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PDF HMMC-3128 Data sheet ( Hoja de datos )
| Número de pieza | HMMC-3128 | |
| Descripción | DC-12 GHz Packaged High Efficiency Divide-by-8 Prescaler | |
| Fabricantes | Agilent(Hewlett-Packard) | |
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Agilent HMMC-3128
DC-12 GHz Packaged High
Efficiency Divide-by-8 Prescaler
1GC1-8208-TR1-7" diameter reel/500 each
1GC1-8208-BLK-bubble strip/10 each
Data Sheet
Features
• Wide Frequency Range:
0.2-12 GHz
• High Input Power Sensitivity:
On-chip pre- and post-amps
-15 to +10 dBm (1- 8 GHz)
-10 to +8 dBm (8-10 GHz)
-5 to +2 dBm (10-12 GHz)
• Pout: 0 dBm (0.5 Vp–p)
• Low Phase Noise:
-153 dBc/Hz @ 100 kHz Offset
• (+) or (-) Single Supply Bias
Operation
• Wide Bias Supply Range:
4.5 to 6.5 volt operating range
• Differential I/0 with on-chip
50 Ω matching
Description
The HMMC-3128 is a packaged GaAs
HBT MMIC pre-scaler which offers
dc to 12 GHz frequency translation
for use in communications and EW
systems incorporating high-frequency
PLL oscillator circuits and signal-
path down conversion applications.
The prescaler provides a large input
power sensitivity window and low
phase noise.
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Package Type:
Package Dimensions:
Package Thickness:
Lead Pitch:
Lead Width:
8-lead SOIC Plastic
4.9 x 3.9 mm typ.
1.55 mm typ.
1.25 mm nom.
0.42 mm nom.
Absolute Maximum Ratings1
(@ TA = 25°C, unless otherwise indicated)
Symbol
Parameters/Conditions
Min.
VCC
VEE
VCC - VEE
VLogic
Pin(CW)
VRFin
TBS2
Tst
Tmax
Bias supply voltage
Bias supply voltage
-7
Bias supply delta
0
Logic threshold voltage
CW RF input power
VCC -1.5
DC input voltage
(@ RFin or RFin ports)
Backside operating temperature -40
Storage temperature
-65
Maximum assembly temperature
(60 s max.)
Max.
+7
+7
VCC -1.2
+10
VCC ±0.5
+85
+165
310
Units
volts
volts
volts
volts
dBm
volts
°C
°C
°C
Notes
1. Operation in excess of any parameter limit (except TBS) may cause permanent damage to the device.
2. MTTF > 1 x 106 hours @ TBS ≤ 85°C. Operation in excess of maximum operating temperature (TBS) will degrade MTTF.
1 page  
Figure 2. Package and dimensions
Symbol Min. Max.
A 1.35 1.75
A1 0.0 .25
B 0.33 0.51
C 0.19 .025
D 4.80 5.00
E 3.80 4.00
e
1.27 BSC
1.27 BSC
H 5.80 6.20
L 0.40 1.27
a 0° 8°
Notes:
• All dimensions in millimeters.
• Refer to JEDEC Outline MS-012 for additional tolerances.
• Exposed heat slug area on package bottom = 2.67 x 1.65.
• Exposed heat sink on package bottom must be soldered to
PCB RF ground plane.
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Figure 3. Assembly diagram (Single-supply, positive-bias configuration shown)
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMMC-3128.PDF ] | |
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