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Número de pieza | AS5SP512K36DQ | |
Descripción | Plastic Encapsulated Microcircuit 18Mb | |
Fabricantes | Austin Semiconductor | |
Logotipo | ||
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No Preview Available ! SSRAM
Austin Semiconductor, Inc. AS5SP512K36DQ
Plastic Encapsulated Microcircuit
18Mb, 512K x 36, Synchronous SRAM
Pipeline Burst, Single Cycle Deselect
FEATURES
• Synchronous Operation in relation to the input Clock
• 2 Stage Registers resulting in Pipeline operation
• On chip address counter (base +3) for Burst operations
• Self-Timed Write Cycles
• On-Chip Address and Control Registers
• Byte Write support
• Global Write support
• On-Chip low power mode [powerdown] via ZZ pin
• Interleaved or Linear Burst support via Mode pin
• Three Chip Enables for ease of depth expansion without
Data Contention.
• Two Cycle load, Single Cycle Deselect
• Asynchronous Output Enable (OE\)
• Three Pin Burst Control (ADSP\, ADSC\, ADV\)
• 3.3V Core Power Supply
• 3.3V/2.5V IO Power Supply
• JEDEC Standard 100 pin TQFP Package, MS026-D/BHA
• Available in Industrial, Enhanced, and Mil-Temperature
Operating Ranges
DQPc
DQc
DQc
VDDQ
VSSQ
DQc
DQc
DQc
DQc
VSSQ
VDDQ
DQc
DQc
NC
VDD
NC
VSS
DQd
DQd
VDDQ
VSSQ
DQd
DQd
DQd
DQd
VSSQ
VDDQ
DQd
DQd
DQPd
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
SSRAM [SPB]
80 DQPb
79 DQb
78 DQb
77 VDDQ
76 VSSQ
75 DQb
74 DQb
73 DQb
72 DQb
71 VSSQ
70 VDDQ
69 DQb
68 DQb
67 VSS
66 NC
65 VDD
64 ZZ
63 DQa
62 DQa
61 VDDQ
60 VSSQ
59 DQa
58 DQa
57 DQa
56 DQa
55 VSSQ
54 VDDQ
53 DQa
52 DQa
51 DQPa
Fast Access Times
Parameter
Cycle Time
Clock Access Time
Output Enable Access Time
Symbol
tCYC
tCD
tOE
www.DataSheet4U.com
Block Diagram
200Mhz
5.0
3.0
3.0
166Mhz
6.0
3.5
3.5
133Mhz
7.5
4.0
4.0
OE\
ZZ
CLK
CE1\
CE2
CE3\
BWE\
BWx\
GW\
ADV
ADSC\
ADSP\
MODE
A0-Ax
CONTROL
BLOCK
BURST CNTL.
Address
Registers
Row
Decode
Column
Decode
I/O Gating and Control
Memory Array
x36
SBP
❑ Synchronous Pipeline
Burst
❋ Two (2) cycle load
❋ One (1) cycle
de-select
❋ One (1) cycle latency
on Mode change
Output Output
Register Driver
Input
Register
Units
ns
ns
ns
GENERAL DESCRIPTION
ASI’s AS5SP512K36DQ is a 18Mb High Performance
Synchronous Pipeline Burst SRAM, available in multiple
temperature screening levels, fabricated using High
Performance CMOS technology and is organized as a 512K
x 36. It integrates address and control registers, a two (2)
bit burst address counter supporting four (4) double-word
transfers. Writes are internally self-timed and synchronous
to the rising edge of clock.
ASI’s AS5SP512K36DQ includes advanced control options
including Global Write, Byte Write as well as an
Asynchronous Output enable. Burst Cycle controls are
DQx, DQPx handled by three (3) input pins, ADV, ADSP\ and ADSC\.
