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PDF LP38512-1.8 Data sheet ( Hoja de datos )
| Número de pieza | LP38512-1.8 | |
| Descripción | 1.5A Fast-Transient Response Low-Dropout Linear Voltage Regulator | |
| Fabricantes | National Semiconductor | |
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May 14, 2008
LP38512-1.8
1.5A Fast-Transient Response Low-Dropout Linear
Voltage Regulator with Error Flag
General Description
The LP38512-1.8 Fast-Transient Response Low-Dropout
Voltage Regulator offers the highest-performance in meeting
AC and DC accuracy requirements for powering Digital
Cores. The LP38512-1.8 uses a proprietary control loop that
enables extremely fast response to change in line conditions
and load demands. Output Voltage DC accuracy is guaran-
teed at 2.5% over line, load and full temperature range from
-40°C to +125°C. The LP38512-1.8 is designed for inputs
from the 2.5V, 3.3V, and 5.0V rail, is stable with 10 μF ceramic
capacitors, and has a fixed 1.8V output. An Error Flag feature
monitors the output voltage and notifies the system processor
when the output voltage falls more than 15% below the nom-
inal value. The LP38512-1.8 provides excellent transient per-
formance to meet the demand of high performance digital
core ASICs, DSPs, and FPGAs found in highly-intensive ap-
plications such as servers, routers/switches, and base sta-
tions.
Features
■ 2.25V to 5.5V Input Voltage Range
■ 1.8V Fixed Output Voltage
■ 1.5A Output Load Current
■ ±2.5% Accuracy over Line, Load, and Full-Temperature
Range from -40°C to +125°C
■ Stable with tiny 10 µF ceramic capacitors
■ 0.20% Output Voltage Load Regulation from 10 mA to
1.5A
■ Enable pin
■ Error Flag Indicates Status of Output Voltage
■ 1uA of Quiescent current in Shutdown
■ 40dB of PSRR at 100 kHz
■ Over-Temperature and Over-Current Protection
■ TO-263 and TO-263 THIN Surface Mount Packages
Applications
■ Digital Core ASICs, FPGAs, and DSPs
■ Servers
■ Routers and Switches
■ Base Stations
■ Storage Area Networks
■ DDR2 Memory
Typical Application Circuit
20183001
© 2008 National Semiconductor Corporation 201830
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1 page  
Typical Performance Characteristics Unless otherwise specified: TJ = 25°C, VIN = 2.5V, VEN = VIN,
CIN = 10 µF, COUT = 10 µF, IOUT = 10 mA.
VOUT vs Temperature
VOUT vs VIN
20183011
Ground Pin Current (IGND) vs VIN
20183037
Ground Pin Current (IGND) vs Temperature
20183012
Ground Pin Current(IGND) vs Temperature, VEN = 0.5V
20183013
Enable Thresholds vs Temperature
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20183014
5
20183016
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5 Page 
FIGURE 2. ERROR Flag Operation, biased from VIN
20183034
POWER DISSIPATION/HEATSINKING
A heatsink may be required depending on the maximum pow-
er dissipation (PD(MAX)), maximum ambient temperature
(TA(MAX)) of the application, and the thermal resistance (θJA)
of the package. Under all possible conditions, the junction
temperature (TJ) must be within the range specified in the
Operating Ratings. The total power dissipation of the device
is given by:
PD = ( (VIN−VOUT) x IOUT) + (VIN x IGND)
(1)
where IGND is the operating ground current of the device
(specified under Electrical Characteristics).
The maximum allowable junction temperature rise (ΔTJ) de-
pends on the maximum expected ambient temperature (TA
(MAX)) of the application, and the maximum allowable junction
temperature (TJ(MAX)):
ΔTJ = TJ(MAX)− TA(MAX)
(2)
The maximum allowable value for junction to ambient Ther-
mal Resistance, θJA, can be calculated using the formula:
θJA = ΔTJ / PD(MAX)
(3)
20183035
FIGURE 3. θJA vs Copper (1 Ounce) Area for TO-263
package
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for θJA for the TO-263 package mounted to a two-layer
PCB is 32°C/W.
Figure 4 shows the maximum allowable power dissipation for
TO-263 packages for different ambient temperatures, assum-
ing θJA is 35°C/W and the maximum junction temperature is
125°C.
HEATSINKING TO-263 PACKAGE
The TO-263 and the TO-263 THIN packages use the copper
plane on the PCB as a heatsink. The tab, or DAP, of these
packages are soldered to the copper plane for heat sinking.
Figure 3 shows a curve for the θJA of TO-263 package for
different copper area sizes, using a typical PCB with 1 ounce
copper and no solder mask over the copper area for heat
sinking.
www.DataSheet.in
20183036
FIGURE 4. Maximum Power Dissipation vs Ambient
Temperature for TO-263 Package
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| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet LP38512-1.8.PDF ] | |
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