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PDF CMBD7000N3 Data sheet ( Hoja de datos )
| Número de pieza | CMBD7000N3 | |
| Descripción | High -speed double diode | |
| Fabricantes | Cystech Electonics | |
| Logotipo |  |
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CYStech Electronics Corp.
High –speed double diode
CMBD7000N3
wSIspwseuwce.d.DNDaoa.tat:eSC:h32e20e90Nt643.U1.2c.0o5m
Revised Date
Page No. : 1/5
Description
The CMBD7000N3 consists of two high-speed switching diodes connected in series, fabricated in planar
technology, and encapsulated in the small SOT-23 plastic SMD package.
Equivalent Circuit
CMBD7000N3
Outline
SOT-23
Cathode/Anode
1：Anode
2：Cathode
3：Cathode/Anode
Anode
Cathode
Absolute Maximum Ratings @TA=25℃
Parameters
Reverse voltage
Forward current
Peak forward surge current
Symbol
VR
IF
IFRM
Power dissipation (Note 1)
Derate above 25℃
PD
Power dissipation (Note 2)
Derate above 25℃
PD
Junction Temperature
Storage Temperature
Tj
Tstg
Note 1: Device mounted on an FR-5 PCB with area 1.0×0.75×0.062 in.
2 : Device mounted on an Alumina board with area 0.4×0.3×0.024 in .
Min
-
-
-55
-55
Max
100
200
500
225
1.8
300
2.4
150
+150
Unit
V
mA
mA
mW
mW/°C
mW
mW/°C
°C
°C
CMBD7000N3
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOT-23 Dimension
wSIspwseuwce.d.DNDaoa.tat:eSC:h32e20e90Nt643.U1.2c.0o5m
Revised Date
Page No. : 5/5
A
L
Marking:
3
S
B
12
MTE5C
VG
C
D
H
KJ
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
Style: Pin 1.Anode 2.Cathode
3.Cathode/Anode
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.1102 0.1204 2.80 3.04
B 0.0472 0.0630 1.20 1.60
C 0.0335 0.0512 0.89 1.30
D 0.0118 0.0197 0.30 0.50
G 0.0669 0.0910 1.70 2.30
H 0.0005 0.0040 0.013 0.10
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
J 0.0034 0.0070 0.085 0.177
K 0.0128 0.0266 0.32 0.67
L 0.0335 0.0453 0.85 1.15
S 0.0830 0.1083 2.10 2.75
V 0.0098 0.0256 0.25 0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CMBD7000N3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet CMBD7000N3.PDF ] | |
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