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PDF AS1361 Data sheet ( Hoja de datos )

Número de pieza AS1361
Descripción (AS1361 / AS1362) High-PSRR Low Dropout Regulators
Fabricantes austriamicrosystems AG 
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No Preview Available ! AS1361 Hoja de datos, Descripción, Manual

AS1361/AS1362
150mA/300mA, Ultra-Low-Noise, High-PSRR
Low Dropout Regulators, with POK
Data Sheet
1 Generalwww.datasheet4u.com Description
2 Key Features
The AS1361/AS1362 are ultra-low-noise, low-dropout
linear regulators specifically designed to deliver up to
150/300mA continuous output current, and can achieve
a low 140mV dropout for 300mA load current. The LDOs
are designed and optimized to work with low-cost, small-
capacitance ceramic capacitors.
The devices are available as the standard products
listed in Table 1.
Table 1. Standard Products
Model Load Current
Output Voltage
AS1361
150mA
Preset – 1.5 to 4.5V
AS1362
300mA
Preset – 1.5 to 4.5V
! Preset Output Voltages: 1.5 to 4.5V (in 50mV steps)
! Output Noise: 9µVRMS @ 100Hz to 100kHz
! Power-Supply Rejection Ratio: 92dB @ 1kHz
! Low Dropout: 140mV @ 300mA Load
! Power-OK Output
! Stable with 1µF Ceramic Capacitor for any Load
! Guaranteed 150/300mA Output
! 1.25V Internal Reference
! Extremely-Low Quiescent Current: 40µA
An integrated P-channel MOSFET pass transistor allows
the devices to maintain extremely low quiescent current
(40µA).
The AS1361/AS1362 uses an advanced architecture to
achieve ultra-low output voltage noise of 9µVRMS and a
power-supply rejection-ratio of better than 80dB (up to
10kHz).
An active-Low, open-drain power-ok output indicates if
the output voltage is within regulation.
The AS1361/AS1362 requires only 1µF output capacitor
for stability at any load. When the LDO is disabled, cur-
rent consumption drops below 500nA.
The devices are available in a TSOT23 6-pin package.
! Excellent Load/Line Transient
! Overcurrent and Thermal Protection
! TSOT23 6-pin Package
3 Applications
The devices are ideal for mobile phones, wireless
phones, PDAs, handheld computers, mobile phone
base stations, Bluetooth portable radios and accesso-
ries, wireless LANs, digital cameras, personal audio
devices, and any other portable, battery-powered appli-
cation.
Figure 1. Typical Application Circuit
Input
2 to 5.5V
CIN
1µF
1
IN
6
OUT
On 3
Off SHDNN
AS1361/
AS1362
4
POK
Output
1.5 to 4.5V
100kΩ
2
GND
CBYPASS
5 10nF
BYPASS
COUT
1µF
IN 1
6 OUT
AS1361/
GND 2 AS1362 5 BYPASS
SHDNN 3
4 POK
www.austriamicrosystems.com
Revision 1.00
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AS1361 pdf
AS1361/AS1362
Data Sheet - Typical Operating Characteristics
7 Typical Operating Characteristics
VIN = VOUT + 0.5V, CIN = COUT = 1µF, CBYPASS = 10nF, TAMB = 25°C (unless otherwise specified).
www.datashFeeigt4uur.eco3m. Output Voltage vs. Input Voltage
3.5
3
IOUT = 150mA
2.5
IOUT = 300mA
2
1.5
1
0.5
0
0 12 34 5
Input Voltage (V)
6
Figure 4. Output Voltage Accuracy vs. Load Current
0.5
0.4
0.3
0.2
0.1
0 Temp = -45°C
-0.1 Temp = 25°C
-0.2
Temp = 85°C
-0.3
-0.4
-0.5
0
50 100 150 200 250 300
Load Current (mA)
Figure 5. Output Voltage Accuracy vs. Temperature
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-40
-15 10 35 60
Temperature (°C)
85
Figure 6. Dropout Voltage vs. Load Current
140
120
100 Temp = 85°C
80 Temp = 25°C
60 Temp = -45°C
40
20
0
0 50 100 150 200 250 300
Load Current (mA)
Figure 7. Dropout Voltage vs. Output Voltage
80
70
60
50
40
30
20
10
0
2 2.2 2.4 2.6 2.8 3 3.2
Output Voltage (V)
www.austriamicrosystems.com
Revision 1.00
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AS1361 arduino
AS1361/AS1362
Data Sheet - Package Drawings and Markings
10 Package Drawings and Markings
The devices are available in a TSOT23 6-pin package.
Figure 19. TSOT23 6-pin Package
www.datasheet4u.com
Symbol Min Typ Max
A 1.00
A1 0.01 0.05 0.10
A2 0.84 0.87 0.90
b 0.30
0.45
b1 0.31 0.35 0.39
c 0.12 0.15 0.20
c1 0.08 0.13 0.16
D 2.90BSC
E 2.80BSC
E1 1.60BSC
e 0.95BSC
e1 1.90BSC
Notes
3,4
3,4
3,4
Symbol Min Typ Max Notes
L 0.30 0.40 0.50
L1 0.60REF
L2 0.25BSC
N6
R 0.10
R1 0.10
0.25
θ 0º 4º 8º
θ1 4º 10º 12º
Tolerances of Form and Position
aaa 0.15
bbb 0.25
ccc 0.10
ddd 0.20
Notes:
1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994.
2. Dimensions are in millimeters.
3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall
not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or pro-
trusion shall not exceed 0.15mm per side. Dimensions D and E1 are determined at datum H.
4. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outer-
most extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
include any mistmatches between the top of the package body and the bottom. D and E1 are determined at
datum H.
www.austriamicrosystems.com
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