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PDF NTMFS4119N Data sheet ( Hoja de datos )
| Número de pieza | NTMFS4119N | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTMFS4119N
Power MOSFET
30 V, 30 A, Single N-Channel,
SO-8 Flat Lead
Features
•ăLow RDS(on)
•ăFast Switching Times
•ăLow Inductance SO-8 Package
•ăThese are Pb-Free Devices
Applications
•ăNotebooks, Graphics Cards
•ăLow Side Switch
•ăDC-DC
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current
(Note 1)
Power Dissipation (Note 1)
Steady
State
t v10 s
Steady
State
t v10 s
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
VDSS
VGS
ID
PD
30
$20
18
13
30
2.3
6.1
Continuous Drain Current
(Note 2)
Power Dissipation (Note 2)
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
ID
PD
IDM
TJ, Tstg
11
8.0
0.9
89
-55 to
150
Source Current (Body Diode)
IS 8.0
Single Pulse Drain-to-Source Avalanche Energy EAS 421
(VDD = 30 V, VGS = 10 V, IPK = 29 A,
L = 1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL 260
Unit
V
V
A
W
A
W
A
°C
A
mJ
°C
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction-to-Case - Steady State
RqJC
1.3 °C/W
Junction-to-Ambient - Steady State (Note 1)
RqJA
53.7
Junction-to-Ambient - t v10 s (Note 1)
RqJA
20.5
Junction-to-Ambient - Steady State (Note 2)
RqJA 138.5
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).
www.DataSheet4U.com
http://onsemi.com
V(BR)DSS
30 V
RDS(on) Typ
2.3 mW @ 10 V
3.1 mW @ 4.5 V
ID Max
(Note 1)
30 A
D
G
S
1
SO-8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
SD
S 4119N
S AYWWG
GG D
D
4119N = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTMFS4119NT1G SO-8 FL 1500 Tape & Reel
(Pb-Free)
NTMFS4119NT3G SO-8 FL 5000 Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 5
1
Publication Order Number:
NTMFS4119N/D
1 page  
NTMFS4119N
PACKAGE DIMENSIONS
DFN6 5x6, 1.27P (SO8 FL)
CASE 488AA-01
ISSUE C
D
2
D1
6
2X
0.20 C
A
B 2X
5 0.20 C
E1
2E
c
1 2 34
TOP VIEW
0.10 C
0.10 C
SIDE VIEW
A
DETAIL A
3X
e
DETAIL A
8X b
0.10 C A B
0.05 c L
1
e/2
4
K
STYLE 1:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
E2
L1 M
4X
q
A1
C
SEATING
PLANE
NOTES:
1.
DIMENSIONING AND
ASME Y14.5M, 1994.
TOLwERwANwCI.NDGaPtEaRSheet4U.com
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.90 1.00 1.10
A1 0.00 --- 0.05
b 0.33 0.41 0.51
c 0.23 0.28 0.33
D 5.15 BSC
D1 4.50 4.90 5.10
D2 3.50 --- 4.22
E 6.15 BSC
E1 5.50 5.80 6.10
E2 3.45 --- 4.30
e 1.27 BSC
G 0.51 0.61 0.71
K 0.51 --- ---
L 0.51 0.61 0.71
L1 0.05 0.17 0.20
M 3.00 3.40 3.80
q 0 _ --- 12 _
SOLDERING FOOTPRINT*
3X
1.270
4X
0.750
4X
1.000
0.965
1.330
2X
0.495
3.200
2X
0.905
4.530
0.475
65
G D2
BOTTOM VIEW
2X
1.530
4.560
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
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ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
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5
NTMFS4119N/D
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet NTMFS4119N.PDF ] | |
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