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PDF LPS001D Data sheet ( Hoja de datos )
| Número de pieza | LPS001D | |
| Descripción | MEMS Pressure Sensor | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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DataSheet.in
LPS001D
MEMS pressure sensor:
300 - 1100 mbar absolute digital output barometer
Preliminary data
Features
■ Piezoresistive pressure sensor
■ Very low power consumption
■ 300 -1100 mbar absolute pressure range
■ 0.1 mbar resolution
■ Embedded offset and span temperature
compensation
■ Embedded 16-bit ADC
■ SPI and I2C interfaces
■ Supply voltage: 2.2 V to 3.6 V
■ 1.8 V compatible IOs
■ High shock survivability (10000 g)
■ Small, thin package
■ ECOPACK® lead-free compliant
Applications
■ Altimeter and barometer for portable devices
■ GPS applications
■ Weather station equipment
■ Sport watches
Description
The LPS001D is an ultra-compact absolute
piezoresistive pressure sensor. It includes a
monolithic sensing element and an IC interface
capable of taking information from the sensing
element and providing a digital signal to external
applications.
HLGA 5x5 16L
The sensing element consists of a suspended
membrane within a single monosilicon substrate,
manufactured using a dedicated process
developed by STMicroelectronics called
“VENSENS”.
The VENSENS process allows the construction of
a monosilicon membrane above an air cavity with
a controlled gap and defined pressure. The
membrane is very small compared to traditional
silicon micromachined membranes. Membrane
breakage is prevented by intrinsic mechanical
stoppers.
The IC interface is manufactured using a standard
CMOS process that allows a high level of
integration, to design a dedicated circuit which is
trimmed to better match the sensing element
characteristics. The LPS001D is available in a
small plastic land grid array (LGA) package, and
is guaranteed to operate over a temperature
range extending from -40 °C to +85 °C. The
package is holed to allow external pressure to
reach the sensing element.
Table 1. Device summary
Order code
Temperature range [°C]
LPS001DL
-40 to +85
LPS001DLTR
-40 to +85
Package
HLGA 5x5 16L
HLGA 5x5 16L
Packing
Tray
Tape and reel
August 2010
Doc ID 17726 Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/32
www.st.com
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DataSheet.in
LPS001D
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Interrupt generation block and output pressure data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
LPS001D electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Multiple bytes SPI read protocol (2 byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Multiple bytes SPI write protocol (2 byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SPI read protocol in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
HLGA 5x5 16L: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . 30
Doc ID 17726 Rev 1
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DataSheet.in
LPS001D
4 Functionality
Functionality
The LPS001D is a high-resolution, digital-output pressure sensor packaged in an LGA holed
package. The complete device includes a sensing element based on a piezoresistive
Wheatstone bridge approach, and an IC interface capable of providing information from the
sensing element to external applications as a digital signal.
4.1 Sensing element
An ST proprietary process is used to obtain a monosilicon µ-sized membrane for MEMS
pressure sensors, without requiring substrate-to-substrate bonding.
When pressure is applied, membrane deflection induces an imbalance in the Wheatstone
bridge piezoresistors, whose output signal is converted by the IC interface.
Intrinsic mechanical stoppers prevent breakage in case of pressure overstress, ensuring
measurement repeatability.
The pressure inside the buried cavity under the membrane is constant and controlled by
process parameters.
To be compatible with traditional packaging technologies, a silicon holed cap is placed on
top of the sensing element. During the moulding phase, this opening is covered by
dedicated protection to avoid membrane blocking.
The package design leaves the holed cap exposed, allowing ambient pressure to reach the
sensing element.
4.2
IC interface
Figure 3. Interrupt generation block and output pressure data.
Delta Pressure
DELTA_P_H & DELTA_P_L
Output Pressure
PRESS_OUT_H & PRESS_OUT_L
-+
+
-
High Press Int
Press Threshold
Reference Press
Low Press Int
Press Threshold
Reference Pressure
REF_P_H & REF_P_L
-1
Positive
Pressure Threshold
THS_P_H & THS_P_L
Negative
-
+
Low Pressure
Interrupt
INT_SOURCE (PL)
High Pressure
Interrupt
INT_SOURCE (PH)
AM07301v1
Doc ID 17726 Rev 1
11/32
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