias are recommended.
4. It is recommended that the layout for the VCC_AMP1 and
VCC_AMP2 signals follow what is shown in Figure 11. The
VCC_AMP1 and VCC_AMP2 traces can be tied together to
share the same power supply. The connecting node should
not be placed close to the package pins. The connecting node
should be connected closer to components C1 and C4 (see
Figure 10). This is to provide isolation between VCC_AMP1
and VCC_AMP2.
NOTE: Junction temperature (Tj) of the device increases with a
poor connection to the slug and ground. This reduces the
lifetime of the device.
Testing Procedure
Use the following procedure to set up the SKY65387-11
Evaluation Board for testing:
1. Connect a 5.0 V supply to the VCC_AMP1 and VCC_AMP2
www.DataSheet.net/
pins. Connect the VCTRL signal to a power supply and set the
power supply to 0 V. If available, enable the current limiting
function of the power supply to 450 mA.
2. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of –20 dBm or less
to the Evaluation Board but do NOT enable the RF signal.
3. Connect a spectrum analyzer to the RF signal output port.
4. Enable the power supply.
5. Enable the RF signal.
6. Take measurements.
CAUTION: If any of the output signals exceed the rated
maximum values, the SKY65387-11 Evaluation Board
can be permanently damaged.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202310A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 27, 2012
5
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page PRELIMINARY DATA SHEET • SKY65387-11 VGA
0.318 ± 0.013 T
8.88 ± 0.10 (Bo)
Pin #1
12.00 ± 0.10
4.00 ± 0.10
B
∅1.50 ± 0.10
2.00 ± 0.10
5° Max
A
A
1.75 ± 0.10
7.50 ± 0.10
16.00 +0.30/–0.10
2.14 ± 0.10 (Ko)
B
B
8° Max
∅1.50 ± 0.25
8.89 ± 0.10 (Ao)
A
Notes:
1. Carrier tape material: black conductive polycarbonate
or polystyrene.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 13.3 mm width.
4. Typical ESD surface resistivity is ≤108 Ohms/square per EIA, JEDEC
tape and reel specification.
5. Tolerance: .XX = ±0.10 mm.
6. All measurements are in millimeters.
Figure 16. SKY65387-11 Tape and Reel Dimensions
S2630
www.DataSheet.net/
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202310A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 27, 2012
11
Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet SKY65387-11.PDF ] |
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