PDF AS5011 Data sheet ( Hoja de datos )

Número de pieza	AS5011
Descripción	Low Power Integrated Hall IC
Fabricantes	austriamicrosystems AG
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No Preview Available ! www.DataSheet4U.com AS5011 Low Power Integrated Hall IC for Human Interface Applications Data Sheet 1 General Description The AS5011 is a complete Hall Sensor IC for smart navigation key applications to meet the low power requirements and host SW integration challenges for products such as cell phones and smart handheld devices. Due to the on chip processing engine, system designers are not tasked with integrating complex SW algorithms on their host processor thus leading to rapid development cycles. The AS5011 single-chip IC includes 4 integrated Hall sensing elements for detecting up to ±2mm lateral displacement, high resolution ADC, XY coordinate and motion detection engine combined with a smart power management controller. The X and Y positions coordinates and magnetic field information for each Hall sensor element is transmitted over a 2-wire I²C compatible interface to the host processor. The AS5011 is available in a small 16-pin 5x5x0.55mm QFN package and specified over an operating temperature of -20 to +80°C. Figure 1 Typical Arrangement of AS5011 and Axial Magnet 3 Key Features 2.7 to 3.6V operating voltage Down to 1.8V peripheral supply voltage Less than 200µA current consumption in Low Power mode Less than 50µA current consumption in Shutdown mode Lateral magnet movement radius up to 2mm I²C interface up to 4MHz Configurable interrupt output for motion detection Three operating modes: Shutdown mode Low Power mode Full Power mode 4 Applications The AS5011 is ideal for small factor manual input devices in battery operated equipment, such as Mobile phones MP3 players PDA’s GPS receivers Gaming consoles 2 Benefits Complete system-on-chip High reliability due to non-contact sensing Low power consumption Figure 2 AS5011 Block Diagram www.austriamicrosystems.com Revision 3.10 1 – 16 1 page AS5011 Data Sheet 6.4 Power modes www.DataSheet4U.com The AS5011 can operate in three different power modes, depending on the power consumption requirements of the whole system. Power Mode [0x76] Register Description Sleep phase Power state between wakeups in Shutdown and Low Power modes RC clock and analog part OFF Digital part in static mode Shutdown mode 1001_x00x Default mode after power on <50µA current consumption LP_Pulsed = 1 Wake up every 80ms from Sleep phase LP_Active = 0 Hall elements in reduced power during wake up LP_Continue = RC clock ON 0 Interrupt LOW on INTn if the magnet is away from the center above the INT_wup_en = Xp Xn Yp Yn threshold values (1) 1 Low Power mode 110x_100x <200µA current consumption Wake up every 20ms from Sleep phase LP_Pulsed = 1 Hall elements in high power during wake up for better accuracy LP_Active = 1 RC clock ON LP_Continue = Interrupt LOW on INTn when XY coordinates are ready to be read (1) 0 INT_act_en = 1 Full Power mode 010x_y00x <8mA current consumption Continuous read LP_Pulsed = 0 Hall elements in high power permanently LP_Active = 1 RC clock ON LP_Continue = Interrupt LOW on INTn when XY coordinates are ready to be read (1) 0 If INT_act_en = 1, after reading the XY coordinate, the next sample is INT_act_en = y stored and won’t be updated until the next read of XY with interrupt release. If INT_act_int_en = 0, the last converted XY coordinate is read in real time. (1) The interrupt will be released to HIGH by reading the X_res_int or Y_res_int registers, or by switching the device into a different power mode. Table 2: Overview of typical power modes www.austriamicrosystems.com Revision 3.10 5 – 16 5 Page AS5011 Data Sheet 8.2 Operating conditions (operating conditions: Tamb = -20 to +80°C, VDD = 3.3V) Parameter Core Supply voltage Peripheral Supply voltage Current consumption on core supply, Shutdown mode Current consumption on core supply, Low Power mode Current consumption on core supply, Full Power mode Symbol Min VDD 2.7 VDDp 1.8 Typ Max 3.6 VDD +0.3 IDDs 50 IDDl 200 IDDf 8 Current consumption on IO supply IDDp 1 Polling clock rate, Shutdown mode Polling clock rate, Low Power mode Coordinate conversion time tP,W tP,A tconv lateral movement radius dx dy 65.6 80 94.4 16.4 20 23.6 330 380 455 ±1.8 2 ±2.3 type of magnet Hall array diameter d2 3 RH 2.2 magnetic field strength BZ 30 120 Ambient temperature range Magnetic field measurement resolution Resolution of XY displacement IC package Power supply filtering capacitors Tamb -20 +80 11 8 QFN16 5x5x0.55mm 100 100 www.DataSheet4U.com Unit Note V V open drain outputs : SCL, SDA, INT/ average current pin VDD µA pulsed current IDDf during tconv with period tP,W average current pin VDD µA pulsed current IDDf during tconv with period tP,A mA continuous current pin VDD average current pin VDDp, 20ms µA i²C polling, 47k pullup resistor on SDA ms internal ms internal µs Full Power mode vertical magnetic field at magnet mm centre, measured at the chip surface mm cylindrical; axial magnetized mm mT vertical magnetic field at magnet center; measured at chip surface °C bit Internal bit over 2dx and 2dy axis nF Ceramic capacitor VDD - VSS nF Ceramic capacitor VDDp - VSS www.austriamicrosystems.com Revision 3.10 11 – 16 11 Page

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