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PDF AND2307 Data sheet ( Hoja de datos )
| Número de pieza | AND2307 | |
| Descripción | LED Displays | |
| Fabricantes | Purdy Electronics | |
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Hay una vista previa y un enlace de descarga de AND2307 (archivo pdf) en la parte inferior de esta página. Total 2 Páginas | ||
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OPTOELECTRONICS
47.76
41.5
3.5 min.
Unit: mm
LED Displays
www.DataSheet4U.com
Product specifications contained herein may be changed without prior
notice. It is therefore advisable to contact Purdy Electronics before
proceeding with the design of equipment incorporating this product.
A
FB
G
E C 25.75
AND-2307 Series
GaAsP/GaP–Red; GaP–Green
7 Segment, Large Size; 2.3 Inch
D
DP
12.0
1.0
0.5
All Pin
No. 1 5
2.54 X 4 = 10.16
5.5ø
No. 5
15
E D C B A F G DP
Features
• Large size—7 segment displays
• Available in red or green
• Suitable for large size displays for distance viewing;
across-the-building status displays
• Available in both common cathode and common anode
• RoHS Compliant
Description
Size
2.3 inch
2.3 inch
Number
of Digits
1
1
Common
Cathode
Anode
AND-2307SCL
AND-2307GCL
AND-2307SAL
AND-2307GAL
Absolute Maximum Ratings (T = 25°C)
Characteristics
DC Forward Current/Segment
Reverse Voltage/Segment
Operating Temperature Range
Storage Temperature Range
Symbol
IF(DC)/SEG
VR
TOpr
TStg
Color
Display
Red
Green
Face
Red
Gray
Rating
30
3 (Red), 5 (Green)
-25 to 85
-25 to 100
Number
of Pins
10
10
Unit
mA
V
°C
°C
Electro-Optical Characteristics (T = 25°C)
Characteristics
Forward Voltage/Segment
Forward Voltage/D.P.
Reverse Current
Luminous Intensity
Per Segment
Red
Green
Peak Emission
Wavelength
Red
Green
Spectral Line
Half Width
Red
Green
Symbol
VF
VF
IR
IV
IV
λP
λP
∆λ
∆λ
Test Condition
IF = 20 mA
IF = 10 mA
VR = 3 (Red), 5 (Green)
IF = 10 mA
IF = 10 mA
IF = 10 mA
IF = 10 mA
IF = 10 mA
IF = 10 mA
Minimum
–
–
–
4.7
4.1
–
–
–
–
Typical
8.4
4.2
–
7.8
6.8
635
567
40
30
Maximum
12.0
6.0
100
–
–
–
–
–
–
Unit
V
V
µA
mcd
mcd
nm
nm
nm
nm
Precaution
Please be careful of the following:
1. Soldering temperature: 260°C max; Soldering time: 3 sec. max; Soldering portion of lead: up to 2 mm from the body of the device.
2. The lead can be formed up to 5 mm from the body of the device without forming stress. Soldering should be performed after the lead
forming.
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085
Tel: 408.523.8200 • Fax: 408.733.1287 • [email protected] • www.purdyelectronics.com
7/18/07
1 page | ||
| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet AND2307.PDF ] | |
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