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PDF MX887P Data sheet ( Hoja de datos )
| Número de pieza | MX887P | |
| Descripción | uPower Hall-Effect Switch | |
| Fabricantes | Clare | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MX887P (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Features
• μPower Operation (15 μW typical at 25°C)
• Omnipolar (switches with N or S pole)
• 2.5V to 5.5V Operation
• CMOS Push-Pull Output
• Ultra Low Offset Canceling Amplifiers Provide
Sensitive, Accurate, Stable Switching Points and
Immunity to Mechanical Stress
• Solid State Reliability
• Operating Temperature Range: -40°C to +85°C
• RoHS Compliant TSOT-23 3-Lead Package
Applications
• Handheld Portable Devices
• White Goods
• Automotive - Body Systems
• Security Systems
• High Reliability Reed Switch Replacement
MX887P
μPower Hawlwl-wE.DfafetacShteSet4wU.ictocmh
Description
The MX887P integrated Hall-Effect switch targets the
requirements of low-power portable devices with
battery operating voltages from 2.5V to 5.5V. On-chip
power management circuitry reduces the effective
average current to just 5μA at VSUPPLY = 3VDC .
The switch output will transition to the Ground
potential when either a north or south magnetic pole is
applied. The removal of a magnetic field will transition
the switch to the VSUPPLY potential. Emulating the
behavior of a traditional reed switch, together with the
advantages of high integration and solid state
reliability, makes the MX887P an ideal replacement in
low-power portable device applications.
Pb
RoHS
2002/95/EC
e3
Figure 1. Functional Block Diagram
Ordering Information
Part
MX887PHTTR
Description
TSOT-23 3L Tape & Reel (3000/Reel)
VSUPPLY
1
Power Management Logic
Hall
Sensor
Output 2
DS-MX887P - August 10, 2009
3
www.clare.com
1
1 page  
3 Manufacturing Information
www.DataSheMetX4U8.c8o7mP
3.1 Mechanical Dimensions
3.1.1 TSOT23 3-Lead Package
2.80 / 3.00
(0.110 / 0.118)
3
0º / 8º
0.10 MIN
(0.004 MIN)
Recommended PCB Land Pattern
2.60 / 3.00
(0.102 / 0.118)
1.50 / 1.70
(0.059 / 0.067)
0.37 / 0.47
(0.015 / 0.019)
2.70
(0.106)
1.05
(0.041)
12
0.75 / 0.90
(0.030 / 0.035)
0.35 / 0.51
(0.014 / 0.020)
5º NOM
0.70 / 0.80
(0.028 / 0.031)
7º NOM
0.60 REF
(0.0236 REF)
0.25 BSC
(0.0098 BSC)
0.10 / 0.25
(0.004 / 0.010)
0.95
(0.037)
0.60
(0.024)
0.00 / 0.10
(0.000 / 0.004)
1.90 BSC
(0.0748 BSC)
0.95 BSC
(0.037 BSC)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
Notes: (Unless otherwise specified)
1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm
(0.004 inches) per side.
2. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.
3. Package top may be smaller than package bottom. Dimensions “D” and “E1” are determined at the outermost extreme of the plastic body
excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body.
3.1.2 Tape & Reel Packaging
178 DIA.
(7.01 DIA.)
0.25 ± 0.05
(0.001 ± 0.002)
Top Cover
Tape Thickness
0.066 MAX.
(0.003 MAX.)
ø1.5, +0.1, -0
(ø0.059, +0.004, -0)
P=4.0 ± 0.1
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.5 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.1
(0.069 ± 0.004)
Embossed Carrier
BO=3.2 ± 0.1
(0.126 ± 0.004)
K0=1.1 ± 0.1
(0.043 ± 0.004)
P=4.0 ± 0.1
(0.157 ± 0.004)
AO=3.2 ± 0.1
(0.126 ± 0.004)
ø1.1 ± 0.1
(0.043 ± 0.004)
W=8.0 ± 0.2
(0.315 ± 0.008)
Dimensions
mm
(inches)
Embossment
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
August 10, 2009
www.clare.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MX887P.PDF ] | |
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