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PDF PS22053 Data sheet ( Hoja de datos )

Número de pieza PS22053
Descripción 1200V/10A low-loss 4th generation IGBT inverter bridge
Fabricantes Mitsubishi Electric Semiconductor 
Logotipo Mitsubishi Electric Semiconductor Logotipo



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No Preview Available ! PS22053 Hoja de datos, Descripción, Manual

PS22053
MITMSUITBSIUSBHISSHEIMSIECMOINCDOUNCDTUOCRTO<RDu<aDl-uIna-lL-Iinn-eLiPnaecPkacgkeaIgneteIlnlitgeellnigtePnotwPeorwMeor dMuoled>ule>
PS22PS02523053
TRATNRSAFNESRF-EMRO-MLDOLTDYPTEYPE
INSIUNLSAUTLEADTETDYPTEYPE
INTEGRATED POWER FUNCTIONS
1200V/10A low-loss 4th generation IGBT inverter bridge
for 3 phase DC-to-AC power conversion
www.DataSheet4U.com
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS
• For upper-leg IGBTS :Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection.
• For lower-leg IGBTS : Drive circuit, Control supply under-voltage protection (UV), Short circuit protection (SC).
• Fault signaling : Corresponding to an SC fault (Lower-side IGBT) or a UV fault (Lower-side supply).
• Input interface : 5V line CMOS/TTL compatible (High active logic).
APPLICATION
AC400V 0.2kW~0.75kW inverter drive for small power motor control.
Fig. 1 PACKAGE OUTLINES
Dimensions in mm
2.54±0.3
302.54(=76.2)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
Type name , Lot No.
2-φ4.5±0.2
QR
Code
22 23 24 25 26 27 28
8±0.3
10.16±0.3
67±0.3
79±0.5
Heat sink side
A
(2.5)
Heat sink side
(2)
Detail : A
All external terminals are treated with lead free solder (ingredient : Sn-Cu) plating.
1. VUFS
2. VUFB
3. VP1
4. UP
5. VVFS
6. VVFB
7. VP1
8. VP
9. VWFS
10. VWFB
11. VP1
12. VPC
13. WP
14. VN1
15. VNC
16. CIN
17. CFO
18. FO
19. UN
20. VN
21. WN
22. P
23. U
24. V
25. W
26. NU
27. NV
28. NW
May 2005

1 page




PS22053 pdf
MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS22053
TRANSFER-MOLD TYPE
INSULATED TYPE
MECHANICAL CHARACTERISTICS AND RATINGS
Parameter
Mounting torque
Weight
Heat-sink flatness
Condition
Mounting screw : M4
Recommended 1.18 N·m
(Note 6)
Min.
0.98
50
Limits
Typ.
77
Max.
1.47
100
Unit
N·m
g
µm
www.DataSheet4UN.ocotem6: Measurement point of heat-sink flatness
+
Heat-sink side
Measurement location
3.25mm
+
Heat-sink side
RECOMMENDED OPERATION CONDITIONS
Symbol
Parameter
Condition
Limits
Min. Typ.
VCC Supply voltage
VD Control supply voltage
VDB Control supply voltage
VD, VDB Control supply variation
tdead
Arm shoot-through blocking time
fPWM
PWM input frequency
IO Output r.m.s. current
PWIN(on)
Applied between P-NU, NV, NW
Applied between VP1-VPC, VN1-VNC
Applied between VUFB-VUFS, VVFB-VVFS, VWFB-VWFS
For each input signal, TC 100°C
TC 100°C, Tj 125°C
VCC = 600V, VD = 15V, fC = 15kHz
P.F = 0.8, sinusoidal PWM
Tj 125°C, TC 100°C
(Note 7)
(Note 8)
350
13.5
13.5
1
3.3
1.5
600
15.0
15.0
350 VCC 800V,
13.5 VD 16.5V,
Ic 10A
2.5
Minimum input pulse width
PWIN(off)
13.5 VDB 16.5V,
20°C TC 100°C,
N line wiring inductance less than
10 < Ic 17A
2.7
10nH
(Note 9)
VNC VNC variation
Between VNC-NU, NV, NW (including surge)
5.0
Note 7 : The output r.m.s. current value depends on the actual application conditions.
8 : DIP-IPM might not make response to the input on signal with pulse width less than PWIN (on).
9 : DIP-IPM might not make response or work properly if the input off signal pulse width is less than PWIN (off).
Max.
800
16.5
16.5
1
15
3.4
5.0
Unit
V
V
V
V/µs
µs
kHz
Arms
µs
V
May 2005

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