Burst operation can be initiated with either the Address
Status Processor (ADSP\) or Address Status Cache
controller (ADSC\) inputs. Subsequent burst addresses
are generated internally in the system’s burst sequence
control block and are controlled by Address Advance
AS5SP512K36DQ
Rev. 2.5 09/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1
1 page SSRAM
Austin Semiconductor, Inc. AS5SP512K36DQ
DC Electrical Characteristics (VDD=3.3v-5%/+10%,
TA=Min. and Max temperatures of Screening level chosen
Symbol
VDD
VDDQ
VoH
VoL
VIH
VIL
IIL
IZZL
IOL
IDD
ISB1
ISB2
ISB3
ISB4
Parameter
Power Supply Voltage
I/O Supply Voltage
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
Input Leakage (except ZZ)
Input Leakage, ZZ pin
Output Leakage
Operating Current
Automatic CE, Power Down
Current - TTL inputs
CMOS Standby
TTL Standby
Clock Running
Test Conditions
VDD=Min., IOH=-4mA
VDD=Min., IOH=-1mA
VDD=Min., IOL=8mA
VDD=Min., IOL=1mA
VDD=Max., VIN=VSS to VDD
3.3v
2.5v
3.3v
2.5v
3.3v
2.5v
3.3v
2.5v
Output Disabled, VOUT=VSSQ to VDDQ
VDD=Max., f=Max.,
IOH=0mA
5.0ns Cycle, 200 Mhz
6.0ns Cycle, 166 Mhz
7.5ns Cycle, 133 Mhz
Max VDD, De-Selected,
VIN>=VIH or VIN</=VIL
5.0ns Cycle, 200 Mhz
f=fMAX=1/tCYC
6.0ns Cycle, 166 Mhz
7.5ns Cycle, 133 Mhz
Max. VDD, Device deselected, VIN </=0.3V or VIN>/=VDDQ-0.3V
f=fMAX=1/tCYC
Device deselected; VDD=Max.; All Inputs </= VIL or VIH;
All inputs static; CLK frequency = 0
Device deselected;
VDD=Max.; All inputs
< VSS+0.2v or VDD-0.2v;
5.0ns Cycle, 200 Mhz
6.0ns Cycle, 166 Mhz
Cycle time (tKC)= Min.
7.5ns Cycle, 133 Mhz
Min
3.135
2.375
2.4
2
2
1.7
-0.3
-0.3
-5
-30
-5
Max
3.630
VDD
0.4
0.4
VDD+0.3
VDD+0.3
0.8
0.7
5
30
5
350
300
275
Units
V
V
V
V
V
V
V
V
V
V
uA
uA
uA
mA
mA
mA
160
150
140
70 mA
80 mA
Notes
1
1,5
1,4
1,4
1,4
1,4
1,2
1,2
1,2
1,2
3
3
135 mA
130 mA
125 mA
Thermal Resistance
Symbol
Description
Conditions
Thermal Resistance
TJA (Junction to Ambient)
Test Conditions follow standard test methods and
Thermal Resistance
procedures for measuring thermal impedance, as
www.DaTtJaCSheet4U.c(Joumnction to Top of Case, Top) per EIA/JESD51
Typical
1-Layer
31
9
Units
0C/W
0C/W
Notes
6
6
Notes:
[1]
[2]
[3]
[4]
[5]
[6]
All Voltages referenced to VSS (Logic Ground)
Overshoot: VIH < +4.6V for t<tKC/2 for I<20mA
Undershoot: VIL >-0.7V for t<tKC/2 for I<20mA
Power-up: VIH <+3.6V and VDD<3.135V for t<200ms
MODE and ZZ pins have internal pull-up resistors, and input leakage +/> +10uA
The load used for VOH, VOL testing is shown in Figure-2 for 3.3v and 2.5V supplies.
AC load current is higher than stated values, AC I/O curves can be made available upon request
VDDQ should never exceed VDD, VDD and VDDQ can be connected together
This parameter is sampled
AS5SP512K36DQ
Rev. 2.5 09/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
5
5 Page SSRAM
Austin Semiconductor, Inc. AS5SP512K36DQ
DOCUMENT TITLE
Plastic Encapsulated Microcircuit , 18Mb, 512K x 36, Synchronous SRAM
Pipeline Burst, Single Cycle Deselect
REVISION HISTORY
Rev #
2.5
History
Release Date
Updated pinout on page one, updated September 2008
max ratings & DC Electrical Characteristics
Status
Release
www.DataSheet4U.com
AS5SP512K36DQ
Rev. 2.5 09/08
11
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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