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Número de pieza | ESDR0502N | |
Descripción | Ultra Low Capacitance ESD Protection Array | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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Ultra Low Capacitance ESD
Protection Array for High
Speed Data Line Protection
The ESDR0502N ultra low capacitance TVS array is designed to
protect high speed data lines from ESD. Ultra−low capacitance and
high level of ESD protection makes this device well suited for use in
USB 2.0 applications.
Features
• Low Capacitance (0.3 pF Typical Between I/O Lines and Ground)
• IEC 61000−4−2 Level 4
• UL Flammability Rating of 94 V−0
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• High Speed Communication Line Protection
• USB 2.0 High Speed Data Line and Power Line Protection
• Monitors and Flat Panel Displays
• MP3
• Gigabit Ethernet
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −40 to +125 °C
Peak Power Dissipation
8x20 ms @ TA = 25°C (Note 1)
Ppk 100 W
Peak Power Current
8x20 ms @ TA = 25°C (Note 1)
Ipp 3.0 A
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
IEC 61000−4−2 Contact (ESD)
ESD
8.0 kV
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse (pin 6 to pin 1).
http://onsemi.com
6
14
5
UDFN6
MU SUFFIX
CASE 517AA
MARKING DIAGRAM
DM
G
D = Specific Device Code*
(Rotated 90° clockwise)
M = Date Code & Assembly Location
G = Pb−Free Device
PINOUT
GND
NC
NC
16
25
34
(Top View)
VBUS
D+
D−
ORDERING INFORMATION
Device
Package Shipping†
ESDR0502NMUTBG UDFN6
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
November, 2009 − Rev. 0
1
Publication Order Number:
ESDR0502N/D
1 page ESDR0502N
PACKAGE DIMENSIONS
www.DataSheet4U.com
UDFN6, 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE C
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉÉÉ
2X TOP VIEW
0.10 C
0.10 C
10X 0.08 C
SIDE VIEW
13
A
B
E
(A3)
A
EDGE OF PACKAGE
L1
DETAIL A
Bottom View
(Optional)
ÉÉÉÉÉÉEXPOSED Cu
MOLD CMPD
A3
A1 DETAIL B
Side View
(Optional)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
L2 0.40 0.50
A1
5X L
SEATING
PLANE
C
MOUNTING FOOTPRINT*
6X
0.42
6X
0.22
L2
6X b
0.10 C A B
0.05 C NOTE 3
6
4
e
BOTTOM VIEW
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ESDR0502N/D
5 Page |
Páginas | Total 5 Páginas | |
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