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PDF ALN0892 Data sheet ( Hoja de datos )

Número de pieza ALN0892
Descripción Internally Matched LNA Module
Fabricantes Advanced Semiconductor 
Logotipo Advanced Semiconductor Logotipo



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plerowTM ALN0892
Internally Matched LNA Module
Features
· S21 = 34.5 dB @ 824 MHz
= 33.5 dB @ 894 MHz
· S21 = 34.0 dB @ 890 MHz
= 33.0 dB @ 960 MHz
· NF of 0.65 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 859, 925 MHz, Zo.sys = 50 ohm
Specifications
Parameter
Unit
CDMA
GSM
Min Typ Max Min Typ Max
Frequency Range
MHz
824
894 890
960
Gain
dB 33
34
32.5 33.5
Gain Flatness
dB
± 0.5
± 0.6
± 0.5
± 0.6
Noise Figure
dB
0.65 0.70
0.60 0.65
Output IP3 (1)
dBm
38
39
38 39
S11 / S22 (2)
dB
-18 / -12
-18 / -12
Output P1dB
dBm
20
21
20 21
Switching Time (3)
 sec
-
-
Supply Current
mA
170 190
170 190
Supply Voltage
V
5
Impedance
50
Max. RF Input Power dBm
C.W 29 ~ 31 (before fail)
Package Type & Size mm
Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 7 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
2-stage Single Type
More Information
Website: www.asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
plerow
ALN0892
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
(Bottom View)
Pin Number
Function
3 RF In
8 RF Out
10 Vs
Others
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø0.4 plated thru holes to ground plane
1/5
(Recommended Footprint)
www.asb.co.kr
April 2009

1 page




ALN0892 pdf
www.DataSheet4U.com
Application Circuit
C1
IN
plerowTM ALN0892
Internally Matched LNA Module
VS
+-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C2
ALN
OUT
1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca-
pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are in-
cluded inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added
just in case that the customer wants. The value of C1 & C2 is determined by considering the application
frequency.
Recommended Soldering Reflow Process
260°C
Ramp-up
(3˚C/sec)
200°C
20~40 sec
Ramp-down
(6°C/sec)
Evaluation Board Layout
Vs
IN OUT
150°C
60~180 sec
Size 25x25mm
(for ALN Series – 13x13mm)
5/5
www.asb.co.kr
April 2009

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