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PDF SKY65329-NP Data sheet ( Hoja de datos )
| Número de pieza | SKY65329-NP | |
| Descripción | 900 MHz Front-End Module | |
| Fabricantes | Skyworks Solutions | |
| Logotipo |  |
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PRELIMINARY DATA SHEET
SKY65329-NP: 900 MHz Front-End Module
Applications
• Paging
• Remote metering
• WLL and ISM transmitters
Features
• 900 MHz transmit saturated output power > 24 dBm
• 900 MHz high efficiency PA and LNA
• Auxiliary bidirectional broadband RF path
• Internal switching and control circuits
• Internal RF match and bias circuits
• Internal DC block on RF ports
• Externally adjustable bias setting
• Single DC supply = 3.6 V
• Small footprint, MCM (28-pin, 8 x 8 mm) Pb-free (MSL3, 260 °C
per JEDEC J-STD-020) SMT package
Description
Skyworks SKY65329-NP is a fully matched, high-efficiency RF
Front-End Module (FEM) with 900 MHz transmit and receive
paths. There are also routing switches to connect auxiliary
broadband signals between the RFIC and antenna ports. By using
three control signals (CTRL1, CTRL2, and PWR_DOWN), the
module can be configured to one of five operational modes (900
MHz transmit, 900 MHz receive, auxiliary RF bypass, auxiliary
power, or power down).
The 900 MHz transmit path consists of an harmonic filter and high
efficiency Power Amplifier (PA). The 900 MHz receive path
contains a low-power Low-Noise Amplifier (LNA). Both the PA and
LNA can be switched to power-down mode for low leakage
current. The auxiliary RF path is a low-loss, broadband,
bidirectional RF path that allows easy switching of signal between
the RFIC and the antenna port.
Breakout ports are available for adding external filters. Switchable
auxiliary power can supply up to 10 mA of VDD power to external
circuitry through pin 26 (VDD_OUT).
The SKY65329-NP is manufactured with advanced InGaP HBT and
silicon CMOS processes, which provide a positive DC voltage
supply while maintaining high efficiency and good linearity.
The device is mounted in a 28-pin, 8 x 8 mm MCM Surface-
Mounted Technology (SMT) package, which allows for a highly
manufacturable low-cost solution.
A block diagram of the SKY65329-NP is shown in Figure 1. The
device package and pinout for the 28-pin MCM are shown in
Figure 2.
Filter 1
Filter 2
Bidirectional
RF Port
Switch A
Switch B
LNA
Harmonic
Filter
PA
Switch C
Switch D
Antenna Port
Filter 3
Filter 4
Figure 1. SKY65329-NP Block Diagram
S1336
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200995A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • March 4, 2009
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PRELIMINARY DATA SHEET • SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
Evaluation Board Description
The SKY65329-NP Evaluation Board is used to test the
performance of the SKY65329-NP FEM. The Evaluation Board
schematic diagram is shown in Figure 3. An assembly drawing for
the Evaluation Board is shown in Figure 4 and the layer detail is
provided in Figure 5. The layer detail physical characteristics are
noted in Figure 6. Table 6 provides the Bill of Materials (BOM) list
for Evaluation Board components.
The four external filters shown in Figure 3 are configured as
throughputs so that the device can be tested immediately.
External resistors are installed with values that allow the unit to
operate immediately with the electrical specifications provided in
Table 4. Refer to the SKY65329 T/R FEM Evaluation Board
Information Application Note (document # *** TBD ***) for
additional testing information.
The digital ground pin of the SKY65329-NP (pin 22) is not
connected to the other ground pins internally. Therefore, an
external common ground connection is needed. If this is not
provided, the digital controller may operate at a different potential
than the RF section, which could damage the part.
The separate digital ground pin allows flexibility when connecting
the ground between the digital and RF sections of the device. This
connection is through resistor R21 and capacitor C11 (loaded with
a 0 Ω resistor by default). If RF isolation is desired between the
digital and RF sections, an appropriate component may be placed
instead. Pin 16 of connector P1 is used to connect the source of
the digital controls to a common ground point with the test fixture
through components R21 and C11.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short as possible.
2. The ground pads of the SKY65329-NP have special electrical
and thermal grounding requirements. These pads are the
main thermal conduit for heat dissipation. Since the circuit
board acts as the heat sink, it must shunt as much heat as
possible from the device. Therefore, design the connection to
the ground pad to dissipate the maximum wattage produced
by the circuit board. Multiple vias to the grounding layer are
required.
3. Two external output bypass capacitors (0.022 μF and 22 μF)
are required on pin 25 (VCC_PA). The same two capacitor
values are also required on pin 14 (VCC_LNA). The capacitors
should be placed in parallel between the supply line and
ground.
4. Pins 14 and 25 (VCC_LNA and VCC_PA, respectively) may be
connected together at the supply.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Package Dimensions
The phone board layout footprint for the SKY65329-NP is shown
in Figure 7. Package dimensions for the 28-pin MCM are shown
in Figure 8, and tape and reel dimensions are provided in
Figure 9.
Electrostatic Discharge (ESD) Sensitivity
The SKY65329-NP is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200995A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • March 4, 2009
5
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PRELIMINARY DATA SHEET • SKY65329-NP TRANSMIT/RECEIVE FRONT-END MODULE
Pin 1
Indicator
B
8C
8
16X 3.9
16X 2.5
16X 1.5
16X 0.5
See Detail D
Pin 28
Pin 1 Indicator
(See Detail C)
Pin 1
A
0
0.15 A B C
Top View
1.05 ± 0.1
A
0.1
Side View
28X SMT Pad
0.1 A B C
B
0 36X Solder Mask Openings
0.2 A B C
Bottom View
0.6 ± 0.05
(0.1)
3X (0.05)
2X 0.6 ± 0.05
Metal Pad
All Edges
0.75 ± 0.05
0.65 ± 0.05
4X (0.05)
2X (0.1)
Detail A
Pad Scale: 2X
Metal Pad
All Edges
6X This rotation
6X Rotated 180o
6X Rotated 90o CW
6X Rotated 90o CCW
2X 0.8 ± 0.05
Detail B
Pad Scale: 2X
1X This rotation
1X Rotated 180o
1X Rotated 90o CW
1X Rotated 90o CCW
0.875
0.875
0.2 x 0.2
Detail C
Scale: 2X
Soldermask
Edges
All measurements are in millimeters
Dimensioning and tolerancing according to ASME Y14.5M-1994
Figure 8. SKY65329-NP 28-Pin MCM Package Dimensions
0.875
0.875
35 X Detail D
Scale: 2X
Soldermask
Edges
S1341
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200995A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • March 4, 2009
11
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11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet SKY65329-NP.PDF ] | |
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