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PDF ESD9B5.0ST5G Data sheet ( Hoja de datos )
| Número de pieza | ESD9B5.0ST5G | |
| Descripción | Transient Voltage Suppressors Micro-Packaged Diodes | |
| Fabricantes | ON Semiconductor | |
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ESD9B5.0ST5G
www.DataSheet4U.com
Transient Voltage
Suppressors
Micro-Packaged Diodes for ESD Protection
The ESD9B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space comes at a premium.
http://onsemi.com
Specification Features
•ăLow Capacitance 15 pF
•ăLow Clamping Voltage
•ăSmall Body Outline Dimensions: 0.039″ x 0.024″ (1.0mm x 0.60mm)
•ăLow Body Height: 0.016″ (0.4 mm)
•ăStand-off Voltage: 5.0 V
•ăLow Leakage
•ăResponse Time is < 1 ns
•ăIEC61000-4-2 Level 4 ESD Protection
•ăIEC61000-4-4 Level 4 EFT Protection
•ăThis is a Pb-Free Device
SOD-923
CASE 514AB
MARKING DIAGRAM
EM
Mechanical Characteristics
CASE: Void‐free, transfer‐molded, thermosetting plastic
Epoxy Meets UL 94 V-0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
E = Specific Device Code
M Date Code
ORDERING INFORMATION
Device
Package
Shipping†
MAXIMUM RATINGS
Rating
IEC 61000-4-2 (ESD)
IEC 61000-4-4 (EFT)
Symbol
Contact
Air
Value
±8.0
±15
40
Unit
kV
A
ESD9B5.0ST5G SOD-923 8000/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Power Dissipation on FR-5 Board
(Note 1) @ TA = 25°C
Thermal Resistance, Junction-to-Ambient
Junction and Storage Temperature Range
Lead Solder Temperature - Maximum
(10 Second Duration)
°PD°
RqJA
TJ, Tstg
TL
300 mW
400 °C/W
-55 to +150 °C
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR-5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
©Ă Semiconductor Components Industries, LLC, 2008
April, 2008 - Rev. 2
1
Publication Order Number:
ESD9B5.0S/D
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet ESD9B5.0ST5G.PDF ] | |
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