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PDF AMMP-5620 Data sheet ( Hoja de datos )
| Número de pieza | AMMP-5620 | |
| Descripción | 6 - 20 GHz High Gain Amplife | |
| Fabricantes | AVAGO TECHNOLOGIES | |
| Logotipo |  |
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AMMP-5620
6 – 20 GHz High Gain Amplifier in SMT Package
Data Sheet
www.DataSheet4U.com
Description
The AMMP-5620 MMIC is a GaAs wide-band amplifier in
a surface mount package designed for medium output
power and high gain over the 6-20 GHz frequency range.
The 3 cascaded stages provide high gain while the single
bias supply offers ease of use. It is fabricated using a
PHEMT integrated circuit process. The RF input and
output ports have matching circuitry for use in 50-ohms
environments. The MMIC is a cost effective alternative
to hybrid (discrete FET) amplifiers that require complex
tuning and assembly processes.
Pin Connections (Top View)
Vd 0.1uF
Features
• Surface Mount Package, 5.0 x 5.0 x 1.25 mm
• Wide Frequency Range 6-20 GHz
• High Gain: 17.5 dB Typical
• Medium Output P1dB: 14.8 dBm Typical
• Input and Output Return Loss: <-10 dB Typical
• 50 Ohm Input and Output Match
• Single Supply Bias: 5V @ 95 mA Typical
Applications
• Generalpurpose,widebandamplifierincommunication
systems or microwave instrumentation
• High Gain Amplifier
123
100pF
RFin RFout
765
AMMP-5620
Note: Package base: GND
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (= 40 V)
ESD Human Body Model (= 150 V)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control
1 page  
AMMP-5620 Typical Performance vs. Temperature (Vdd = 5V, Zin = Zo = 50W)
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20
16
12
8
4
0
4 7 10 13 16
Frequency (GHz)
Figure 14. Gain and Temperature
-40 C
25 C
85 C
19 22
0
-10
-20
-30
-40
-50
-60
-70
4
7 10 13 16
Frequency (GHz)
Figure 15. Isolation and Temperature
-40 C
25 C
85 C
0
-10
-20
-40 C
-30
25 C
19 22
-40
4
85 C
7 10 13 16 19 22
Frequency (GHz)
Figure 16. Input Return Loss and Temperature
0
-5
-10
-15
-20
-25
-30
-35
4
-40 C
25 C
85 C
7 10 13 16 19 22
Frequency (GHz)
8
7
6
5
4
3
2 -40 C
25 C
1 85 C
0
4 7 10 13 16 19 22
Frequency (GHz)
20
16
12
8
-40 C
4 25 C
85 C
0
4 7 10 13 16 19 22
Frequency (GHz)
Figure 17. Output Return Loss and Temperature Figure 18. Noise Figure and Temperature
Figure 19. P1dB and Temperature
100
95
90
85 -40 C
25 C
85 C
80
3 3.5 4 4.5 5 5.5 6
Vdd (V)
Figure 20. Idd vs. Vdd
Note: These measurements are obtained using demo board with 50 Ohm traces at input and output. Aspects of the amplifier performance may be
improved over a narrower bandwidth by application of additional conjugate, linearity or low noise matching.
5 Page 
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 26. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The combined PCB and stencil layout is shown in Figure
27.
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Figure 25. Suggested PCB Land Pattern and Stencil Layout
Figure 26. Stencil Outline Drawing (mm)
11
Figure 27. Combined PCB and Stencil Layout
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet AMMP-5620.PDF ] | |
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