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PDF MT29F1G08AACWP Data sheet ( Hoja de datos )

Número de pieza MT29F1G08AACWP
Descripción NAND Flash Memory
Fabricantes Micron Technology 
Logotipo Micron Technology Logotipo



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Micron Confidential and Proprietary
1Gb: x8, x16 NAND Flash Memory
Features
NAND Flash Memory
MT29F1G08AACWP, MT29F1G08AACH4
MT29F1G08ABCHC, MT29F1G16ABCHC,
MT29F1G08ABCH4, MT29F1G16ABCH4
Features
Open NAND Flash Interface (ONFI) 1.0-compliant1
Single-level cell (SLC) technology
Organization
Page size x8: 2112 bytes (2048 + 64 bytes)
Page size x16: 1056 words (1024 + 32 words)
Block size: 64 pages (128K + 4K bytes)
Device size: 1Gb: 1024 blocks
Asynchronous I/O performance
tRC/tWC: 25ns (3.3V), 35ns (1.8V)
Array performance
Read page: 25µs
Program page: 250µs (TYP, 3.3V)
Program page: 250µs (TYP, 1.8V)
Erase block: 500µs (TYP)
Command set: ONFI NAND Flash Protocol
Advanced command set
Program cache
Read cache sequential
Read cache random
One-time programmable (OTP) mode
Block lock (1.8V only)
Boot block (1.8V only)
Programmable drive strength
Read unique ID
Internal data move
Operation status byte provides software method for
detecting
Operation completion
Pass/fail condition
Write-protect status
Internal data move operations supported within the
device from which data is read
Ready/busy# (R/B#) signal provides a hardware
method for detecting operation completion
WP# signal: write protect entire device
Blocks 0–7 (block address 00h-07h) guaranteed to
be valid with ECC when shipped from factory (3.3V
only); see Error Management (page 83).
Blocks 0–3 (block address 00h-03h) guaranteed to
be valid with ECC when shipped from factory (1.8V
only); see Error Management (page 83).
RESET (FFh) required as first command after power-
on
Alternate method of device initialization (Nand_In-
it) after power up3 (contact factory)
Quality and reliability
Data retention: 10 years
Endurance: 100,000 PROGRAM/ERASE cycles
Operating Voltage Range
VCC: 2.7–3.6V
VCC: 1.65–1.95V
Operating temperature:
Commercial: 0°C to +70°C
Extended (ET): –40ºC to +85ºC
Package
48-pin TSOP type 1, CPL2
63-ball VFBGA
Notes:
1. The ONFI 1.0 specification is available at
www.onfi.org.
2. CPL = Center parting line.
3. Available only in 1.8V VFBGA package.
PDF:09005aef83c2e425
1gb_nand_m58a.pdf – Rev. D 1/10 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2008 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Datasheet pdf - http://www.DataSheet4U.net/

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MT29F1G08AACWP pdf
www.DataSheet.co.kr
Micron Confidential and Proprietary
1Gb: x8, x16 NAND Flash Memory
List of Tables
Table 1: Asynchronous Signal Definitions ........................................................................................................ 8
Table 2: Array Addressing (x8) ........................................................................................................................ 16
Table 3: Array Addressing (x16) ...................................................................................................................... 17
Table 4: Asynchronous Interface Mode Selection ........................................................................................... 18
Table 5: Command Set .................................................................................................................................. 29
Table 6: READ ID Parameters for Address 00h ................................................................................................ 33
Table 7: READ ID Parameters for Address 20h ................................................................................................ 34
Table 8: Parameter Page Data Structure ......................................................................................................... 36
Table 9: Feature Address Definitions .............................................................................................................. 39
Table 10: Feature Addresses 01h: Timing Mode .............................................................................................. 41
Table 11: Feature Addresses 80h: Programmable I/O Drive Strength ............................................................... 42
Table 12: Feature Addresses 81h: Programmable R/B# Pull-Down Strength ..................................................... 42
Table 13: Features Address 90h: Operation Mode ........................................................................................... 43
Table 14: Status Register Definition ............................................................................................................... 44
Table 15: Block Lock Address Cycle Assignments ............................................................................................ 65
Table 16: Block Lock Status Register Bit Definitions ........................................................................................ 68
Table 17: Error Management Details .............................................................................................................. 83
Table 18: Absolute Maximum Ratings ............................................................................................................ 84
Table 19: Recommended Operating Conditions ............................................................................................. 84
Table 20: Valid Blocks .................................................................................................................................... 84
Table 21: Capacitance ................................................................................................................................... 85
Table 22: Test Conditions .............................................................................................................................. 85
Table 23: AC Characteristics: Command, Data, and Address Input (3.3V) ......................................................... 86
Table 24: AC Characteristics: Command, Data, and Address Input (1.8V) ......................................................... 86
Table 25: AC Characteristics: Normal Operation (3.3V) ................................................................................... 87
Table 26: AC Characteristics: Normal Operation (1.8V) ................................................................................... 88
Table 27: DC Characteristics and Operating Conditions (3.3V) ........................................................................ 89
Table 28: DC Characteristics and Operating Conditions (1.8V) ........................................................................ 90
Table 29: PROGRAM/ERASE Characteristics .................................................................................................. 91
PDF:09005aef83c2e425
1gb_nand_m58a.pdf – Rev. D 1/10 EN
5 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.net/

5 Page





MT29F1G08AACWP arduino
www.DataSheet.co.kr
Micron Confidential and Proprietary
1Gb: x8, x16 NAND Flash Memory
Signal Descriptions and Assignments
Figure 4: 63-Ball VFBGA, x16 (Balls Down, Top View)
1 2 3 4 5 6 7 8 9 10
A NC NC
NC NC
B NC
NC NC
C WP# ALE Vss CE# WE# R/B#
D VCC RE# CLE NC NC NC
E NC NC NC NC NC NC
F NC NC NC NC VSS NC
G
DNU
VCC LOCK I/O13 I/O15
NC
H I/O8 I/O0 I/O10 I/O12 I/O14 VCC
J I/O9 I/O1 I/O11 VCC I/O5 I/O7
K VSS I/O2 I/O3 I/O4 I/O6 VSS
L NC NC
NC NC
M NC NC
NC NC
PDF:09005aef83c2e425
1gb_nand_m58a.pdf – Rev. D 1/10 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.net/

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