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PDF NTK3043N Data sheet ( Hoja de datos )
| Número de pieza | NTK3043N | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NTK3043N
Power MOSFET
20 V, 285 mA, N−Channel with ESD
Protection, SOT−723
Features
• Enables High Density PCB Manufacturing
• 44% Smaller Footprint than SC−89 and 38% Thinner than SC−89
• Low Voltage Drive Makes this Device Ideal for Portable Equipment
• Low Threshold Levels, VGS(TH) < 1.3 V
• Low Profile (< 0.5 mm) Allows It to Fit Easily into Extremely Thin
Environments such as Portable Electronics.
• Operated at Standard Logic Level Gate Drive, Facilitating Future
Migration to Lower Levels Using the Same Basic Topology.
• This is a Pb−Free Device
Applications
• Interfacing, Switching
• High Speed Switching
• Cellular Phones, PDA’s
www.DataSheet4U.com
http://onsemi.com
V(BR)DSS
20 V
RDS(on) TYP
1.5 W @ 4.5 V
2.4 W @ 2.5 V
5.1 W @ 1.8 V
6.8 W @ 1.65 V
ID Max
285 mA
SOT−723 (3−LEAD)
3
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
tv5s
Steady
State
tv5s
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
TA = 25°C
TA = 85°C
TA = 25°C
VDSS
VGS
ID
PD
ID
PD
20 V
±10 V
255
185 mA
285
440
mW
545
210
mA
155
310 mW
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IDM
TJ,
TSTG
IS
TL
400
−55 to
150
286
260
mA
°C
mA
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size.
1
1 − Gate
2 − Source
3 − Drain
Top View
2
MARKING DIAGRAM
CASE 631AA
SOT−723
KA M
1
KA = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
Shipping†
NTK3043NT1G SOT−723 4000/Tape & Reel
(Pb−Free)
4 mm Pitch
NTK3043NT5G SOT−723 8000/Tape & Reel
(Pb−Free)
2 mm Pitch
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 2
1
Publication Order Number:
NTK3043N/D
1 page  
NTK3043N
PACKAGE DIMENSIONS
SOT−723
CASE 631AA−01
ISSUE B
www.DataSheet4U.com
−X−
D
b1
−Y−
3
12
E
A
L HE
b 2X
e 0.08 (0.0032) X Y
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.45 0.50 0.55
b 0.15 0.21 0.27
b1 0.25 0.31 0.37
C 0.07 0.12 0.17
D 1.15 1.20 1.25
E 0.75 0.80 0.85
e 0.40 BSC
H E 1.15 1.20 1.25
L 0.15 0.20 0.25
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
INCHES
MIN NOM MAX
0.018 0.020 0.022
0.0059 0.0083 0.0106
0.010 0.012 0.015
0.0028 0.0047 0.0067
0.045 0.047 0.049
0.03 0.032 0.034
0.016 BSC
0.045 0.047 0.049
0.0059 0.0079 0.0098
SOLDERING FOOTPRINT*
0.40
0.0157
0.40
0.0157
1.0
0.039
0.40
0.0157
0.40
0.0157
0.40
0.0157
SCALE 20:1
ǒ mm Ǔ
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NTK3043N.PDF ] | |
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