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PDF AS1331 Data sheet ( Hoja de datos )
| Número de pieza | AS1331 | |
| Descripción | 300mA Buck-Boost Synchronous DC/DC Converters | |
| Fabricantes | austriamicrosystems AG | |
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Datasheet
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AS1331
300mA Buck-Boost Synchronous DC/DC Converters
1 General Description
This special device is a synchronous buck-boost DC/DC
converter which can handle input voltages above, below,
or equal to the output voltage.
Due to the internal structure of the AS1331 which is
working continuously through all operation modes this
device is ideal for dual or triple cell alkaline/NiCad/NiMH
as well as single cell Li-Ion battery applications.
Because of the implemented Power Save Mode, the
solution footprint and the component count is minimized
and also over a wide range of load currents a high
conversion efficiency is provided.
The device includes two N-channel MOSFET switches
and two P-channel switches. Also following features are
implemented: a quiescent current of typically 22µA
(ideal for battery power applications), a shutdown
current less than 1µA, current limiting, thermal shutdown
and output disconnect.
The AS1331 is available in a 10-pin 3x3mm TDFN
package with fixed and adjustable output voltage.
2 Key Features
! Input Voltage Range: 1.8V to 5.5V
! Output Voltages:
- Fixed: 2.5V, 3.0V, 3.3V
- Adjustable: 2.5V to 3.3V
! Output Current: 300mA @ 3.3V
! Up to 90% efficiency
! Power Good
! Output Disconnection in Shutdown
! Automatic transition between Buck and Boost mode
! Ultra Low Quiescent Current: 22µA, Shutdown Cur-
rent <1µA (Active Low)
! Short-Circuit Protection
! Low Battery detection
! Over Temperature Protection
! 10-pin 3x3mm TDFN package
3 Applications
The AS1331 is an ideal solution for handheld
computers, handheld instruments, portable music
players and PDA’s. Two and three cell Alkaline, NiCd or
NiMH or single cell Li battery powered products.
Figure 1. AS1331 - Typical Application Diagram
1.8 to 5.5V
C1
10µF
L1
6.8µH
4 SW1
5
2 SW2
8
Low Battery Detect
VIN LBO
R3
71
LBI AS1331-AD VOUT
R1
On 6
10
Off EN
FB
R2
C2
22µF
VOUT
2.5V to 3.3V
3 PGND 9 GND
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1 page  
AS1331
Datasheet - Electrical Characteristics
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Table 3. Electrical Characteristics
Symbol
Parameter
Thermal Protection
Thermal Shutdown
Conditions
10°C Hysteresis
Min Typ Max Units
145 °C
1. If the input voltage falls below this value during normal operation the device goes in startup mode.
2. The regulator is in startup mode until this voltage is reached. Caution: Do not apply full load current until the
device output > 2.3V
3. LBO goes low in startup mode as well as during normal operation if:
1) The voltage at the LBI pin is below LBI threshold.
2) The voltage at the LBI pin is below 0.1V and VOUT is below 92.5% of its nominal value.
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AS1331
Datasheet - Detailed Description
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Start-Up Mode
At start-up the switch SW D is disabled and its diode is used to transfer current to the output capacitor until VOUT
reaches approximately 2.15V. The inductor current is controlled by an alternate algorithm during start-up.
Note: Do not apply loads >1mA until VOUT = 2.3V is reached.
Other AS1331 Features
Shutdown
The part is in shutdown mode while the voltage at pin EN is below 0.4V and is active when the voltage is higher than
1.4V.
Note: EN can be driven above VIN or VOUT, as long as it is limited to less than 5.5V.
Output Disconnect and Inrush Limiting
During shutdown VOUT is going to 0V so that no current from the input source is running thru the device. The inrush
current is also limited at turn-on mode to minimize the surge currents seen by the input supply. These features of the
AS1331 are realized by opening both P-channel MOSFETs of the rectifiers, allowing a true output disconnect.
Power-OK and Low-Battery-Detect Functionality
LBO goes low in startup mode as well as during normal operation if:
1) The voltage at the LBI pin is below LBI threshold (1.25V). This can be used to monitor the battery voltage.
2) LBI pin is connected to GND and VOUT is below 92.5% of its nominal value. LBO works as a power-OK signal in this
case.
The LBI pin can be connected to a resistive-divider to monitor a particular definable voltage and compare it with a
1.25V internal reference. If LBI is connected to GND an internal resistive-divider is activated and connected to the
output. Therefore, the Power-OK functionality can be realised with no additional external components.
The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to
VIN = 1.8V. A capacitor to GND may be added to generate a power-on-reset delay. To obtain a logic-level output,
connect a pull-up resistor from pin LBO to pin VOUT. Larger values for this resistor will help to minimize current
consumption; a 100kΩ resistor is perfect for most applications (see Figure 25 on page 12).
For the circuit shown in the left of Figure 24 on page 12, the input bias current into LBI is very low, permitting large-
value resistor-divider networks while maintaining accuracy. Place the resistor-divider network as close to the device as
possible. Use a defined resistor for R2 and then calculate R1 as:
R1
=
R2
⋅
⎛
⎝
------V-----I-N-------
VSENSE
–
1⎠⎞
(EQ 1)
Where:
VSENSE (the internal sense reference voltage) is 1.25V.
R2 (the predefined resistor in the resistor devider) has to be ≤ 270kΩ.
In case of the LBI pin is connected to GND, an internal resistor-devider network is activated and compares the output
voltage with a 92.5% voltage threshold. For this particular Power-OK application, no external resistive components are
necessary.
Thermal Shutdown
To prevent the AS1331 from short-term misuse and overload conditions the chip includes a thermal overload
protection. To block the normal operation mode all switches will be turned off. The device is in thermal shutdown when
the junction temperature exceeds 145°C. To resume the normal operation the temperature has to drop below 135°C.
A good thermal path has to be provided to dissipate the heat generated within the package. Otherwise it’s not possible
to operate the AS1331 at its useable maximal power. To dissipate as much heat as possible away from the package
into a copper plane with as much area as possible, it’s recommended to use multiple vias in the printed circuit board.
It’s also recommended to solder the Exposed Pad (pin 11) to the GND plane.
Note: Continuing operation in thermal overload conditions may damage the device and is considered bad practice.
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| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet AS1331.PDF ] | |
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