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PDF LT3482 Data sheet ( Hoja de datos )

Número de pieza LT3482
Descripción 90V Boost DC/DC Converter
Fabricantes Linear Technology 
Logotipo Linear Technology Logotipo



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FEATURES
High Output Voltage: Up to 90V
Integrated Schottky Diodes
48V, 280mA Internal Switch
High Side APD Current Monitor
Adjustable Switching Frequency: 650kHz or 1.1MHz
Wide VIN Range: 2.5V to 16V
Surface Mount Components
Low Shutdown Current: <1µA
Soft-Start
Internal Compensation
CTRL Pin Allows Output Adjustment with No Polarity
Inversion
3mm × 3mm 16-Lead QFN Package
U
APPLICATIO S
APD Bias
PIN Diode Bias
Optical Receivers and Modules
Fiber Optic Network Equipment
LT3482www.DataSheet4U.com
90V Boost DC/DC
Converter with APD
Current Monitor
DESCRIPTIO
The LT®3482 is a fixed frequency current mode step-up
DC/DC converter with voltage doubler designed to bias
avalanche photodiodes (APDs) in optical receivers. It can
provide up to 90V output. The LT3482 features high side
APD current monitoring with better than 10% relative ac-
curacy over the entire temperature range. The integrated
power switch, Schottky diodes and APD current monitor
allow a small converter footprint and low solution cost.
Constant switching frequency results in predictable output
noise that is easy to filter. The inductor-based topology
ensures an input free from switching noise. An integrated
high side current monitor produces a current proportional
to APD current with better than 10% relative accuracy
over four decades of dynamic range in the input range of
250nA to 2.5mA. This current can be used as a reference
to provide a digitally programmed output voltage via the
CTRL pin. The LT3482 is available in the tiny footprint
(3mm × 3mm) 16-lead QFN package.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATIO
VIN
5V
OFF ON
10µH
0.1µF
1µF SW PUMP
VIN MONIN
fSET LT3482
SHDN
CTRL
GND
VOUT2
VOUT1
FB
0.47µF
0.47µF
MON
APD 85V
AT 2.5mA
10nF
10k
0.1µF
0.1µF 1M
14k
VAPD
RIPPLE
100mV/DIV
3482 TA01a
Output Voltage Ripple
500ns/DIV
3482 TA01b
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LT3482 pdf
LT3482www.DataSheet4U.com
PI FU CTIO S
APD (Pin 2): Connect APD cathode to this pin.
MONIN (Pin 3): Current Monitor Power Supply Pin. An
external lowpass filter can be included here to further
reduce supply voltage ripple.
VOUT2 (Pin 4): Voltage Doubler Output Pin. Put a 50V
rated capacitor between this pin and VOUT1. Tie a resistor
divider to the FB pin and GND.
VOUT1 (Pin 5): Boost Output Pin. Put a capacitor between
this pin and the GND plane. Minimize the length of the
trace to the capacitor.
PUMP (Pin 6): Charge Pump Pin. Put a 50V rating bypass
capacitor between SW and PUMP to form a complete volt-
age doubler with the internal integrated Schottky diodes.
Minimize trace length to the capacitor.
SW (Pins 7, 8): Switch Pin. Minimize the trace length on
this pin to reduce EMI.
GND (Pins 9, 10): Ground. Pins connected internally. For
best performance, connect both pins to board ground.
VIN (Pin 11): Input Supply Pin. This pin must be locally
bypassed.
SHDN (Pin 12): Shutdown Pin. Tie to 1.5V or higher to
enable device; 0.4V or less to disable device. This pin also
functions as soft-start between 1.5V and 2V.
CTRL (Pin 13): Internal Reference Override Pin. This allows
the FB voltage to be externally set between 0V and 1.2V.
Tie this pin higher than 1.5V to use the internal reference
of 1.235V.
FB (Pin 14): Feedback Pin. Connect the output resistor
divider tap here.
fSET (Pin 15): Oscillator Frequency Selection Pin. Tie this
pin to above 1.5V or higher to select the higher switching
frequency of 1.1MHz. For lower switching frequency, tie
to GND.
MON (Pin 16): Current Monitor Output Pin. It sources a
current equal to 20% of the APD current and converts to
a reference voltage through an external resistor.
Exposed Pad (Pin 17): GND. This pin must be soldered
to the PCB.
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LT3482 arduino
PACKAGE DESCRIPTIO
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
LT3482www.DataSheet4U.com
0.70 ±0.05
3.50 ± 0.05
1.45 ± 0.05
2.10 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ± 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
0.40 ± 0.10
1.45 ± 0.10
(4-SIDES)
1
2
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
(UD16) QFN 0904
0.25 ± 0.05
0.50 BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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