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PDF BUK624R5-30C Data sheet ( Hoja de datos )
| Número de pieza | BUK624R5-30C | |
| Descripción | N-channel TrenchMOS Intermediate Level FET | |
| Fabricantes | NXP Semiconductors | |
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BUK624R5-30C
www.DataSheet4U.com
N-channel TrenchMOS intermediate level FET
Rev. 01 — 21 June 2010
Objective data sheet
1. Product profile
1.1 General description
Intermediate level gate drive N-channel enhancement mode Field-Effect Transistor (FET)
in a plastic package using advanced TrenchMOS technology. This product has been
designed and qualified to the appropriate AEC Q101 standard for use in high performance
automotive applications.
1.2 Features and benefits
AEC Q101 compliant
Suitable for intermediate level gate
drive sources
Suitable for thermally demanding
environments due to 175 °C rating
1.3 Applications
12 V Automotive systems
HVAC
Motors, lamps and solenoid control
Start-Stop micro-hybrid applications
Ultra high performance power
switching
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter
Conditions
Min Typ Max Unit
VDS
drain-source
Tj ≥ 25 °C; Tj ≤ 175 °C
voltage
- - 30 V
ID
drain current
VGS = 10 V; Tmb = 25 °C;
[1] - - 75 A
see Figure 1
Ptot total power Tmb = 25 °C; see Figure 2
dissipation
- - 158 W
Static characteristics
RDSon
drain-source
VGS = 10 V; ID = 25 A; Tj = 25 °C;
on-state resistance see Figure 5
-
3.8 4.5 mΩ
Avalanche ruggedness
EDS(AL)S
non-repetitive
drain-source
avalanche energy
ID = 75 A; Vsup ≤ 30 V;
RGS = 50 Ω; VGS = 10 V;
Tj(init) = 25 °C; unclamped
- - 330 mJ
[1] Continuous current is limited by package.
1 page  
NXP Semiconductors
www.DataSheet4U.com
BUK624R5-30C
N-channel TrenchMOS intermediate level FET
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
Conditions
see Figure 3
vertical in free air
Min Typ Max Unit
- - 0.95 K/W
- 60 - K/W
10
Zth (j-mb)
(K/W)
1
10-1
10-2
δ = 0.5
0.2
0.1
0.05
0.02
single shot
003aad070
P δ = tp
T
tp t
T
10-3
10-6
10-5
10-4
10-3
10-2
10-1 tp (s)
1
Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse duration
BUK624R5-30C
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 21 June 2010
© NXP B.V. 2010. All rights reserved.
5 of 12
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NXP Semiconductors
www.DataSheet4U.com
BUK624R5-30C
N-channel TrenchMOS intermediate level FET
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BUK624R5-30C
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 21 June 2010
© NXP B.V. 2010. All rights reserved.
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