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PDF AMMC-6430 Data sheet ( Hoja de datos )
| Número de pieza | AMMC-6430 | |
| Descripción | 25 - 33 GHz Power Amplifier | |
| Fabricantes | AVAGO TECHNOLOGIES | |
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AMMC - 6430
25 - 33 GHz Power Amplifier
Data Sheet
Chip Size: 2500 x 1750 µm (100 x 69 mils)
Chip Size Tolerance: ± 10µm (±0.4 mils)
Chip Thickness: 100 ± 10µm (4 ± 0.4 mils)
Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils)
Description
The AMMC-6430 MMIC is a broadband nearly 1W power
amplifier designed for use in transmitters that operate
in various frequency bands between 25GHz and 33GHz.
This MMIC optimized for linear operation with an output
third order intercept point (OIP3) of 37dBm. At 30GHz it
provides 29dBm of output power (P-1dB) and 17dB of
gain. The device has input and output matching circuitry
for use in 50 Ω environments. The AMMC-6430 also inte-
grates a temperature compensated RF power detection
circuit that enables power detection of 0.3V/W. DC bias is
simple and the device operates on widely available 5.5V for
current supply (negative voltage only needed for Vg). It is
fabricated in a PHEMT process for exceptional power and
gain performance. For improved reliability and moisture
protection, the die is passivated at the active areas.
www.DataSheet4U.com
AMMC-6430 Absolute Maximum Ratings[1]
Features
• Wide frequency range: 25 - 33 GHz
• High gain: 17 dB
• Power: @30 GHz, P-1dB=29 dBm
• Highly linear: OIP3=37dBm
• Integrated RF power detector
• 5.5 Volt, -0.7 Volt, 900mA operation
Applications
• Microwave Radio systems
• Satellite VSAT and DBS systems
• LMDS & Pt-Pt mmW Long Haul
• 802.16 & 802.20 WiMax BWA
• WLL and MMDS loops
• Commercial grade military
• Can be driven by AMMC-6345, increasingluding overall
gain.
Symbol
Parameters/Conditions
Units
Min.
Max.
Vd Positive Drain Voltage
V
Vg Gate Supply Voltage
V -3
Id Drain Current
mA
Pin CW Input Power
dBm
Tch Operating Channel Temp.
°C
Tstg Storage Case Temp.
°C -65
Tmax
Maximum Assembly Temp (60 sec max)
°C
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
7
0.5
1500
23
+150
+150
+300
Note: These devices are ESD sensitive. The following precautions are strongly recommended. Ensure
that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices
1 page  
Biasing and Operation
The recommended quiescent DC bias condition for op-
timum efficiency, performance, and reliability is Vd=5
volts with Vg set for Id=950 mA. Minor improvements in
performance are possible depending on the application.
The drain bias voltage range is 3 to 5.5V. A single DC gate
supply connected to Vg will bias all gain stages. Muting
can be accomplished by setting Vg and /or Vg to the
pinch-off voltage Vp.
An optional output power detector network is also
provided. The differential voltage between the Det-Ref
and Det-Out pads can be correlated with the RF power
emerging from the RF output port. The detected voltage
is given by :
( )V = Vref − Vdet − Vofs
where Vref is the voltage at the DET _ R port, Vdet is a volt-
age at the DET _ O port, and Vofs is the zero-input-power
offset voltage. There are three methods to calculate :
1. Vofs can be measured before each detector measure-
ment (by removing or switching off the power source
and measuring ). This method gives an error due to
temperature drift of less than 0.01dB/50°C.
2. Vofs can be measured at a single reference temperature.
The drift error will be less than 0.25dB.
3. Vofs can either be characterized over temperature and
stored in a lookup table, or it can be measured at two
temperatures and a linear fit used to calculate at any
temperature. This method gives an error close to the
method #1.
The RF ports are AC coupled at the RF input to the first stage
and the RF output of the final stage. No ground wired are
needed since ground connections are made with plated
www.DataSthhreoeut4gUh.c-ohmoles to the backside of the device.
Assembly Techniques
The backside of the MMIC chip is RF ground. For microstrip
applications the chip should be attached directly to the
ground plane (e.g. circuit carrier or heatsink) using electri-
cally conductive epoxy [1]
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plate
metal shim (same length and width as the MMIC) under
the chip which is of correct thickness to make the chip
and adjacent circuit the same height. The amount of
epoxy used for the chip and/or shim attachment should
be just enough to provide a thin fillet around the bottom
perimeter of the chip or shim. The ground plain should
be free of any residue that may jeopardize electrical or
mechanical attachment.
The location of the RF bond pads is shown in Figure 12.
Note that all the RF input and output ports are in a Ground-
Signal configuration.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is normally sufficient
for signal connections, however double bonding with 0.7
mil gold wire or use of gold mesh [2] is recommended
for best performance, especially near the high end of the
frequency band.
Thermosonic wedge bonding is preferred method for wire
attachment to the bond pads. Gold mesh can be attached
using a 2 mil round tracking tool and a tool force of ap-
proximately 22 grams and a ultrasonic power of roughly
55 dB for a duration of 76 +/- 8 mS. The guided wedge at
an untrasonic power level of 64 dB can be used for 0.7 mil
wire. The recommended wire bond stage temperature is
150 +/- 2C.
Caution should be taken to not exceed the Absolute Maxi-
mum Rating for assembly temperature and time.
The chip is 100um thick and should be handled with care.
This MMIC has exposed air bridges on the top surface and
should be handled by the edges or with a custom collet
(do not pick up the die with a vacuum on die center).
This MMIC is also static sensitive and ESD precautions
should be taken.
Notes:
[1] Ablebond 84-1 LM1 silver epoxy is recommended.
[2] Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824
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