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PDF PTN3331 Data sheet ( Hoja de datos )
| Número de pieza | PTN3331 | |
| Descripción | High speed differential line driver | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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PTN3331
High speed differential line driver
Rev. 01 — 06 August 2002
www.DataSheet4U.com
Product data
1. Description
The PTN3331 is a differential line driver that implements the electrical characteristics
of Low-Voltage Differential Signaling (LVDS) that meets or exceeds the requirements
of the ANSI TIA/EIA-644 Standard. LVDS is used to achieve higher data rates on
commonly used media. LVDS overcomes the limitations of achievable slew rates and
EMI restrictions of previous differential signaling techniques. The PTN3331 operates
at 3.3 volt supply levels and current mode output drivers. The output drivers will
deliver a minimum of 247 mV into a 100 Ω load when enabled.
The intended application of this device is for point-to-point baseband transmission
rates over a controlled impedance media of approximately 100 Ω. The maximum rate
and distance of data transfer is dependent upon the attenuation characteristics of the
media selected and the noise coupling to the environment.
The PTN3331 is designed to function over the full industrial temperature range of
−40 °C to +85 °C.
2. Features
s Meets or exceeds the requirements of ANSI TIA/EIA-644 Standard
s Low-Voltage Differential Signaling with output voltage of 350 mV across a 100 Ω
load
s 300 ps maximum channel to channel output skew
s 500 ps typical output voltage rise and fall times
s Power dissipation of 100 mW typical at 200 MHz
s Driver at high impedance when disabled or with VCC = 0 V
s 5 volt tolerant inputs with Low Voltage TTL (LVTTL) logic input levels
s Pin-compatible with AM26LS31 and SN65LVDS31.
3. Applications
s Low voltage, low EMI, high speed differential signaling
s Point-to-point high speed data transmission
s High performance switches and routers.
1 page  
Philips Semiconductors
10. Static characteristics
Table 6: DC electrical characteristics
Over recommended operating conditions, unless otherwise noted.
Symbol Parameter
Conditions
VOD
∆VOD
differential output voltage
change in differential voltage
magnitude between logic states
RL = 100 Ω
See Figure 4.
VOC(SS)
Steady-state common-mode output
voltage
∆VOC(SS)
Change in steady-state
common-mode output voltage
between logic states
VOC(PP)
Peak-to-peak common-mode output
voltage
ICC Supply current
VI = 0.8 or 2 V;
enabled, no load
VI = 0.8 or 2 V;
enabled, RL = 100 Ω
VI = 0 V or VCC;
disabled
IIH
IIL
IOS
IOZ
IO(OFF)
Ci
HIGH-level input current
LOW-level input current
Output short circuit current
High-impedance output current
Power-off output current
Input capacitance
VIH = 2 V
VIL = 0.8 V
VO(Y) or VO(Z) = 0 V
VOD = 0 V or 2.4 V
VCC = 0 V; VO = 2.4 V
[1] All typical values are at Tamb = 25 °C and VCC = 3.3 V.
PTN3331www.DataSheet4U.com
High speed differential line driver
Min
247
−50
1.125
−50
Typ[1]
340
-
1.2
-
Max
454
+50
1.375
+50
Unit
mV
mV
V
mV
- 50 150 mV
- 22 30 mA
- 25 35 mA
-
0.25 1
mA
- 4 20 µA
-
0.1 10
µA
- −4 −24 mA
- ±1 - µA
1-
−1 µA
- 3 - pF
9397 750 08339
Product data
Rev. 01 — 06 August 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
5 of 14
5 Page 
Philips Semiconductors
PTN3331www.DataSheet4U.com
High speed differential line driver
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 220 °C for thick/large
packages, and below 235 °C small/thin packages.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
• Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
9397 750 08339
Product data
Rev. 01 — 06 August 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
11 of 14
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| PDF Descargar | [ Datasheet PTN3331.PDF ] | |
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