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PDF KAG00J007M-FGG2 Data sheet ( Hoja de datos )

Número de pieza KAG00J007M-FGG2
Descripción MCP Memory
Fabricantes Samsung Electronics 
Logotipo Samsung Electronics Logotipo



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KAG00J007M-FGG2
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MCP MEMORY
MCP Specification of
256Mb NAND*2 and 256Mb Mobile SDRAM
- 1 - Revision 0.6
October 2003

1 page




KAG00J007M-FGG2 pdf
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KAG00J007M-FGG2
PIN DESCRIPTION
Pin Name
CLK
CKE
/CS
/RAS
/CAS
/WEd
A0 ~ A12
BA0 ~ BA1
LDQM
UDQM
DQ0d ~ DQ15d
Vdd
Vddq
Vss
Vssq
Pin Function(Mobile SDRAM)
System Clock
Clock Enable
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Address Input
Bank Address Input
Lower Input/Output Data Mask
Upper Input/Output Data Mask
Data Input/Output
Power Supply
Data Out Power
Ground
DQ Ground
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MCP MEMORY
Pin Name
/CE
/RE
/WP
/WE
ALE
CLE
R/B
IO0 ~ IO7
Vcc
Vccq
Vss
Pin Function(NAND Flash)
Chip Enable
Read Enable
Write Protection
Write Enable
Address Latch Enable
Command Latch Enable
Ready/Busy Output
Data Input/Output
Power Supply
Data Out Power
Ground
Pin Name
NC
DNU
Pin Function
No Connection
Do Not Use
ORDERING INFORMATION
KA G 00 J 0 0 7 M - F G G 2
Samsung
MCP Memory(3chips)
Device Type
NAND + NAND + SDRAM
NOR Flash Density, Voltage,
Organization, Bank Size, Boot Block
00 = None
NAND Flash Density, Voltage, Organization
J = 256M+256M, 2.6V/2.6V, x8
UtRAM Density, Voltage, Organization
0 = None
SRAM Density, Voltage, Organization
0 = None
SDRAM Speed
2 = 9.5ns(CL = 3)
NAND Flash Speed
G = 50ns
NAND Flash Speed
G = 50ns
Package
F = FBGA
Version
M = 1st Generation
DRAM Interface, Density,
Voltage, Organization, Option
7 = SDR, 256M, 1.8V/1.8V, X16
NOTE :
1. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific purpose,
such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.
- 5 - Revision 0.6
October 2003

5 Page





KAG00J007M-FGG2 arduino
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KAG00J007M-FGG2
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MCP MEMORY
VALID BLOCK
Parameter
Valid Block Number
Symbol
NVB
Min
4026
Typ.
-
Max
4096
Unit
Blocks
NOTE :
1. The NAND Flash may include invalid blocks when first shipped. Additional invalid blocks may develop while being used. The number of valid blocks is
presented with both cases of invalid blocks considered. Invalid blocks are defined as blocks that contain one or more bad bits. Do not erase or
program factory-marked bad blocks. Refer to the attached technical notes for a appropriate management of invalid blocks.
2. The 1st block, which is placed on 00h block address, is fully guaranteed to be a valid block, does not require Error Correction.
3. The 2nd and 3rd blocks are good upon shipping.
4. Minimum 1004 valid blocks are guaranteed for each contiguous 128Mb memory space.
AC TEST CONDITION
( Vcc=2.4V~2.9V unless otherwise noted)
Parameter
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Levels
Output Load (VccQ:2.65V +/-10%)
Value
0V to VccQ
5ns
VccQ/2
1 TTL GATE and CL=30pF
CAPACITANCE(TA=25°C, VCC=2.65V, f=1.0MHz)
Item
Symbol
Test Condition
Input/Output Capacitance
Input Capacitance
CI/O
CIN
VIL=0V
VIN=0V
NOTE : Capacitance is periodically sampled and not 100% tested.
Min
-
-
Max
20
20
Unit
pF
pF
MODE SELECTION
CLE
ALE
CE
WE
RE
WP
Mode
HL L
LHL
HX
Command Input
Read Mode
HX
Address Input(4clock)
HL L
LHL
HH
Command Input
Write Mode
HH
Address Input(4clock)
LLL
H H Data Input
L L LH
X Data Output
L L X H H X During Read(Busy)
X X X X X H During Program(Busy)
X X X X X H During Erase(Busy)
X X(1) X X X L Write Protect
X X H X X 0V/VCC(2) Stand-by
NOTE :
1. X can be VIL or VIH.
2. WP should be biased to CMOS high or CMOS low for standby.
Program/Erase Characteristics
Parameter
Symbol
Min
Typ
Max Unit
Program Time
tPROG
-
200 500
µs
Number of Partial Program Cycles
in the Same Page
Main Array
Spare Array
Nop
-
-
-
-
2 cycles
3 cycles
Block Erase Time
tBERS
-
2
3 ms
- 11 -
Revision 0.6
October 2003

11 Page







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