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PDF MAX4899AE Data sheet ( Hoja de datos )

Número de pieza MAX4899AE
Descripción USB 2.0 High-Speed Fault-Tolerant 3:1 / 4:1 Multiplexers
Fabricantes Maxim Integrated Products 
Logotipo Maxim Integrated Products Logotipo



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No Preview Available ! MAX4899AE Hoja de datos, Descripción, Manual

19-0616; Rev 0; 7/06
EVAALVUAAILTAIOBNLEKIT
USB 2.0 High-Speed, Fault-Tolerant 3:1, 4:1
Multiplexers
General Description
www.dTathaeshMeeAt4Xu4.c8o9m9E/MAX4899AE analog multiplexers com-
bine the low on-capacitance (CON) and low on-resis-
tance (RON) necessary for high-performance switching
applications. These devices are designed for USB 2.0
high-speed applications at 480Mbps. The MAX4899E/
MAX4899AE also handle all the requirements for USB
low- and full-speed signaling.
The MAX4899E is a dual 3:1 multiplexer whereas the
MAX4899AE is a dual 4:1 multiplexer. The MAX4899E/
MAX4899AE feature two digital inputs, C0 and C1, to con-
trol the analog signal path. Typical applications include
switching a USB connector between USB and other oper-
ations such as serial communications, audio, and video.
An enable input (EN) is provided to disable all channels
and place the device into a high-impedance (off) state,
as well as reducing power consumption.
The MAX4899E/MAX4899AE operate from a 2.7V to
3.6V power-supply voltage and are protected against
+5.5V shorts to COMA- and COMA+. In addition,
COMA+ and COMA- are normally connected to outside
circuitry and feature ±15kV ESD protection. The
MAX4899E/MAX4899AE are available in a 3mm x 3mm,
16-pin TQFN package and operate over the -40°C to
+85°C temperature range.
Applications
Cell Phones
Digital Still Cameras
PDAs
Digital Video Cameras
MPEG-4 Players
Portable GPS
Combination Products
KVM
Features
Single 2.7V to 3.6V Power-Supply Voltage
Low 4Ω (typ) On-Resistance (RON)
-3dB Bandwidth: 425MHz
Fault Tolerant to Meet Full USB 2.0 Specification
COM_ Protected to ±15kV ESD Protection per
Human Body Model (MIL-STD-883; Method 3015)
Low Operating Current (200µA), Ultra-Low
Quiescent Current (3.0µA max) in Standby Mode
Low Threshold Eliminates the Need for
Translators in 1.8V Low Voltage Systems
Tiny 16-Pin, 3mm x 3mm, Lead-Free TQFN Package
Eye Diagram
0.5
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
TIME (ns)
NOTE: UI = 2.08ns
MASK = USB 2.0 HIGH SPEED
Pin Configurations appear at end of data sheet.
Ordering Information/Selector Guide
PART
PIN-PACKAGE
MUX CONFIGURATION
TOP MARK
MAX4899EETE+
16 TQFN-EP*
DUAL 3:1
AEY
MAX4899AEETE+
16 TQFN-EP*
DUAL 4:1
AEZ
Note: All devices are specified over the -40°C to +85°C operating temperature range.
+Denotes lead-free package.
*EP = Exposed paddle.
PKG CODE
T1633-4
T1633-4
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

1 page




MAX4899AE pdf
USB 2.0 High-Speed, Fault-Tolerant 3:1, 4:1
Multiplexers
www.datasheet4u.com
PIN
MAX4899E MAX4899AE
11
22
33
44
55
66
7, 8 —
—7
—8
99
10 10
11 11
12 12
13 13
14 14
15 15
16 16
——
Pin Description
NAME
FUNCTION
GND
COMA+
COMA-
V+
Ground
Analog Switch Common D+ Terminal
Analog Switch Common D- Terminal
Positive Supply-Voltage Input. Connect V+ to a 2.7V to 3.6V supply voltage. Bypass V+
to GND with a 0.1µF capacitor placed as close as possible to the device.
C1
Digital Control Input 1. C1 and C0 control the analog signal path as shown in the
Functional Diagrams section.
C0
N.C.
USB3-
USB3+
USB2-
USB2+
USB1+
USB1-
USB0+
USB0-
EN
Digital Control Input 0. C1 and C0 control the analog signal path as shown in the
Functional Diagrams section.
No Connection. Not internally connected.
Analog Switch 3 D- Terminal
Analog Switch 3 D+ Terminal
Analog Switch 2 D- Terminal
Analog Switch 2 D+ Terminal
Analog Switch 1 D+ Terminal
Analog Switch 1 D- Terminal
Analog Switch 0 D+ Terminal
Analog Switch 0 D- Terminal
Active-Low Enable Input. For normal operation, drive EN low. Drive EN high to place all
channels in a high-impedance state. The internal charge pump is turned off when EN is
a logic-high.
Active-Low Charge-Pump Enable Input. Drive QP low for normal operation. Drive QP
QP high to disable the charge pump with the switches still active at a reduced analog signal
range and higher RON.
EP Exposed Paddle. Connect EP to GND.
_______________________________________________________________________________________ 5

5 Page





MAX4899AE arduino
USB 2.0 High-Speed, Fault-Tolerant 3:1, 4:1
Multiplexers
www.datasheet4u.com
USB
TRANSCEIVER
USB0+
USB0-
VBUS
D+
COMA+
USB1+
USB1-
MAX4899AE
D-
COMA-
USB2+
GND
USB
CONNECTOR
USB3+
USB2-
USB3-
SERIAL DATA LINK
AUDIO
HEADPHONE
AUXILIARY
INPUT
Figure 8. MAX4899AE Multiplexing Four Data Types
ESD Protection
As with all Maxim devices, ESD-protection structures are
incorporated on all pins to protect against electrostatic
discharges encountered during handling and assembly.
The COMA+ and COMA- lines have extra protection
against static electricity. Maxim’s engineers have devel-
oped state-of-the-art structures to protect these pins
against ESD of ±15kV without damage. The ESD struc-
tures withstand high ESD in all states: normal operation,
tri-state output mode, and powered down. After an ESD
event, Maxim’s E-versions keep working without latch-
up, whereas competing products can latch and must be
powered down to remove latch-up.
Human Body Model
The MAX4899E/MAX4899AE COMA+ and COMA- pins
are characterized for ±15kV ESD protection using the
Human Body Model (MIL-STD-883, Method 3015).
Figure 9a shows the Human Body Model and Figure 9b
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est, which is then discharged into the device through a
1.5kΩ resistor.
RC 1MΩ
CHARGE-CURRENT-
LIMIT RESISTOR
RD 1500Ω
DISCHARGE
RESISTANCE
HIGH-
VOLTAGE
DC
SOURCE
Cs
100pF
STORAGE
CAPACITOR
Figure 9a. Human Body ESD Test Model
DEVICE
UNDER
TEST
IP 100%
90%
AMPERES
36.8%
10%
0
0
tRL
Ir PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
TIME
tDL
CURRENT WAVEFORM
Figure 9b. Human Body Model Current Waveform
PROCESS: BiCMOS
Chip Information
______________________________________________________________________________________ 11

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