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Número de pieza ALN1100
Descripción Internally Matched LNA Module
Fabricantes Advanced Semiconductor 
Logotipo Advanced Semiconductor Logotipo



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plerowTM ALN1100
Internally Matched LNA Module
Features
S21 = 31.7 dB @ 950 MHz
= 32.3 dB @ 1250 MHz
NF of 0.75 dB over frequency
Unconditionally Stable
Single 5V Supply
High OIP3 @ Low Current
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. =1100 MHz, Zo.sys = 50 ohm
Parameter
Specifications
Unit
Min Typ Max
Frequency Range
MHz
950
1250
Gain
dB 31 32
Gain Flatness
Noise Figure
Output IP3 (1)
S11 / S22 (2)
dB
dB
dBm
dB
± 0.3
± 0.5
0.75 0.8
34 35
-18 / -10
Output P1dB
Switching Time (3)
Supply Current
dBm
µsec
mA
17 18
-
100 120
Supply Voltage
Impedance
Max. RF Input Power
V
dBm
5
50
C.W 29 ~ 31 (before fail)
Package Type & Size
mm Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 10 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
2-stage Single Type
More Information
Website: www.asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
plerow
ALN1100
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
+Vcc
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
November 2008

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