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PDF AMMP-6222 Data sheet ( Hoja de datos )
| Número de pieza | AMMP-6222 | |
| Descripción | 7 to 21 GHz GaAs High Linearity LNA | |
| Fabricantes | AVAGO TECHNOLOGIES | |
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AMMP-6222
7 to 21 GHz GaAs High Linearity LNA in SMT Package
Data Sheet
www.DataSheet4U.com
Description
Avago Technologies’ AMMP-6222 is an easy-to-use
broadband, high gain, high linearity Low Noise Amplifier
in a surface mount package. The wide band and
unconditionally stable performance makes this MMIC
ideal as a primary or sub-sequential low noise block or a
transmitter or LO driver. The MMIC has 3 gain stages and
a selectable pin to switch between low and high current,
corresponding with low and high output power and
linearity. In the high current, high output power state, it
requires a 4V, 120mA supply. In the low current, low output
power state, the supply is reduced to 4V, 95mA. Since this
MMIC covers several bands, it can reduce part inventory
and increase volume purchase options The MMIC is
fabricated using PHEMT technology. The surface mount
package eliminates the need of “chip & wire” assembly
for lower cost. This MMIC is fully SMT compatible with
backside grounding and I/Os.
Pin Connections (Top View)
123
100pF
84
76
5
Top view
Package base: GND
Pin Function
1
2 Vdd
3
4 RFout
5 Current Sel
6
7
8 RFin
Features
• Surface Mount Package, 5.0 x 5.0 x 1.25 mm
• Single Positive Bias Pin
• Selectable Output Power / Linearity
• No Negative Gate Bias
Specifications (Vdd = 4.0V, Idd = 120mA)
• RF Frequencies: 7 - 21 GHz
• High Output IP3: 29dBm
• High Small-Signal Gain: 24dB
• Typical Noise Figure: 2.3dB
• Input, Output Match: -10dB
Applications
• Microwave Radio systems
• Satellite VSAT, DBS Up/Down Link
• LMDS & Pt-Pt mmW Long Haul
• Broadband Wireless Access
(including 802.16 and 802.20 WiMax)
• WLL and MMDS loops
• Commercial grade military
Note:
1. This MMIC uses depletion mode pHEMT devices.
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (60V)
ESD Human Body Model (150V)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control
1 page  
AMMP-6222 Typical Performance for High Current, High Output Power Configuration (Cont)
(TA = 25°C, Vdd=4V, Idd=120mA, Zin = Zout = 50 W unless noted)
www.DataSheet4U.com
25
20
15
10
5
0
6
3V
4V
5V
8 10 12 14 16 18 20 22
Frequency (GHz)
Figure 13a. Output P1dB over Vdd
35
30
25
20
15
10
5
0
6
3V
4V
5V
8 10 12 14 16 18 20 22
Frequency (GHz)
Figure 14a. Output IP3 over Vdd
35
30
25
20
15
10
5
5
25C
85C
-40C
10 15 20
Frequency (GHz)
Figure 15a. Small-signal Gain Over Temp
0
-5
-10
-15
-20
-25
5
25C
-40C
85C
10 15 20
Frequency (GHz)
Figure 17a. Input Return Loss Over Temp
25
25
8
-40C
6 25C
85C
4
2
0
6 8 10 12 14 16 18 20 22
Frequency (GHz)
Figure 16a. Noise Figure Over Temp
0
25C
-5 85C
-40C
-10
-15
-20
5
10 15 20
Frequency (GHz)
Figure 18a. Output Return Loss Over Temp
25
5 Page 
Manual Assembly
• Follow ESD precautions while handling packages.
• Handling should be along the edges with tweezers.
• Recommended attachment is conductive solder paste.
Please see recommended solder reflow profile. Neither
Conductive epoxy or hand soldering is recommended.
• Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
• Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
• Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
300
Peak = 250 ± 5˚C
250
Melting point = 218˚C
200
150
100
50
0 Ramp 1 Preheat Ramp 2 Reflow
0 50 100 150 200
Seconds
Cooling
250
300
www.DataSheet4U.com
A properly designed solder screen or stencil is required to
ensure optimum amount of solder paste is deposited onto
the PCB pads. The recommended stencil layout is shown
in Figure 23. The stencil has a solder paste deposition
opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The most commonly used solder reflow method is
accomplished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated reflow
processes is shown in Figure 24. This profile is designed
to ensure reliable finished joints. However, the profile
indicated in Figure 14 will vary among different solder
pastes from different manufacturers and is shown here for
reference only.
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
Package, Tape & Reel, and Ordering Information
AMMP-6222 Part Number Ordering Information
Part Number
AMMP-6222-BLKG
AMMP-6222-TR1G
AMMP-6222-TR2G
Devices Per Container
10
100
500
Container
Antistatic bag
7” Reel
7” Reel
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet AMMP-6222.PDF ] | |
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