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PDF BTD2444S3 Data sheet ( Hoja de datos )
| Número de pieza | BTD2444S3 | |
| Descripción | NPN Epitaxial Planar Transistor | |
| Fabricantes | Cystech Electonics | |
| Logotipo |  |
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CYStech Electronics Corp.
Low Vcesat NPN Epitaxial Planar Transistor
BTD2444S3
Spec. No. : C223S3-R
Issued Date : 2005.06.29
Revised Date :
Page No. : 1/4
Features
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• The BTD2444S3 is designed for general purpose low frequency power amplifier applications.
• Low VCE(sat), VCE(sat)=40mV (typical), at IC / IB = 50mA / 2.5mA
• Pb-free package
Symbol
BTD2444S3
Outline
SOT-323
C
B：Base
C：Collector
E：Emitter
BE
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation
Junction Temperature
Storage Temperature
Note : Single pulse, Pw=10ms
Symbol
VCBO
VCEO
VEBO
IC
ICP
Pd
Tj
Tstg
BTD2444S3
Limits
40
25
6
800
1.5 (Note)
225
150
-55~+150
Unit
V
V
V
mA
A
mW
°C
°C
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOT-323 Dimension
Spec. No. : C223S3-R
Issued Date : 2005.06.29
Revised Date :
Page No. : 5/4
3
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1
e1 bp
e
D
0
A
A1
QC
Marking:
2
WB
Lp
detail Z
TBES
EA Z
θ
He
1
scale
2 mm
vA
3-Lead SOT-323 Plastic
Surface Mounted Package
CYStek Package Code: S3
Style: Pin 1.Base 2.Emitter 3.Collector
DIM
Inches
Min. Max.
A 0.0315 0.0433
A1 0.0000 0.0039
bp 0.0118 0.0157
C 0.0039 0.0098
D 0.0709 0.0866
E 0.0453 0.0531
e 0.0512
-
Millimeters
Min. Max.
0.80 1.10
0.00 0.10
0.30 0.40
0.10 0.25
1.80 2.20
1.15 1.35
1.3 -
DIM
Inches
Min. Max.
e1 0.0256
-
He 0.0787 0.0886
Lp 0.0059 0.0177
Q 0.0051 0.0091
v 0.0079
-
w 0.0079
-
θ-
-
*: Typical
Millimeters
Min. Max.
0.65
-
2.00 2.25
0.15 0.45
0.13 0.23
0.2 -
0.2 -
10° 0°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD2444S3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet BTD2444S3.PDF ] | |
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