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PDF STPS1L30MF Data sheet ( Hoja de datos )
| Número de pieza | STPS1L30MF | |
| Descripción | Low drop power Schottky rectifier | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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STPS1L30MF
Low drop power Schottky rectifier in flat package
Main product characteristics
IF(AV)
VRRM
Tj (max)
www.DataSheet4U.VcoFm(max)
1A
30 V
150° C
0.39 V
Features and benefits
■ Very low profile package: 0.85 mm
■ Backward compatible with standard STmite
footprint
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
■ Low forward voltage drop for higher efficiency
and extended battery life
■ Low thermal resistance
■ Avalanche capability specified
Order Code
Part number
STPS1L30MF
Marking
F1L3
A
K
STmite flat
(DO222-AA)
Description
Single Schottky rectifier suited for switch mode
power supplies and high frequency DC to DC
converters.
Packaged in STmite flat, this device is intended
for use in very low voltage, high frequency
inverters, free wheeling and polarity protection
applications. Due to the very small size of the
package this device fits battery powered
equipment (cellular, notebook, PDA’s, printers) as
well as chargers and PCMCIA cards.
Table 1. Absolute ratings (limiting values)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IF(RMS) RMS forward voltage
IF(AV) Average forward current
Tc = 140° C δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
PARM Repetitive peak avalanche power
tp = 1 µs Tj = 25° C
Tstg Storage temperature range
Tj Maximum operating junction temperature(1)
dV/dt Critical rate of rise of reverse voltage (rated VR, Tj = 25° C)
1.
d----P-----t--o----t
dTj
<
------------1-------------
Rth(j – a)
condition to avoid thermal runaway for a diode on its own heatsink
Value
30
2
1
50
1200
-65 to + 150
150
10000
Unit
V
A
A
A
W
°C
°C
V/µs
August 2006
Rev 1
1/7
www.st.com
1 page  
STPS1L30MF
2 Package information
Package information
Table 4. STmite flat dimensions
Dimensions
Ref. Millimeters
Inches
www.DataSheet4U.com
Min. Typ. Max. Min. Typ. Max.
L1 A 0.80 0.85 0.95 0.031 0.033 0.037
E1
L L2
b 0.40 0.55 0.65 0.016 0.022 0.026
Db
b2 0.70 0.85 1.00 0.027 0.033 0.039
b2
c 0.10 0.15 0.25 0.004 0.006 0.009
L3
E
c
D 1.75 1.90 2.05 0.069 0.075 0.081
E 3.60 3.80 3.90 0.142 0.150 0.154
A E1 2.80 2.95 3.10 0.110 0.116 0.122
L 0.50 0.55 0.80 0.020 0.022 0.031
L1 2.10 2.40 2.60 0.083 0.094 0.102
L2 0.45 0.60 0.75 0.018 0.024 0.030
L3 0.20 0.35 0.50 0.008 0.014 0.020
Figure 12. STmite flat recommended footprint (all dimensions in mm)
0.85 0.63 2.00 0.65
0.65 0.95 1.95
4.13
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5/7
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| PDF Descargar | [ Datasheet STPS1L30MF.PDF ] | |
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