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PDF STM32F103xC Data sheet ( Hoja de datos )
| Número de pieza | STM32F103xC | |
| Descripción | ARM-based 32-bit MCU | |
| Fabricantes | STMicroelectronics | |
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STM32F103xC STM32F103xD
STM32F103xE
Performance line, ARM-based 32-bit MCU with up to 512 KB Flash,
USB, CAN, 11 timers, 3 ADCs and 13 communication interfaces
Preliminary Data
Features
■ Core: ARM 32-bit Cortex™-M3 CPU
www.DataSheet4U.com–
72 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance at 0 wait state memory
access
– Single-cycle multiplication and hardware
division
■ Memories
– 256-to-512 Kbytes of Flash memory
– up to 64 Kbytes of SRAM
– Flexible static memory controller with 4
Chip Select. Supports Compact Flash,
SRAM, PSRAM, NOR and NAND memories
– LCD parallel interface, 8080/6800 modes
■ Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR, and programmable voltage
detector (PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC with calibration
– 32 kHz oscillator for RTC with calibration
■ Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers
■ 3 × 12-bit, 1 µs A/D converters (up to 21
channels)
– Conversion range: 0 to 3.6 V
– Triple-sample and hold capability
– Temperature sensor
■ 2-channel 12-bit D/A converter
■ DMA: 12-channel DMA controller
– Supported peripherals: timers, ADCs, DAC,
SDIO, I2Ss, SPIs, I2Cs and USARTs
■ Debug mode
– Serial wire debug (SWD) & JTAG interfaces
– Cortex-M3 Embedded Trace Macrocell™
FBGA
LQFP64 10 × 10 mm,
LQFP100 14 × 14 mm,
LQFP144 20 × 20 mm
LFBGA100 10 × 10 mm
LFBGA144 10 × 10 mm
■ Up to 112 fast I/O ports
– 51/80/112 I/Os, all mappable on 16
external interrupt vectors, all 5 V-tolerant
except for analog inputs
■ Up to 11 timers
– Up to four 16-bit timers, each with up to 4
IC/OC/PWM or pulse counter
– 2 × 16-bit, 6-channel timers with PWM
output and dead-time generation
– 2 × watchdog timers (Independent and
Window)
– SysTick timer: a 24-bit downcounter
– 2 × 16-bit basic timers to drive the DAC
■ Up to 13 communication interfaces
– Up to 2 × I2C interfaces (SMBus/PMBus)
– Up to 5 USARTs (ISO 7816 interface, LIN,
IrDA capability, modem control)
– Up to 3 SPIs (18 Mbit/s), 2 with I2S
interface multiplexed
– CAN interface (2.0B Active)
– USB 2.0 full speed interface
– SDIO interface
■ CRC calculation unit, 96-bit unique ID
■ ECOPACK® packages
Table 1. Device summary
Reference
Part number
STM32F103xC
STM32F103RC STM32F103VC
STM32F103ZC
STM32F103xD
STM32F103RD STM32F103VD
STM32F103ZD
STM32F103xE
STM32F103RE STM32F103ZE
STM32F103VE
May 2008
Rev 2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
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1 page  
STM32F103xC, STM32F103xD, STM32F103xE
List of tables
Table 45.
Table 46.
Table 47.
Table 48.
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
www.DataSheet4UT.caobmle 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
SCL frequency (fPCLK1= 36 MHz.,VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
SD / MMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
USB startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
USB: full-speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
RAIN max for fADC = 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data . . . . . . . 107
LFBGA100 - low profile fine pitch ball grid array package mechanical data. . . . . . . . . . . 108
LQPF100 – 100-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . 110
LQFP64 – 64 pin low-profile quad flat package mechanical data. . . . . . . . . . . . . . . . . . . 111
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
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5 Page 
STM32F103xC, STM32F103xD, STM32F103xE
Description
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Embedded Flash memory
Up to 512 Kbytes of embedded Flash is available for storing programs and data.
CRC (cyclic redundancy check) calculation unit
The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit
data word and a fixed generator polynomial.
Among other applications, CRC-based techniques are used to verify data transmission or
storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of
verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of
the software during runtime, to be compared with a reference signature generated at link-
time and stored at a given memory location.
Embedded SRAM
Up to 64 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait
states.
FSMC (flexible static memory controller)
The FSMC is embedded in the STM32F103xC, STM32F103xD and STM32F103xE
performance line family. It has four Chip Select outputs supporting the following modes:
RAM, PSRAM, NOR and NAND.
Functionality overview:
● The three FSMC interrupt lines are ORed in order to be connected to the NVIC
● Write FIFO
● Code execution from external memory except for
● The targeted frequency is SYSCLK/2, so external access is at 36 MHz when the
system is at 72 MHz and external access is at 24 MHz when the system is at 48 MHz
LCD parallel interface
The FSMC can be configured to interface seamlessly with most graphic LCD controllers. It
supports the Intel 8080 and Motorola 6800 modes, and is flexible enough to adapt to
specific LCD interfaces. This LCD parallel interface capability makes it easy to build cost-
effective graphic applications using LCD modules with embedded controllers or high-
performance solutions using external controllers with dedicated acceleration.
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| Páginas | Total 70 Páginas | |
| PDF Descargar | [ Datasheet STM32F103xC.PDF ] | |
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