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PDF MAX17062 Data sheet ( Hoja de datos )
| Número de pieza | MAX17062 | |
| Descripción | TFT-LCD Step-Up DC-DC Converter | |
| Fabricantes | Maxim Integrated Products | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MAX17062 (archivo pdf) en la parte inferior de esta página. Total 14 Páginas | ||
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19-1042; Rev 0; 10/07
www.DataSheet4EUV.cAAoLVmUAAILTAIOBNLEKIT
TFT-LCD Step-Up DC-DC Converter
General Description
The MAX17062 is a high-performance step-up DC-DC
converter that provides a regulated supply voltage for
active-matrix thin-film transistor (TFT) liquid-crystal dis-
plays (LCDs). The MAX17062 incorporates current-
mode, fixed-frequency, pulse-width modulation (PWM)
circuitry with a built-in n-channel power MOSFET to
achieve high efficiency and fast-transient response.
Users can select 640kHz or 1.2MHz operation using a
logic input pin (FREQ). The high switching frequencies
allow the use of ultra-small inductors and low-ESR
ceramic capacitors. The current-mode architecture pro-
vides fast transient response to pulsed loads. A com-
pensation pin (COMP) gives users flexibility in adjusting
loop dynamics. The 22V internal MOSFET can generate
output voltages up to 20V from an input voltage
between 2.6V and 5.5V. Soft-start slowly ramps the input
current and is programmed with an external capacitor.
The MAX17062 is available in a 10-pin TDFN package.
Applications
Notebook Computer Displays
LCD Monitor Panels
LCD TV Panels
Features
o 90% Efficiency
o Adjustable Output from VIN to 20V
o 2.6V to 5.5V Input Supply Range
o Input Supply Undervoltage Lockout
o Pin-Programmable 640kHz/1.2MHz Switching
Frequency
o Programmable Soft-Start
o Improved EMI
o FB Regulation Voltage Tolerance < 1%
o Small 10-Pin TDFN Package
o Thermal-Overload Protection
Ordering Information
PART
TEMP RANGE
PIN-
PACKAGE
PKG
CODE
MAX17062ETB+T
-40°C to +85°C
10 TDFN-EP*
(3mm x 3mm)
T1033-2
+Denotes a lead-free package.
*EP = Exposed pad.
T = Tape and reel.
Pin Configuration
Minimal Operating Circuit
TOP VIEW
10 9 8 7 6
MAX17062
*EP
12 345
*EP = EXPOSED PAD.
TDFN
(3mm x 3mm)
VIN
2.6V TO 5.5V
6
LX
8
IN
7
LX
FB 2
MAX17062
9
FREQ
PGND 5
3 SHDN
PGND 4
10
SS
AGND
EP
COMP 1
VOUT
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1 page  
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TFT-LCD Step-Up DC-DC Converter
Typical Operating Characteristics (continued)
(Circuit of Figure 1. VIN = 5V, VMAIN = 15V, TA = +25°C, unless otherwise noted.)
SOFT-START
(RLOAD = 30Ω)
MAX17062 toc06
VOUT
5V/div
2ms/div
OV
INDUCTOR
CURRENT
1A/div
OA
LOAD-TRANSIENT RESPONSE
(ILOAD = 50mA TO 550mA)
MAX17062 toc07
15V
VOUT
500mV/div
AC-COUPLED
0V
L = 2.7μH
RCOMP = 47kΩ
CCOMP1 = 560pF
100μs/div
IOUT
500mA/div
50mA
INDUCTOR
CURRENT
2A/div
0A
PULSED LOAD-TRANSIENT RESPONSE
(ILOAD = 100mA TO 1.1A)
MAX17062 toc08
15V
VOUT
200mV/div
AC-COUPLED
IOUT
1A/div
0.1A
INDUCTOR
CURRENT
1A/div
0A
L = 2.7μH
RCOMP = 47kΩ
CCOMP1 = 560pF
10μs/div
SWITCHING WAVEFORMS
(ILOAD = 600mA)
MAX17062 toc09
1μs/div
LX
10V/div
0V
INDUCTOR
CURRENT
1A/div
0A
_______________________________________________________________________________________ 5
5 Page 
www.DataSheet4U.com
TFT-LCD Step-Up DC-DC Converter
VIN
4.5V TO 5.5V
C1
4.7μF
10V
VGOFF
-15V
C11
0.22μF
1 D2
C12
0.1μF
3
2
L1
2.7μH
C2
4.7μF
10V
R5
10Ω
8
IN
U1
LX 6
LX 7
C3
1μF MAX17062 PGND 5
R1
100kΩ
3 SHDN
9
FREQ
10
SS
C4
33nF
COMP
1
PGND 4
FB 2
AGND EP
C14
0.1μF
D3 2
3
1
D1
C7
10μF
25V
R4
221kΩ
R3
20kΩ
C15
0.22μF
C8
10μF
25V
R2
47kΩ
C5
560pF
C6
OPEN
VGON
+29V
VOUT
+15V/600mA
Figure 3. Multiple-Output TFT-LCD Power Supply
Multiple-Output Power Supply for TFT LCD
Figure 3 shows a power supply for active-matrix TFT-
LCD flat-panel displays. Output-voltage transient perfor-
mance is a function of the load characteristic. Add or
remove output capacitance (and recalculate compensa-
tion-network component values) as necessary to meet
the required transient performance. Regulation perfor-
mance for secondary outputs (VGON and VGOFF)
depends on the load characteristics of all three outputs.
PCB Layout and Grounding
Careful PCB layout is important for proper operation. Use
the following guidelines for good PCB layout:
1) Minimize the area of high-current loops by placing
the inductor, rectifier diode, and output capacitors
near the input capacitors and near the LX and
PGND pins. The high-current output loop goes from
the positive terminal of the input capacitor to the
inductor, to the IC’s LX pin, out of GND, and to the
input capacitor’s negative terminal. The high-cur-
rent output loop is from LX switch node to the recti-
fier diode (D1) to the output capacitors, and
reconnecting negative terminals of output capaci-
tors to PGND of the IC. This loop has very high
di/dt, and it is critical to minimize the area of this
loop. Connect these loop components with short,
wide connections. Avoid using vias in the high-cur-
rent paths. If vias are unavoidable, use many vias in
parallel to reduce resistance and inductance.
2) Create a power ground island (PGND) consisting of
the input and output capacitor grounds and PGND
pins. Connect all these together with short, wide
traces or a small ground plane. Maximizing the
width of the power ground traces improves efficien-
cy and reduces output voltage ripple and noise
spikes. Create an analog ground plane (AGND)
consisting of the feedback-divider ground connec-
tion, the COMP and SS capacitor ground connec-
tions, and the device’s exposed backside pad.
Connect the AGND and PGND islands by connect-
ing the PGND pins directly to the exposed backside
pad. Make no other connections between these
separate ground planes.
______________________________________________________________________________________ 11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet MAX17062.PDF ] | |
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