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PDF ESDAVLC8-1BM2 Data sheet ( Hoja de datos )

Número de pieza ESDAVLC8-1BM2
Descripción TVS Clamping Arrays
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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No Preview Available ! ESDAVLC8-1BM2 Hoja de datos, Descripción, Manual

ESDAVLC8-1BM2, ESDAVLC8-1BT2
Single line low capacitance Transil™ for ESD protection
Features
Single line bidirectional protection
Breakdown voltage = 8.5 V min.
Very low capacitance = 4.5 pF @ 0 V
Lead-free packages
“Halogen-free” according to ECOPACK®2
Benefits
Very low capacitance for optimized data
integrity
Very low reverse current < 50 nA
Low PCB space consumption: 0.6 mm2 max
High reliability offered by monolithic integration
Complies with the following standards:
IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G - Method 3015-7: class 3
– HBM (human body model)
www.DataSAhepetp4Ul.iccomations
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Computers
Printers
Communication systems
Cellular phone handsets and accessories
Video equipment
SOD882
ESDAVLC8-1BM2
SOD882T
ESDAVLC8-1BT2
Figure 1. Functional diagram
I/O1
I/O2
Description
The ESDAVLC8-1BM2 and ESDAVLC8-1BT2 are
bidirectional single line TVS diodes designed to
protect datalines or other I/O ports against ESD
transients.
The devices are ideal for applications where both
printed circuit board space and power absorption
capability are required.
January 2010
TM: Transil is a trademark of STMicroelectronics
Doc ID 16937 Rev 1
1/13
www.st.com
13

1 page




ESDAVLC8-1BM2 pdf
ESDAVLC8-1BM2, ESDAVLC8-1BT2
2 Ordering information scheme
Figure 15. Ordering information scheme
Ordering information scheme
ESD array
Very low capacitance
Breakdown voltage
8 = 8.5 Volts min
Number of lines
Directional
B = Bidirectional
Package
M2 = SOD882
T2 = Thin SOD882
ESDA VLC 8 - 1 B x2
www.DataSheet4U.com
Doc ID 16937 Rev 1
5/13

5 Page





ESDAVLC8-1BM2 arduino
ESDAVLC8-1BM2, ESDAVLC8-1BT2
Recommendation on PCB assembly
4.5 Reflow profile
Figure 25. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
www.DataSheet4U.com
Doc ID 16937 Rev 1
11/13

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