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PDF LTC3221-5 Data sheet ( Hoja de datos )

Número de pieza LTC3221-5
Descripción Micropower
Fabricantes Linear Technology 
Logotipo Linear Technology Logotipo



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No Preview Available ! LTC3221-5 Hoja de datos, Descripción, Manual

LTC3221/
LTC3221-3.3/LTC3221-5
Micropower,
Regulated Charge Pump
in 2 × 2 DFN
FEATURES
Ultralow Power: 8µA Quiescent Current
Regulated Output Voltages: 3.3V ±4%, 5V ±4%, ADJ
VIN Range:
1.8V to 4.4V (LTC3221-3.3)
www.DataSheet4U.2co.7mV to 5.5V (LTC3221-5)
Output Current: Up to 60mA
No Inductors Needed
Very Low Shutdown Current: <1µA
Shutdown Disconnects Load from VIN
Burst Mode Control
Short-Circuit Protected
Solution Profile < 1mm
Tiny 2mm × 2mm 6-Pin DFN Package
U
APPLICATIO S
Low Power 2 AA Cell to 3.3V Supply
Memory Backup Supplies
Tire Pressure Sensors
General Purpose Low Power Li-Ion to 5V Supply
RF Transmitters
Glucose Meters
DESCRIPTIO
The LTC®3221 family are micropower charge pump DC/DC
converters that produce a regulated output at up to 60mA.
The input voltage range is 1.8V to 5.5V. Extremely low
operating current (8µA typical at no load) and low external
parts count (one flying capacitor and two small bypass
capacitors at VIN and VOUT) make them ideally suited for
small, battery-powered applications.
The LTC3221 family includes fixed 5V and 3.3V output
versions plus an adjustable version. All parts operate
as Burst Mode® switched capacitor voltage doublers
to achieve ultralow quiescent current. The chips use a
controlled current to supply the output and will survive
a continuous short-circuit from VOUT to GND. The FB pin
of the adjustable LTC3221 can be used to program the
desired output voltage.
The LTC3221 family is available in a low profile (0.75mm)
2mm × 2mm 6-pin DFN package.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. Burst
Mode is a registered trademark of Linear Technology Corporation. All other trademarks are
the property of their respective owners.
TYPICAL APPLICATIO
1µF
VIN
2.2µF
2
5
C
VIN
1
C+
VOUT
6
LTC3221-X
4,7 GND
VOUT
4.7µF
OFF ON 3 SHDN
3221 TA01
REGULATED 3.3V OUTPUT FROM 1.8V TO 4.4V INPUT
VOUT = 3.3V ±4%
IOUT = OmA TO 25mA; VIN >1.8V
IOUT = OmA TO 60mA; VIN >2V
REGULATED 5V OUTPUT FROM 2.7V TO 5.5V INPUT
VOUT = 5V ±4%
IOUT = OmA TO 25mA; VIN >2.7V
IOUT = OmA TO 60mA; VIN >3V
No-Load Input Current
vs Supply Voltage
16
14
12
10 TA = 90°C
TA = 25°C
8
6 TA = –45°C
4
2
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5
SUPPLY VOLTAGE (V)
3221 TA01b
3221f
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1 page




LTC3221-5 pdf
LTC3221/
LTC3221-3.3/LTC3221-5
TYPICAL PERFOR A CE CHARACTERISTICS (LTC3221-5 only)
Load Regulation
5.10
5.05
5.00
4.95
www.DataSheet4U.com
4.90
VIN = 4.2V
VIN = 3.6V
VIN = 2.7V
4.85
4.80
0
20 40 60 80 100 120
LOAD CURRENT (mA)
3221 G16
No-Load Input Current vs
Supply Voltage
16
14
12
10 TA = 90°C
8
6
4 TA = 25°C
TA = –45°C
2
0
2.7 3.0 3.3 3.6 3.9 4.2 4.5
SUPPLY VOLTAGE (V)
3221 G19
Output Load Capability at 4%
Below Regulation
120 VOUT = 4.8V
110
TA = –45°C
100
90 TA = 90°C
80 TA = 25°C
70
60
50
40
2.7
3.0 3.3 3.6 3.9 4.2
SUPPLY VOLTAGE (V)
3221 G17
Extra Input Current vs Load
Current (IIN-2 ILOAD)
10 VIN = 3V
1
0.1
0.01
0.001
0.01
0.1 1 10
LOAD CURRENT (mA)
100
3221 G20
Effective Open-Loop Output
Resistance vs Temperature
15 VIN = 2.7V
14 VOUT = 4.5V
13
12
11
10
9
8
7
6
5
–50 –25
0
25 50 75 100
TEMPERATURE (°C)
3221 G18
Efficiency vs Supply Voltage
100
90
80
THEORETICAL MAX
70
60 IOUT = 1mA IOUT = 30mA
50
40
30
20
10
0
2.7
3.0 3.3 3.6 3.9
SUPPLY VOLTAGE (V)
4.2 4.5
3221 G21
Output Ripple vs Load Current
90 VIN = 3V
80
Output Ripple
70 COUT = 2.2µF
60
50
VOUT
50mV/DIV
(AC-COUPLED)
40
COUT = 4.7µF
30
20
10
0
0 20 40 60 80 100
LOAD CURRENT (mA)
1µs/DIV
VIN = 3V
ILOAD = 60mA
COUT = 4.7µF, 6.3V, SIZE 0603
3221 G13
Load Transient Response
VOUT
50mV/DIV
(AC-COUPLED)
60mA
IOUT
0mA
3221 G23
5µs/DIV
VIN = 3V
ILOAD = 0mA TO 60mA STEP
COUT = 4.7µF, 6.3V, SIZE 0603
3221 G24
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LTC3221-5 arduino
PACKAGE DESCRIPTIO
LTC3221/
LTC3221-3.3/LTC3221-5
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
2.50 ±0.05
www.DataSheet4U1..1c5o±m0.05
0.61 ±0.05
(2 SIDES)
0.675 ±0.05
PACKAGE PIN 1 BAR
OUTLINE TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50 BSC
1.42 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
R = 0.115
TYP
0.56 ± 0.05
(2 SIDES)
4
0.38 ± 0.05
6
2.00 ±0.10
(4 SIDES)
0.75 ±0.05
0.00 – 0.05
PIN 1
CHAMFER OF
EXPOSED PAD
31
(DC6) DFN 1103
0.25 ± 0.05
0.50 BSC
1.37 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
3221f
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