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Número de pieza | TSM4405P | |
Descripción | Single P-Channel 1.8V Specified MicroSURF MOSFET | |
Fabricantes | Taiwan Semiconductor Company | |
Logotipo | ||
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Single P-Channel 1.8V Specified MicroSURFTM MOSFET
Patent Pending
SS
DG
Bump Side View
Lateral Power™ for
Load Switching and PA Switch
VDS = - 12V
RDS (on), Vgs @ - 4.5V, Ids @ - 4.9A = 55mΩ
RDS (on), Vgs @ - 2.5V, Ids @ - 4.4A = 70mΩ
RDS (on), Vgs @ - 1.8V, Ids @ - 4.0A = 90mΩ
Description
TSM4405P is new low cost, state of the art MicroSURFTM lateral MOSFET process technology in chip scale bondwireless
packaging minimizes PCB space and Rds(on) plus provides an ultra low Qg x Rds(on) figure of merit.
Features
Low profile package: less than 0.8mm height when
mounted on PCB
Occupies only 1.21mm2 of PCB area
Less than 30% of the area of a SC-70
Excellent thermal and electrical capabilities
Lead free solder bumps available
Block Diagram
Ordering Information
Part No.
TSM4405P
Packing
Tape & Reel
Q’ty
3kpcs / 7”
Absolute Maximum Rating (Ta = 25 oC unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Maximum Power Dissipation (Steady State)
Operating Junction Temperature
Operating Junction and Storage Temperature Range
Thermal Performance
Symbol
VDS
VGS
ID
IDM
PD
TJ
TJ, TSTG
Parameter
Junction to Ambient Thermal Resistance
Junction to Balls Thermal Resistance
Symbol
Rθja
RθjR
Limit
- 12V
±8
- 4.9
- 10
1. 5
+150
- 55 to +150
Limit
85
20
Unit
V
V
A
A
W
oC
oC
Unit
oC/W
oC/W
TSM4405P
1-6 2003/10 rev. F
1 page Dimensional Outline and Pad Layout
SS
GD
0.50mm
Ø 0.30mm
Solder Mask Ø ~ 0.28mm
(Solder Mask Defined Pads)
0.50mm
D = Drain Pad
S = Source Pad
G = Gate Pad
0.27mm
LAND PATTERN RECOMMENDATION
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SILICON
0.757mm
+/-0.03mm
CXXXX
BACKSIDE VIEW (No Bump Side View)
Mark on backside of die
C = 4405P Product Code
XXXX = Lot Traceability Code
Mark is located in lower right quadrant
on top of Drain pad. Gate pad is located
in lower left quadrant.
1.15mm
+/- 0.05mm
1.15mm
+/-0.05mm
0.30mm
0.50mm
Bump
Ø 0.37mm
0.50mm 0.30mm
Bumps are Lead Free solder 96.8 Sn / 2.6 Ag / 0.6 Cu
Patents are pending on the product described in the data sheet.
Lateral PowerTM and MicroSURFTM are trademarks of Great Wall Semiconductor Corporation.
TSM4405P
5-6 2003/10 rev. F
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet TSM4405P.PDF ] |
Número de pieza | Descripción | Fabricantes |
TSM4405P | Single P-Channel 1.8V Specified MicroSURF MOSFET | Taiwan Semiconductor Company |
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