|
|
PDF AMIS-710206-A4 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-710206-A4 | |
| Descripción | 200dpi CIS Module | |
| Fabricantes | AMI SEMICONDUCTOR | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de AMIS-710206-A4 (archivo pdf) en la parte inferior de esta página. Total 9 Páginas | ||
|
No Preview Available !
AMIS-710205-A4/AMIS-710206-A4: 200dpi CIS Modules
Data Sheet
1.0 General Description
The AMIS-710205-A4 (PI205MC-A4-R) and AMIS-710206-A4 (PI206MC-A4-R) are a family of contact image sensor (CIS) modules. As
a family group they are called AMIS-710205/206 modules. They are long contact image sensor modules, using MOS image sensor
technology for high-speed performance and high sensitivity. They contain their own complete optical system including the light source;
accordingly, they make a very compact imaging system. The four parallel video outputs give this family of CIS modules their high speed
performance. They all possess identical electrical circuit components, as well as the same mechanical and optical components, except
for their LED light sources. They differ in their specification, however, because the different light sources impact the efficacy of the high
speed performance.
The two modules are suitable for scanning A4 size (216mm) documents with eight dots per millimeter (dpm) resolution. Applications
include document scanning, mark readers, gaming and office automation equipment.
2.0 Key Features
• Light source, lens and sensor are integrated into a single module
• Ultra high-speed
• Four parallel analog video outputs clocked at 5.0MHz
• 90µsec/line scanning speed @ 5.0MHz clock rate with optional light sources, selected from the option of two above modules
• 8dpm resolution, 216mm scanning length
• Wide dynamic range
• LED light source (selectable among the two above modules)
• Standard A4 size ≅ 14mm x 19mm x 232mm
• Low power
• Light weight
3.0 Functional Description
www.DataSheet4U.com
Each of the two modules in the family AMIS-710205/206 consists of four major components. The first of them is the printed circuit board
(PCB) on which the 27 imaging chips, AMIS-720233 (PI3033), are bonded. These sensor chips, produced by AMI Semiconductor, are
monolithic devices with 64 photo sensing elements. Each of 27 chips are completely self-contained scanning chips with their control
circuits integrated within the chips, so that they can be cascaded to provide a 1728 photo-elements module. The AMIS-720233 chips
are integrated with the photo sensors' associated multiplex switches, a digital shift register and the chip selection switch. The chip's shift
register sequentially clocks out the integrated image charges from each sensing element and passes them through the chip-select
switch and out onto the video line. The chip-select switches are sequentially switched as each of the predecessor chips completes its
scan. These 27 sensors, bonded on a PCB, are grouped into four sub-cascaded sections. Each contiguously cascaded chip section is
connected on separate video lines, providing four video outputs, VOUT1, VOUT2, VOUT3, and VOUT4. Before the signal charges from
the four video lines appear at their respective outputs, they are converted to signal voltages by four on-board buffer amplifiers; one for
each of its corresponding video section. The first three sections, VOUT1, VOUT2 and VOUT3 have seven sensor chips, while the
VOUT4 has six sensor chips. Since each sensor chip has 64 pixels, there are a total of 1728 pixels (see Figure 1).
Mounted in the module housing, along with the PCB, is the second major component. It is a one-to-one graded indexed micro lens
array, which focuses the image of the scanned documents onto the sensing line of the sensor chips. The third major component
mounted in the module is the LED light source (see Figure 2). This pictorial cross section shows the LED bar light source and its
illumination path as it reflects the image from the document and focuses through the ROD lens on to the image sensing line of the
sensing chips. All components are housed in a small plastic housing and covered with the fourth major component, a glass window.
This cover glass not only serves to protect all of the critical components within the housing from dust, but it also serves a minor role in
the optical system. Together with rest of the module's optical system, the module is adjusted to obtain the optimum depth-of-focus.
AMI Semiconductor – Aug. 06, M-20608-001
www.amis.com
1
1 page  
AMIS-710205-A4/AMIS-710206-A4: 200dpi CIS Modules
9.0 Reset Level and Video Sampling Time
Data Sheet
Figure 3: Video Pixel Definition
Figure 3 graphically shows the video signal waveform and defines the single video pixel structure. The signal output waveform is shown
relative to the input clock waveform, as well as the symbols and terminologies used to define the performance specifications. Figure 3
explains the terminology used to characterize the dark signal levels and the recommended video pixel sampling times.
www.DataSheet4U.com
Note 6, under Table 7, specifies the dark level (DL). This is the level seen during the dark read out; for example, either the module sits
on a black target or the light source is turned off. It is measured from ground or 0V. The reset level is a reference level for the reset
switch, which is not necessarily on ground because after the reset occurs, the signal is passed through an amplifier. The difference
between the dark level and the reset level is called the pedestal (PED). In most cases, the offset control of the amplifier is used to
adjust the dark level to 0V or ground. Hence, the reset level will sit below ground.
The video pixels demonstrated in this graph emanate from an ideal CIS module with a phototransistor imaging structure. The video
output at high speeds, such as 5.0MHz, does not instantly rise to its final value, although given enough time; it would asymptotically
approach its steady state value. But, at high speeds it is impractical to wait for the final stable value. Accordingly, as Figure 3 indicates,
the output signal continues to rise towards its steady state value. Consistent with the forgoing comments, under Table 7, instead of the
conventional signal sampling time, tst is defined to substitute the conventional settling time definition. This definition is used because
the output signal continues to rise asymptotically to the final stable value but not within a practical time in high speed applications. This
is true even when the video rises to its peak value, Vp, defined in the algorithm used in the measurements described by the following
equation:
MTF={[Vp(n)+Vp(n+1)]/2-[Vp(n+2)+Vp(n+3)]/2}/{[Vp(n)+Vp(n+1)]/2+[Vp(n+2)+Vp(n+3)]/2}
Where n is 1, 2, .....1728th, Vp(n) is the signal amplitude of the nth pixel.
AMI Semiconductor – Aug. 06, M-20608-001
www.amis.com
5
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet AMIS-710206-A4.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| AMIS-710206-A4 | 200dpi CIS Module | AMI SEMICONDUCTOR |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |