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Número de pieza | APTGT50TDU170PG | |
Descripción | Triple Dual Common Source Trench Field Stop IGBT Power Module | |
Fabricantes | Microsemi Corporation | |
Logotipo | ||
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Triple Dual Common Source
Trench + Field Stop IGBT®
Power Module
C1
G1
C3
G3
C5
G5
E1 E3
E1/E2
E2 E4
E3/E4
E5
E6
E5/E6
G2
C2
G4
C4
G6
C6
C1 C3
C5
G1 G3 G5
E1/E2 E1 E3/E4 E3 E5/E6 E5
E2 E4 E6
G2 G4 G6
C2 C 4 C 6
Absolute maximum ratings
Symbol
Parameter
VCES Collector - Emitter Breakdown Voltage
IC Continuous Collector Current
ICM
VGE
PD
RBSOA
Pulsed Collector Current
Gate – Emitter Voltage
Maximum Power Dissipation
Reverse Bias Safe Operating Area
VCES = 1700V
IC = 50A @ Tc = 80°C
Application
• AC Switches
• Switched Mode Power Supplies
• Uninterruptible Power Supplies
Features
• Trench + Field Stop IGBT® Technology
- Low voltage drop
- Low tail current
- Switching frequency up to 20 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- Avalanche energy rated
- RBSOA and SCSOA rated
• Kelvin emitter for easy drive
• Very low stray inductance
- Symmetrical design
- Lead frames for power connections
• High level of integration
• Kelvin emitter for easy drive
Benefits
• Stable temperature behavior
• Very rugged
• Solderable terminals for easy PCB mounting
• Direct mounting to heatsink (isolated package)
• Low junction to case thermal resistance
• Easy paralleling due to positive TC of VCEsat
• Very low (12mm) profile
• Each leg can be easily paralleled to achieve a dual
common source configuration of three times the
current capability
• RoHS Compliant
TC = 25°C
TC = 80°C
TC = 25°C
TC = 25°C
Tj = 125°C
Max ratings
1700
70
50
100
±20
310
100A @ 1600V
Unit
V
A
V
W
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1-5
1 page APTGT50TDU170PGwww.DataSheet4U.com
Operating Frequency vs Collector Current
30
25
20 ZVS
15
ZCS
VCE=900V
D=50%
RG=10 Ω
TJ=125°C
TC=75°C
10
5 hard
switching
0
0 10 20 30 40 50 60 70 80
IC (A)
100
90
80
70
60
50
40
30
20
10
0
0
Forward Characteristic of diode
TJ =25°C
TJ= 125°C
TJ=125°C
0.5 1 1.5 2 2.5
VF (V)
3
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.8
0.7 0.9
Diode
0.6
0.5 0.7
0.4 0.5
0.3 0.3
0.2
0.1 0.1
0 0.05
0.00001
0.0001
Single Pulse
0.001
0.01
0.1
rectangular Pulse Duration (Seconds)
1
10
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
www.microsemi.com
5-5
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet APTGT50TDU170PG.PDF ] |
Número de pieza | Descripción | Fabricantes |
APTGT50TDU170P | Triple Dual Common Source Trench IGBT Power Module | Advanced Power Technology |
APTGT50TDU170PG | Triple Dual Common Source Trench Field Stop IGBT Power Module | Microsemi Corporation |
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