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PDF 35XS3400 Data sheet ( Hoja de datos )

Número de pieza 35XS3400
Descripción Quad High Side Switch
Fabricantes Freescale Semiconductor 
Logotipo Freescale Semiconductor Logotipo



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No Preview Available ! 35XS3400 Hoja de datos, Descripción, Manual

Freescale Semiconductor
Advance Information
Document Number: MC35XS3400
Rev. 10.0, 8/2013
Quad High Side Switch
(Quad 35 mOhm)
35XS3400
The 35XS3400 is one in a family of devices designed for low-voltage
automotive lighting applications. Its four low RDS(ON) MOSFETs (quad
35 mOhm) can control four separate 28 W bulbs, and/or LEDs.
Programming, control and diagnostics are accomplished using a
16-bit SPI interface. Its output with selectable slew rate improves
electromagnetic compatibility (EMC) behavior. Additionally, each
output has its own parallel input or SPI control for pulse-width
modulation (PWM) control. The 35XS3400 allows the user to program
via the SPI the fault current trip levels and duration of acceptable lamp
inrush. The device has Fail-safe mode to provide functionality of the
outputs in case of MCU damage. This device is powered by
SMARTMOS technology.
HIGH SIDE SWITCH
Features
• Four protected 35 mhigh side switches (at 25 °C)
• Operating voltage range of 6.0 V to 20 V with standby current <
5.0 A, extended mode from 4.0 V to 28 V
• 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting
with daisy chain capability
• PWM module using external clock or calibratable internal
oscillator with programmable outputs delay management
• Smart over-current shutdown, severe short-circuit, over-
temperature protection with time limited autoretry, and Fail-safe
mode in case of MCU damage
• Output OFF or ON OpenLoad detection compliant to bulbs or
LEDs and short to battery detection
• Analog current feedback with selectable ratio and board
temperature feedback
FK SUFFIX (PB-FREE)
98ARL10596D
24-PIN PQFN
ORDERING INFORMATION
Device
(for Tape and Reel
orders add an R2
suffix to the part)
Temperature
Range (TA)
Package
MC35XS3400CHFK
MC35XS3400DHFK
-40 to 125°C
24 PQFN
VDD
VDD VPWR VDD
VPWR
I/O
SCLK
CS
SI
I/O
MCU SO
I/O
I/O
I/O
I/O
A/D
GND
35XS3400
VDD
VPWR
WAKE
FS
SCLK
CS
SO
HS0
HS1
RST
SI
IN0
IN1
IN2
IN3
CSNS
FSI
HS2
HS3
GND
LOAD
LOAD
LOAD
LOAD
Figure 1. 35XS3400 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2008 - 2013. All rights reserved.

1 page




35XS3400 pdf
PIN CONNECTIONS
Table 2. 35XS3400 Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 19.
Pin
Number
Pin Name
Pin
Function
Formal Name
Definition
13
VDD
Power Digital Drain Voltage This pin is an external voltage input pin used to supply power interfaces to the
SPI bus.
14, 17, 23 GND
Ground
Ground
These pins, internally shorted, are the ground for the logic and analog circuitry
of the device. These ground pins must be also shorted in the board.
15
VPWR
Power Positive Power Supply This pin connects to the positive power supply and is the source of operational
power for the device.
16
SO
Output
Serial Output
This output pin is connected to the SPI serial data input pin of the MCU or to
the SI pin of the next device of a daisy-chain of devices.
18
HS3
Output
High Side Outputs Protected 35 mhigh side power output pins to the load.
19 HS1
21 HS0
22 HS2
4, 20
NC
N/A
No Connect
These pins may not be connected.
24
FSI
Input
Fail-safe Input
This input enables the watchdog timeout feature.
Analog Integrated Circuit Device Data
Freescale Semiconductor
35XS3400
5

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35XS3400 arduino
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, -40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max Unit
POWER OUTPUT TIMING HS0 TO HS3
Output Rising Medium Slew Rate (medium speed slew rate / SR[1:0]=00)(27) SRR_00
V/s
VPWR = 14 V
0.2 0.4 0.8
Output Rising Slow Slew Rate (low speed slew rate / SR[1:0]=01)(27)
VPWR = 14 V
SRR_01
V/s
0.1 0.2 0.4
Output Falling Fast Slew Rate (high speed slew rate / SR[1:0]=10)(27)
VPWR = 14 V
SRR_10
V/s
0.4 0.8 1.6
Output Falling Medium Slew Rate (medium speed slew rate / SR[1:0]=00)(27) SRF_00
V/s
VPWR = 14 V
0.2 0.4 0.8
Output Falling Slow Slew Rate (low speed slew rate / SR[1:0]=01)(27)
VPWR = 14 V
SRF_01
V/s
0.1 0.2 0.4
Output Rising Fast Slew Rate (high speed slew rate / SR[1:0]=10)(27)
VPWR = 14 V
SRF_10
V/s
0.4 0.8 1.6
Output Turn-ON Delay Time(28)
VPWR = 14 V for medium speed slew rate (SR[1:0]=00)
t DLY(ON)
s
35 60 85
Output Turn-OFF Delay Time(29)
VPWR = 14 V for medium speed slew rate (SR[1:0]=00)
t DLY(OFF)
s
35 60 85
Driver Output Matching Slew Rate (SRR /SRF)
VPWR = 14 V @ 25 °C and for medium speed slew rate (SR[1:0]=00)
SR
0.8 1.0 1.2
Driver Output Matching Time (tDLY(ON) - tDLY(OFF))
t RF
s
VPWR = 14 V, fPWM = 240 Hz, PWM duty-cycle = 50%, @ 25 °C for medium
-25 0
25
speed slew rate (SR[1:0]=00)
Notes
27. Rise and Fall Slew rates measured across a 5.0 resistive load at high side output = 30% to 70% (see Figure 4, page 16).
28. Turn-ON delay time measured from rising edge of any signal (IN[0:3] and CS) that would turn the output ON to VHS[0:3] = VPWR / 2 with
RL = 5.0 resistive load.
29. Turn-OFF delay time measured from falling edge of any signal (IN[0:3] and CS) that would turn the output OFF to VHS[0:3] =VPWR / 2
with RL = 5.0 resistive load.
Analog Integrated Circuit Device Data
Freescale Semiconductor
35XS3400
11

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