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PDF LTC4301L Data sheet ( Hoja de datos )
| Número de pieza | LTC4301L | |
| Descripción | Hot Swappable 2-Wire Bus Buffer | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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FEATURES
s Level Translates 1V Signals to Standard 3.3V and
5V Logic Rails
s Allows Bus Pull-Up Voltages as Low as 1V on
SDAIN and SCLIN
s Bidirectional Buffer* for SDA and SCL Lines
www.DataSheetI4nUc.croemases Fanout
s Prevents SDA and SCL Corruption During Live Board
Insertion and Removal from Backplane
s Isolates Input SDA and SCL Line from Output
s 10kV Human Body Model ESD Protection
s Supports Clock Stretching, Arbitration and
Synchronization
s High Impedance SDA, SCL Pins for VCC = 0V
s CS Gates Connection from Input to Output
s Compatible with I2CTM, I2C Fast Mode and SMBus
Standards (Up to 400kHz Operation)
s Small 8-Pin MSOUP and DFN (3mm × 3mm) Packages
APPLICATIO S
s Hot Board Insertion
s Servers
s Capacitance Buffer/Bus Extender
s Desktop Computers
LTC4301L
Hot Swappable 2-Wire
Bus Buffer with Low Voltage
Level Translation
DESCRIPTIO
The LTC®4301L hot swappable, 2-wire bus buffer allows
I/O card insertion into a live backplane without corruption
of the data and clock busses. In addition, the LTC4301L
SDAIN and SCLIN pins are compatible with systems with
pull-up voltages as low as 1V. Control circuitry prevents
the backplane from being connected to the card until a
stop bit or a bus idle is present. When the connection is
made, the LTC4301L provides bidirectional buffering,
keeping the backplane and card capacitances isolated.
When driven low, the CS input pin allows the part to
connect after a stop bit or bus idle occurs. Driving CS high
breaks the connection between SCLIN and SCLOUT and
between SDAIN and SDAOUT. A logic high on READY
indicates that the backplane and card sides are connected
together.
The LTC4301L is offered in 8-pin DFN (3mm × 3mm) and
MSOP packages.
, LTC and LT are registered trademarks of Linear Technology Corporation.
I2C is a trademark of Philips Electronics N.V.
*Patent Pending
TYPICAL APPLICATIO
1.2V
VCC
SDA
µP
SCL
GND
3.3V
0.01µF
2k 2k
VCC
SDAIN SDAOUT
LTC4301L
SCLIN SCLOUT
CS READY
GND
10k 10k
SDA
SCL
4301l TA01a
Input-Output Connection
OUTPUT
SIDE
20pF
0.5V/DIV
INPUT
SIDE
55pF
1µs/DIV
4301 TA01b
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1 page  
BLOCK DIAGRA
SDAIN
6
www.DataSheet4U.com
SCLIN
3
LTC4301L
LTC4301L Supply Independent 2-Wire Bus Buffer
PRECHARGE
CONNECT PRECHARGE
CONNECT
R1 R2
200k 200k
VCC 8
SDAOUT
7
CONNECT
SCLOUT
2
0.6V
CS
1
1.4V
LOGIC
PRECHARGE
CONNECT
UVLO
95µs
DELAY
CONNECT
CONNECT
1.8V
READY
5
GND
4
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5 Page 
PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
LTC4301L
www.DataSheet4U.com
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
1 234
1.10
(.043)
MAX
SEATING
PLANE 0.22 – 0.38
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.009 – .015)
TYP 0.65
(.0256)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.86
(.034)
REF
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8) 0204
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LTC4301L.PDF ] | |
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