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PDF APM2350-P29 Data sheet ( Hoja de datos )
| Número de pieza | APM2350-P29 | |
| Descripción | Medium Power Amplifier Module | |
| Fabricantes | Advanced Semiconductor Business | |
| Logotipo |  |
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Features
· S21 = 29.8 dB @ 2300 MHz
= 28.2 dB @ 2400 MHz
· NF of 2.1 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
plerowTM APM2350-P29
Low Noise & High OIP3
Medium Power Amplifier Module
Description
The plerowTM APM-Series is an internally matched
amplifier mini-module for such application band in
SMD package with the output P1dB of 29 dBm. It is
compactly designed for low current consumption and
high OIP3. Integrating all the components for biasing
and matching within the module enhances production
yield and throughput as well. It passes through the
stringent DC, RF, and reliability tests. Not sample test
but 100% quality control test is made before packing.
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 2350 MHz, Zo.sys = 50 ohm
Parameter
Unit Specifications
Min Typ Max
Frequency Range
MHz
2300
2400
Gain
dB 28 29
Gain Flatness
dB
± 0.8
± 0.9
Noise Figure
dB
2.1 2.2
Output IP3 (1)
dBm 44 47
S11 / S22 (2)
dB
-18 / -10
Output P1dB
dBm 28 29
Switching Time (3)
µsec
-1
Supply Current
mA
460 500
Supply Voltage
V
5
Impedance
Ω
50
Max. RF Input Power
dBm
C.W 23 ~ 25 (before fail)
Package Type & Size
mm Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 15 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [email protected]
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
plerow
APM2350-P29
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
Ø0.3 plated thru holes to ground plane
1/5
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
2 x Ø2.0 plated thru holes to screw on heat sinker
(Recommended Footprint)
www.asb.co.kr
February 2009
1 page  
www.DataSheet4U.com
Channel Power vs. ACLR Test Configuration
plerowTM APM2350-P29
Low Noise & High OIP3
Medium Power Amplifier Module
APM2350
– P29
Evaluation Board attached with Heat Sink
Evaluation Board
* In order to prevent damage of D.U.T (APM-Series) from heating, you must to use a properly sized heat
sink for testing a module.
5/5
www.asb.co.kr
February 2009
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet APM2350-P29.PDF ] | |
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